Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2003
12/31/2003CN1133240C 非圆形微通道 Non-circular microchannel
12/31/2003CN1133230C High frequency circuit device and used electrid element used thereof
12/31/2003CN1133209C Stacked via in copper/polyimide BEOL
12/31/2003CN1133205C Process for preparing diode with ceramic substrate and crystal grain structure
12/31/2003CA2490773A1 Dicopper(i)oxalate complexes as precursor substances for the deposition of metallic copper
12/31/2003CA2489916A1 Complexing agent for treating metallic and plastic surfaces
12/30/2003US6671384 Apparatus having an electroacoustic transducer mounted on a p.c. board with the aid of a holding means
12/30/2003US6671182 Soldermask opening to prevent delamination
12/30/2003US6671036 Balanced positioning system for use in lithographic apparatus
12/30/2003US6671024 Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof
12/30/2003US6670819 Methods of engaging electrically conductive pads on a semiconductor substrate
12/30/2003US6670816 Test coupon for measuring a dielectric constant of a memory module board and method of use
12/30/2003US6670720 Semiconductor chip package with alignment structure
12/30/2003US6670718 Wiring board utilizing a conductive member having a reduced thickness
12/30/2003US6670706 Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same
12/30/2003US6670704 Device for electronic packaging, pin jig fixture
12/30/2003US6670701 Semiconductor module and electronic component
12/30/2003US6670699 Semiconductor device packaging structure
12/30/2003US6670698 Integrated circuit package mounting
12/30/2003US6670697 Semiconductor device module frame and group thereof
12/30/2003US6670696 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof
12/30/2003US6670693 Laser synthesized wide-bandgap semiconductor electronic devices and circuits
12/30/2003US6670557 Design for constructing an input circuit to receive and process an electrical signal
12/30/2003US6670556 Printed circuit board unit with detachment mechanism for electronic component
12/30/2003US6670549 Electronic module
12/30/2003US6670430 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
12/30/2003US6670264 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
12/30/2003US6670220 Semiconductor device and manufacture method of that
12/30/2003US6670217 Methods for forming a die package
12/30/2003US6670102 Method for manufacturing circuit board having conductive via
12/30/2003US6670101 For making additional interconnect layers on commercially available printed circuit boards
12/30/2003US6669869 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated
12/30/2003US6669833 Agitating electrolyte inside tank with suspended, reciprocating paddle
12/30/2003US6669809 Apparatus for removing a coating film
12/30/2003US6669805 Drill stack formation
12/30/2003US6669781 Method and apparatus for improving stencil/screen print quality
12/30/2003US6669490 Conductive elastomeric contact system with anti-overstress columns
12/30/2003US6669489 Interposer, socket and assembly for socketing an electronic component and method of making and using same
12/30/2003US6669149 Fixing member for fixing an object to be attached to a plate and clamp with fixing member
12/30/2003US6669079 Conductive paste and semiconductor component having conductive bumps made from the conductive paste
12/30/2003US6669077 High-strength solder joint
12/30/2003US6668451 Methods for trimming electrical parameters in an electrical circuit
12/30/2003US6668450 Method for the production of an electrotechnical device
12/30/2003US6668449 Method of making a semiconductor device having an opening in a solder mask
12/30/2003US6668448 Method of aligning features in a multi-layer electrical connective device
12/30/2003US6668447 Multilayered board comprising folded flexible circuits and method of manufacture
12/30/2003US6668445 Method of increasing tab bond strength using reactive ion etching
12/25/2003WO2003106740A1 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board
12/25/2003WO2003106176A1 Paste container for screen printing and screen printing apparatus
12/25/2003US20030236362 Alkyl acrylate monomer, a core-shell polymer or a semicrystalline polymer; heat curable
12/25/2003US20030236006 Standing board fixing structure
12/25/2003US20030235976 Method for producing a substrate arrangement
12/25/2003US20030235087 Storage cell for surface mounting
