Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2003
11/25/2003US6653736 Multilayer flexible wiring boards
11/25/2003US6653593 Control system for ablating high-density array of vias or indentation in surface of object
11/25/2003US6653575 Electronic package with stacked connections and method for making same
11/25/2003US6653574 Multi-layered substrate with a built-in capacitor design and a method of making the same
11/25/2003US6653573 Wiring board comprising granular magnetic film
11/25/2003US6653572 Multilayer circuit board
11/25/2003US6653371 Shelf life stability
11/25/2003US6653232 Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus
11/25/2003US6653217 Method of connecting a conductive trace to a semiconductor chip
11/25/2003US6653168 LSI package and internal connecting method used therefor
11/25/2003US6653056 Process for patterning non-photoimagable ceramic tape
11/25/2003US6653055 Forming printed circuits by selectively etching copper lamination by exposing photoresists and electrodeposited coatings to light
11/25/2003US6652993 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
11/25/2003US6652962 Resin-coated composite foil, production and use thereof
11/25/2003US6652958 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources
11/25/2003US6652956 X-ray printing personalization technique
11/25/2003US6652805 Highly filled composites of powdered fillers and polymer matrix
11/25/2003US6652731 Comprises 2,3,4-trihydroxybenzaldehyde for inhibiting consumption of plating additives; integrated circuits
11/25/2003US6652727 Hydrodynamically inaccessible recesses of printed circuits are plated using a pulsed reversing current with cathodic pulses having a duty cycle <50%; plating hydrodynamically accessible recesses using a pulsed reversing current of <50%
11/25/2003US6652697 Method for manufacturing a copper-clad laminate
11/25/2003US6652665 Immersing and aggitating in preheated solution containing quaternary ammonium fluoride and hydrophobic nonhydroxylic aprotic solvent
11/25/2003US6652659 Eliminating flutuations in amount of residue on electronic substrate using deionized water containing alkali metal bicarbonate
11/25/2003US6652342 Wiring board and gas discharge type display apparatus using the same
11/25/2003US6652310 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member
11/25/2003US6652290 Connecting devices and method for interconnecting circuit components
11/25/2003US6652161 Optical wavelength division multiplexer and/or demultiplexer mounted in a pluggable module
11/25/2003US6652075 Electronically addressable microencapsulated ink and display thereof
11/25/2003US6652073 Structure of a flexible printed circuit for inkjet printheads and the manufacturing process therefor
11/25/2003US6651871 Substrate coated with a conductive layer and manufacturing method thereof
11/25/2003US6651870 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
11/25/2003US6651869 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
11/25/2003US6651680 Washing apparatus with UV exposure and first and second ultrasonic cleaning vessels
11/25/2003US6651335 Catalyst layer is absorbed on a surface of a substrate, a laser beam is selectively applied to the catalyst layer, processing of electroless plating is applied to the substrate,
11/25/2003US6651324 Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
11/25/2003US6651322 Method of reworking a multilayer printed circuit board assembly
11/25/2003US6651320 Connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhance and connection resistance value is stabilized low
11/25/2003US6651315 Electrical devices
11/20/2003WO2003096777A2 Adapter for surface mount devices to through hole applications
11/20/2003WO2003096776A1 Flexible printed wiring board for chip-on-film
11/20/2003WO2003096775A2 Thermal dissipating printed circuit board and methods
11/20/2003WO2003096389A2 Metal object to be at least partially coated with a substance
11/20/2003WO2003096265A1 Method of producing a digital fingerprint sensor and the corresponding sensor
11/20/2003WO2003096123A1 Reversal imprint technique
11/20/2003WO2003095729A1 Plural layer woven electronic textile, article and method
11/20/2003WO2003095715A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plasting operations
11/20/2003WO2003095714A1 Process for producing high temperature heat resisting carrier foil clad electrolytic copper foil and high temperature heat resisting carrier foil clad electrolytic copper foil obtained by the process
11/20/2003WO2003095713A1 Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate
11/20/2003WO2003095710A2 Methods of and apparatus for electrochemically fabricating structures
11/20/2003WO2003095709A2 Multistep release method for electrochemically fabricated structures
