| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/14/2004 | EP1381259A1 Structure of printed circuit board (PCB) |
| 01/14/2004 | EP1381258A1 High-frequency module |
| 01/14/2004 | EP1381151A1 Piezoelectric oscillator and its manufacturing method |
| 01/14/2004 | EP1381080A2 Component-embedded board fabrication method and apparatus |
| 01/14/2004 | EP1380195A1 Printed circuit board comprising a component |
| 01/14/2004 | EP1380193A1 A method for forming a printed circuit board and a printed circuit board formed thereby |
| 01/14/2004 | EP1380066A1 Microwave circuit |
| 01/14/2004 | EP1060494B1 Electroluminescent lamp devices and their manufacture |
| 01/14/2004 | EP1034091B1 Interior trim panel and electrical harness apparatus for an automotive vehicle |
| 01/14/2004 | CN2599902Y 防护型陶瓷基板 Protective ceramic substrate |
| 01/14/2004 | CN2599735Y Current-limiting device |
| 01/14/2004 | CN1468503A Methods of manufacturing a printed circuit board shielded against interfering radiation |
| 01/14/2004 | CN1468467A Thick film millimeter wave transceiver module |
| 01/14/2004 | CN1468326A Method for enhancing the solderability of a surface |
| 01/14/2004 | CN1468324A Bath and method of electroless plating of silver on metal surfaces |
| 01/14/2004 | CN1468177A Card type recording medium and production method therefor |
| 01/14/2004 | CN1468172A Circuit protective composites |
| 01/14/2004 | CN1468153A Platable dielectric materials for microvia technology |
| 01/14/2004 | CN1468050A Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method |
| 01/14/2004 | CN1468049A Method for plating conductive layer on circuit layout of printed circuit board |
| 01/14/2004 | CN1468048A Enhancement of current-carrying capacity of a multilayer circuit board |
| 01/14/2004 | CN1468047A Slice-shape back glue carrier for printed circuit board |
| 01/14/2004 | CN1468046A Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment |
| 01/14/2004 | CN1468045A Structure of printed circuit board |
| 01/14/2004 | CN1467832A Recovery processing method of an electrode |
| 01/14/2004 | CN1467831A Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 01/14/2004 | CN1467803A Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another |
| 01/14/2004 | CN1467685A Ic card and manufacturing method thereof |
| 01/14/2004 | CN1467541A Liquid crystal display device and method for manufacturing liquid crystal display device |
| 01/14/2004 | CN1467304A Non-conductor metallization manufacturing process applying ultrasonic equipment to activator containing colloid |
| 01/14/2004 | CN1134888C Method of forming groove in surface of mother substrate |
| 01/14/2004 | CN1134869C Socket connector and manufacturing method thereof |
| 01/14/2004 | CN1134798C Method for producing rotary print conductor and method for producing raw sheet in laminate |
| 01/14/2004 | CN1134797C 叠层电子元件 Laminated electronic components |
| 01/14/2004 | CN1134667C Microelectronic spring contact element |
| 01/13/2004 | US6678878 Intelligent milling path creation for panelization abstract |
| 01/13/2004 | US6678877 Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas |
| 01/13/2004 | US6678171 Fastening arrangement for light emitting diode metal array |
| 01/13/2004 | US6678169 Printed circuit board and electronic equipment using the board |
| 01/13/2004 | US6678167 High performance multi-chip IC package |
| 01/13/2004 | US6678144 Capacitor, circuit board with built-in capacitor and method for producing the same |
| 01/13/2004 | US6678121 Fiber reinforced laminate actuator arm for disc drives |
| 01/13/2004 | US6678061 Method of calibrating the optical system of a laser machine for processing electrical circuit substrates |
| 01/13/2004 | US6677773 Testing device for printed circuit boards |
| 01/13/2004 | US6677707 Side-emitting surface mounted light emitting diode |
| 01/13/2004 | US6677668 Configuration for testing a substrate mounted with a most performance-demanding integrated circuit |
| 01/13/2004 | US6677580 Photo-interrupter and semiconductor device using it |
| 01/13/2004 | US6677553 Laser processing apparatus |
| 01/13/2004 | US6677292 Terpene, tetrahydrofuran, and butylated hydroxytoluene; pens |
| 01/13/2004 | US6677291 Cleaning solvent and dispenser |
| 01/13/2004 | US6677245 Contact structure production method |
| 01/13/2004 | US6677238 System and methods for fabrication of a thin film pattern |