12/25/2003US20030235044 Electronic circuit board manufacturing process and associated apparatus
12/25/2003US20030235043 Wiring board device
12/25/2003US20030235038 Power semiconductor module
12/25/2003US20030234709 Lead-less surface mount reed relay
12/25/2003US20030234620 Electroluminescent lamp module and processing method
12/25/2003US20030234451 Stabilized wire bonded electrical connections and method of making same
12/25/2003US20030234447 Contact structure for reliable metallic interconnection
12/25/2003US20030234443 Low profile stacking system and method
12/25/2003US20030234441 Method of mounting a leadless package and structure therefor
12/25/2003US20030234403 Optical package structure
12/25/2003US20030234277 Microelectronic device interconnects
12/25/2003US20030234117 Ground connector assembly with substrate strain relief and method of making same
12/25/2003US20030234085 Ultrasonic manufacturing apparatus
12/25/2003US20030234072 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces
12/25/2003US20030233960 Method for electroless plating without precious metal sensitization
12/25/2003US20030233750 Method and apparatus for supporting a substrate
12/24/2003WO2003107727A1 Stencil
12/24/2003WO2003107726A1 A pcb method and apparatus for producing landless interconnects
12/24/2003WO2003107496A1 Laser beam machine and control method of the machine
12/24/2003WO2003107413A2 Method and device for producing an electronic component having external contact surfaces
12/24/2003WO2003107266A1 Method for production of antennae for rfid transponders
12/24/2003WO2003106734A2 Metallisation
12/24/2003WO2003106573A1 A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby
12/24/2003WO2003106175A1 Support system and method for a screen printing unit
12/24/2003WO2003089991A3 Photocurable compositions containing reactive particles
12/24/2003WO2003079743A3 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method
12/24/2003WO2003070994A3 Lead-free tin-silver-copper alloy solder composition
12/24/2003WO2002088243A3 Method for producing thin homogeneous layers with the help of screen printing technology, device for carrying out said method and the use thereof
12/24/2003WO2002061010A8 Method for adhering substrates using light activatable adhesive film
12/24/2003DE20315064U1 Energiesparlampe mit semitransparentem Schutzrohr Energy saving lamp with semi-transparent protective tube
12/24/2003DE10255337C1 Anordnung zur Reduzierung der elektromagnetischen Abstrahlung und zur Ableitung von Überspannungen Arrangement for reducing the electromagnetic radiation and for the disposal of overvoltages
12/24/2003DE10249992C1 Durchsichtige Scheibe mit einer undurchsichtigen Kontaktfläche für eine Lötverbindung Transparent disk with an opaque contact surface for solder
12/24/2003DE10239845C1 Elektrode für fotovoltaische Zellen, fotovoltaische Zelle und fotovoltaischer Modul Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
12/24/2003CN1463572A Method for mfg. ceramic multilayered board
12/24/2003CN1463571A Electronic component-use material and electronic component using it
12/24/2003CN1463570A Printed circuit board with mounted printed circuit on it, and system of electrical components connected with said printed circuit board
12/24/2003CN1463410A Method for producing contactless chip card using transfer paper and intelligent card manufactured by such method
12/24/2003CN1463281A Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil
12/24/2003CN1463261A Method for mfg. ceramic part
12/24/2003CN1463174A High frequency circuit connection structure having good high frequency performance
12/24/2003CN1462980A Appts. for removing coating on conductive material of non-donductive carrier
12/24/2003CN1132509C Sheet for heat transfer substrate and method for mfg. sheet, and heat transfer substrate using same and mfg. method therefor
12/24/2003CN1132267C Three-way connector
12/24/2003CN1132242C Automated stacking and soldering appts. for three dimensional stack package devices and mfg. method thereof
12/24/2003CN1132203C Monolithic ceramic electronic element and its producing method
12/24/2003CN1132054C Composite and flexible circuit distributing plate, and its mfg. method, photoelctric device and electronic device
12/24/2003CN1131894C Preteatment solution for electroless plating, electroless plating bath and electroless plating method
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