11/20/2003WO2003095707A2 Method of and apparatus for forming three-dimensional structures
11/20/2003WO2003095706A2 Electrochemically fabricated hermetically sealed microstructures
11/20/2003WO2003095204A1 An improved thermal conducting system and laminates produced thereform
11/20/2003WO2003094719A1 Woven electronic textile, yarn and article
11/20/2003WO2003069695A3 Multilayer package for a semiconductor device
11/20/2003WO2003067940A3 Circuit carrier and production thereof
11/20/2003WO2003028100A3 Encapsulation of pin solder for maintaining accuracy in pin position
11/20/2003WO2003028088A3 Methods of forming metallurgy structures for wire and solder bonding and related structures
11/20/2003WO2003028044A3 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
11/20/2003WO2003023820A3 Boat for ball attach manufacturing process and method of fabricating reliable flip-chip assembly
11/20/2003WO2003023082A3 System and process for automated microcontact printing
11/20/2003WO2003019656A3 Interconnect module with reduced power distribution impedance
11/20/2003WO2002103455A3 Method and apparatus for imaging with fiber optic arrays on non-flat surfaces
11/20/2003WO2002093647A3 Electronic package with high density interconnect and associated methods
11/20/2003WO2002065589A8 Connector and contact wafer
11/20/2003US20030217349 BWB transmission wiring design system
11/20/2003US20030216505 Conductive resin composition
11/20/2003US20030216490 Multilayer printed circuits; fluoropolymer dielectric, coupler and filler mixture
11/20/2003US20030216076 Electrical connector with improved terminals
11/20/2003US20030216068 Optically transparent elastomeric interconnects and method of using same
11/20/2003US20030216066 Zero insertion force heat-activated retention pin
11/20/2003US20030216065 Component retention socket
11/20/2003US20030216061 Method of attaching circuitry to a modular jack connector using electrically conductive paste
11/20/2003US20030216023 Projected contact structures for engaging bumped semiconductor devices and methods of making the same
11/20/2003US20030215754 Residue reducing stable concentrate
11/20/2003US20030215620 Member having metallic layer, its manufacturing method and its application
11/20/2003US20030215619 Metal core substrate and process for manufacturing same
11/20/2003US20030215568 Positioning an extruder in line with the hole, extruding and depositing balls of molten electroconductive material into the apertures; materials handling
11/20/2003US20030215567 A blends comprising an adduct of epoxidized phenolic resins with (meth)acrylic acid, a (meth)acrylates, a liquid epoxy resins and curing agents; noncracking, solder-resistance, corrosion resistance, durability
11/20/2003US20030215566 Stuffing through holes on the dielectric layer with microstructure or nanostructure electroconductive paste, to connect and conduct each other, forming accurate integrated circuits
11/20/2003US20030215565 Method and apparatus for the formation of laminated circuit having passive components therein
11/20/2003US20030214860 Circuit board having traces with distinct transmission impedances
11/20/2003US20030214800 System and method for processor power delivery and thermal management
11/20/2003US20030214797 Multilayer printed circuit board
11/20/2003US20030214796 High frequency module mounting structure in which solder is prevented from peeling
11/20/2003US20030214795 Electronic component with bump electrodes, and manufacturing method thereof
11/20/2003US20030214792 Multi-feature-size electronic structures
11/20/2003US20030214771 Printed circuit board scrap edge removal tool
11/20/2003US20030214558 Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly
11/20/2003US20030214370 RF filtered DC interconnect
11/20/2003US20030214053 Tape carrier package and method of fabricating the same
11/20/2003US20030214047 Semiconductor device, method for mounting the same, and method for repairing the same
11/20/2003US20030214045 Miniaturized contact spring
11/20/2003US20030214028 Device for mounting a semiconductor package on a support plate via a base
11/20/2003US20030214027 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
11/20/2003US20030213988 Semiconductor memory module
11/20/2003US20030213963 High speed electronic interconnection using a detachable substrate
11/20/2003US20030213833 Reflow soldering apparatus and reflow soldering method
11/20/2003US20030213832 Solder ball attaching system and method
11/20/2003US20030213831 Method of connecting circuit boards
11/20/2003US20030213787 Beam shaping and projection imaging with solid state UV gaussian beam to form vias
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