| 01/13/2004 | US6677229 Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board |
| 01/13/2004 | US6677055 Preventing the formation of whiskers and recess cavities on lead surfaces |
| 01/13/2004 | US6676991 Etch resist using printer technology |
| 01/13/2004 | US6676843 Magnetically patterning conductors |
| 01/13/2004 | US6676726 Method and apparatus for manufacturing minute metallic sphere |
| 01/13/2004 | US6676457 Connector and method for connecting a connector to a printed-circuited board |
| 01/13/2004 | US6676440 Coin type battery and a coin type capacitor; soldering |
| 01/13/2004 | US6675930 Speaker holder |
| 01/13/2004 | US6675852 Platen for use in laminating press |
| 01/13/2004 | US6675704 Solder paste stenciling apparatus for minimizing residue of solder paste |
| 01/13/2004 | US6675474 Electronic component mounted member and repair method thereof |
| 01/13/2004 | US6675473 Method of positioning a conductive element in a laminated electrical device |
| 01/13/2004 | US6675472 Preventing burrs wherein the copper plating is performed prior to making the routing of one or more slots by a thin plating; improved castellation via process |
| 01/13/2004 | US6675471 Method of producing high-frequency modules |
| 01/13/2004 | US6675470 Method for manufacturing an electro-optical device |
| 01/13/2004 | US6675469 Vapor phase connection techniques |
| 01/13/2004 | US6675456 Alignment plate with matched thermal coefficient of expansion method |
| 01/13/2004 | US6675450 Method of manufacturing and mounting electronic devices to limit the effects of parasitics |
| 01/13/2004 | CA2322468C Integrated circuit connection using an electrically conductive adhesive |
| 01/08/2004 | WO2004004434A1 Multilayer stripline radio frequency circuits and interconnection methods |
| 01/08/2004 | WO2004004433A1 Process for creating vias for circuit assemblies |
| 01/08/2004 | WO2004004432A1 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/08/2004 | WO2004004431A1 Socketless package to circuit board assemblies and methods of using same |
| 01/08/2004 | WO2004004430A1 Process for creating holes in polymeric substrates |
| 01/08/2004 | WO2004004429A1 Releasable protective insulating layers for substrates |
| 01/08/2004 | WO2004004428A1 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 01/08/2004 | WO2004004427A1 Carriers for printed circuit board marking |
| 01/08/2004 | WO2004004025A2 Method for the economical structuring of conducting polymers by means of defining hydrophilic and hydrophobic regions |
| 01/08/2004 | WO2004004017A2 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof |
| 01/08/2004 | WO2004004004A2 Forming contact arrays on substrates |
| 01/08/2004 | WO2004003993A1 Packaging method and packaging system |
| 01/08/2004 | WO2004003992A1 Cof film carrier tape and its manufacturing method |
| 01/08/2004 | WO2004003273A2 Fabric and yarn structures for improving signal integrity in fabric based electrical circuits |
| 01/08/2004 | WO2004003259A1 Method of forming polyimide coating containing dielectric filler on surface of metallic material, process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 01/08/2004 | WO2004003097A1 Anisotropic conductive film |
| 01/08/2004 | WO2004003086A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 01/08/2004 | WO2004003055A1 Biaxially oriented polyester film and laminates thereof with copper |
| 01/08/2004 | WO2003094203A3 Direct-connect signaling system |
| 01/08/2004 | WO2003081966A3 Process and apparatus for manufacturing printed circuit boards |
| 01/08/2004 | WO2002100952A3 Tab circuit for ink jet printer cartridges |
| 01/08/2004 | WO2002097534A3 Apparatus and method for aligning an article with a reference object |
| 01/08/2004 | WO2002041397A3 Low profile integrated module interconnects |
| 01/08/2004 | US20040006161 Ultraviolet curable resin composition and photo solder resist ink including the same |
| 01/08/2004 | US20040005813 Apparatus and method for effecting an improved electrical connection structure |
| 01/08/2004 | US20040005794 Construction for mounting a terminal, a circuit board connector and method of mounting it |
| 01/08/2004 | US20040005790 Ball grid array jumper |
| 01/08/2004 | US20040005772 Method of producing copper foil solder bump |
| 01/08/2004 | US20040005459 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure |