Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2003
11/04/2003US6641898 Printed wiring board and method of manufacturing a printed wiring board
11/04/2003US6641868 Screen printing apparatus and method of screen printing
11/04/2003US6641865 Method for selectively applying solder mask
11/04/2003US6641860 Method of manufacturing printed circuit boards
11/04/2003US6641712 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
11/04/2003US6641669 Method and apparatus for improving stencil/screen print quality
11/04/2003US6641411 Low cost high speed connector
11/04/2003US6641410 Electrical solder ball contact
11/04/2003US6641409 Grounding structure for network card
11/04/2003US6641407 Conductor interconnect structure connecting circuit boards
11/04/2003US6641406 Flexible connector for high density circuit applications
11/04/2003US6641030 Method and apparatus for placing solder balls on a substrate
11/04/2003US6640435 Methods for trimming electrical parameters in an electrical circuit
11/04/2003US6640434 Method of forming an electrical circuit on a substrate
11/04/2003US6640433 Forming organic thin film by building up of monomolecular film, baking to produce amorphous carbon or graphite, microcutting, applying electroconductive film
11/04/2003US6640430 Method of manufacturing a printed circuit board
11/04/2003US6640429 Method of making multilayer circuit board
11/04/2003US6640420 Process for manufacturing a composite polymeric circuit protection device
10/2003
10/30/2003WO2003090507A1 Filtration of flux contaminants
10/30/2003WO2003090321A1 Electrical connectors
10/30/2003WO2003090277A1 Circuit board, process for producing the same and power module
10/30/2003WO2003090276A2 Method for the production of contact pads on a substrate and device for carrying out said method
10/30/2003WO2003090258A2 Laser machining
10/30/2003WO2003090183A1 Electrotechnical kit
10/30/2003WO2003090129A1 Global equivalent circuit modeling system for substrate mounted circuit components incoporating substrate dependent characteristics
10/30/2003WO2003089991A2 Photocurable compositions containing reactive particles
10/30/2003WO2003067906A3 High-speed router with single backplane distributing both power and signaling
10/30/2003WO2003062866A3 Flex board interface to an optical module
10/30/2003WO2003022581A3 Inkjet deposition apparatus and method
10/30/2003WO2003004210B1 Method of ablating an opening in a hard, non-metallic substrate
10/30/2003WO2002068321A3 Forming tool for forming a contoured microelectronic spring mold
10/30/2003WO2002017387A9 Conductive material patterning methods
10/30/2003US20030204218 Protection apparatus for implantable medical device
10/30/2003US20030203994 Solventless photo-sensitive thermosetting-type ink
10/30/2003US20030203668 Electrical interconnect using locally conductive adhesive
10/30/2003US20030203660 Surface mount socket contact providing uniform solder ball loading and method
10/30/2003US20030203643 Method and apparatus for fabricating a device, and the device and an electronic equipment
10/30/2003US20030203630 Removal of copper oxides from integrated interconnects
10/30/2003US20030203623 Substrate conductive post formation
10/30/2003US20030203612 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
10/30/2003US20030203317 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same
10/30/2003US20030203210 Resistance to gas and liquid permeation; lightweight, preferably transparent, flexibility and resiliency, as well as resistance to cracking and delaminating
10/30/2003US20030203187 Manufacture of masks and electronic parts
10/30/2003US20030203175 Greensheet carriers and processing thereof
10/30/2003US20030203174 Low signal loss bonding ply for multilayer circuit boards
10/30/2003US20030203171 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
10/30/2003US20030203170 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead
10/30/2003US20030203169 Ceramic structure using a support sheet
10/30/2003US20030203101 Process for forming a patterned thin film conductive structure on a substrate
10/30/2003US20030202373 Semiconductor package with a controlled impedance bus and method of forming same
10/30/2003US20030202372 Semiconductor memory module
10/30/2003US20030202333 Arrangement consisting of a circuit carrier and a printed circuit board or a printed circuit board assembly
10/30/2003US20030202332 Second level packaging interconnection method with improved thermal and reliability performance
10/30/2003US20030202329 Expansion board apparatus and removing method
10/30/2003US20030202314 Printed circuit board capacitor structure and method
10/30/2003US20030202312 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
10/30/2003US20030202281 Electromagnetic wave shielded write and read wires on a support for a magnetic media drive
10/30/2003US20030202151 Display device substrate, method for man ufacturing the display device substrate, liquid-crystal device, and electronic equipment
10/30/2003US20030202048 Ink jet printing mechanism that incorporates a shape memory alloy
10/30/2003US20030201989 Signal transmission system
10/30/2003US20030201709 Display panel module with improved bonding structure and method of forming the same
10/30/2003US20030201542 Flexible lead surface-mount semiconductor package
10/30/2003US20030201534 Dielectric supports surfaces; electrically connecting structures; overcoating projections with metal
10/30/2003US20030201526 Packages for semiconductor die
10/30/2003US20030201427 Press fitting concave and convex shapes
10/30/2003US20030201310 Packaging method using lead-free solder
10/30/2003US20030201309 Polymer for exterior contactors; bonding semiconductor contact pads
10/30/2003US20030201303 Modified aperture for surface mount technology (SMT) screen printing
10/30/2003US20030201260 Method for drilling holes in a substrate
10/30/2003US20030201258 Method for producing a trench structure in a polymer substrate
10/30/2003US20030201247 Etchant, method for roughening copper surface and method for producing printed wiring board
10/30/2003US20030201244 Method of generating ejection pattern data, and head motion pattern data; apparatus for generating ejection pattern data; apparatus for ejecting functional liquid droplet; drawing system; method of manufacturing organic EL device, electron emitting device, PDP device, electrophoresis display device, color filter, and organic EL; and method of forming spacer, metal wiring, lens, resist, and light diffuser
10/30/2003US20030201242 Method for manufacturing wiring circuit boards with bumps and method for forming bumps
10/30/2003US20030201184 Electroplating of a metal; seed layer immersion in an electrolyte; controlled trapping of air bubbles by positioning substrate
10/30/2003US20030201123 Electrical connector pad assembly for printed circuit board
10/30/2003US20030201122 Flip-chip package substrate
10/30/2003US20030200855 System for singulating semiconductor components utilizing alignment pins
10/30/2003US20030200836 Flux for solder paste
10/30/2003US20030200647 Pattern forming method, method of making microdevice, method of making thin-film magnetic head, method of making magnetic head slider, method of making magnetic head apparatus, and method of making magnetic recording and reproducing apparatus
10/30/2003DE10210040C1 Betriebsverfahren und Transportwagen für eine Laserbearbeitungsanlage Operating procedures and transport cart for laser processing system
10/30/2003CA2482629A1 Global equivalent circuit modeling system for substrate mounted circuit components incorporating substrate dependent characteristics
10/29/2003EP1357775A1 Circuit board and its manufacturing method
10/29/2003EP1357774A1 Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure
10/29/2003EP1357773A2 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
10/29/2003EP1357772A2 Manufacturing method for conductive layer wiring, layered structure member, electro-optic device, and electronic apparatus
10/29/2003EP1357771A1 Electronic parts
10/29/2003EP1357597A1 Voltage conversion module
10/29/2003EP1357591A2 Method of mounting electrical components on a base plate in a radio frequency terminal unit
10/29/2003EP1357588A1 A substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
10/29/2003EP1357197A1 Minute copper balls and a method for their manufacture
10/29/2003EP1356498A1 Chromium adhesion layer for copper vias in low-k technology
10/29/2003EP1252026B1 Thermal mass transfer donor element with light-to-heat conversion layer
10/29/2003EP1196288B1 Method and apparatus for dispensing viscous material
10/29/2003CN2583391Y Improved liquid metal electromagnetic pump for pumping leadless brazing filler metal
10/29/2003CN2582807Y Molten tin bath structure with rotational spray nozzle
10/29/2003CN2582806Y Adjustable tin furnace spout
10/29/2003CN1452853A Adhesive bonding of printed circuit boards to heat sinks
10/29/2003CN1452787A Clamping heat sinks to circuit boards over processors
10/29/2003CN1452534A Laser drilling method
10/29/2003CN1452451A Multilayer wiring substrate, method for mfg. same, electronic device and electronic machine
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