Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2003
12/02/2003US6656750 Method for testing chips on flat solder bumps
12/02/2003US6656627 Battery pack
12/02/2003US6656370 Method for the manufacture of printed circuit boards
12/02/2003US6656341 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching
12/02/2003US6656314 Method of manufacturing multilayer substrates
12/02/2003US6656308 Temporary rigid immobilization of the printing stamp backplane by glue lamination during curing; silicone rubber printing stamp imprinted with a microcircuit in positive relief
12/02/2003US6656291 Sn-Bi solder powder; acid anhydride activating agent
12/02/2003US6656279 Apparatus for the spray treatment of printed circuit boards
12/02/2003US6656275 Partial plating system
12/02/2003US6655995 Electrical connector receptacle cage with interlocking upper and lower shells
12/02/2003US6655990 Method of surface mounting a connector and connector
12/02/2003US6655969 Contact elements
12/02/2003US6655968 Circuit having bus bars and junction box containing the circuit
12/02/2003US6655967 Electrical connector housing
12/02/2003US6655964 Low cost integrated out-of-plane micro-device structures and method of making
12/02/2003US6655950 Printed circuit board edge shaping tool
12/02/2003US6655574 Apparatus for selective soldering
12/02/2003US6655286 Method for preventing distortions in a flexibly transferred feature pattern
12/02/2003US6655024 Method of manufacturing a circuit board
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
12/02/2003US6655021 Method and apparatus for improving mounting
12/02/2003US6655018 Technique for surface mounting electrical components to a circuit board
12/02/2003CA2293110C Conductive elastomer interconnect
12/02/2003CA2214130C Assemblies of substrates and electronic components
12/02/2003CA2168013C Alkaline ammoniacal cupric chloride etching bath containing a copper (i) stabilizer
11/2003
11/27/2003WO2003098985A1 Method for forming multilayer circuit structure and base having multilayer circuit structure
11/27/2003WO2003098984A1 Interlayer connection structure and its building method
11/27/2003WO2003098983A1 Printed wiring board
11/27/2003WO2003098981A1 Electrical device
11/27/2003WO2003098745A1 Method of attaching circuitry to a modular jack connector using electrically conductive paste
11/27/2003WO2003098744A1 Optically transparent elastomeric interconnects and method of using same
11/27/2003WO2003097557A1 Method for producing a ceramic-copper composite substrate
11/27/2003WO2003097357A2 Device and method for positioning a substrate to be printed
11/27/2003WO2003097295A1 Automatic machine tool
11/27/2003WO2003073473A3 High frequency device packages and methods
11/27/2003WO2003062311A3 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
11/27/2003WO2003041463A3 Method and apparatus for emi shielding
11/27/2003WO2003041130A3 Method for creating adhesion during fabrication of electronic devices
11/27/2003WO2002080271A3 Fluxless flip chip interconnection
11/27/2003WO2002078359A3 Insulation strip for a pots splitter card
11/27/2003US20030220185 Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate
11/27/2003US20030219991 Conductive material patterning methods
11/27/2003US20030219956 Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
11/27/2003US20030219927 Solder balls and conductive wires for a semiconductor package, and an improved manufacturing method, and evaporation method therefor
11/27/2003US20030219923 Method and system for fabricating electronics
11/27/2003US20030219656 Waterborne printed circuit board coating compositions
11/27/2003US20030219623 Solder joints with low consumption rate of nickel layer
11/27/2003US20030219608 Metal transfer sheet, producing method thereof, and producing method of ceramic condenser
11/27/2003US20030219604 Three-layer structure consisting of a layer A, a layer B and a layer C laminated in this order, wherein the layer A comprises a fluororesin having a melting point higher than the press molding temperature of a product to be molded, the
11/27/2003US20030219588 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
11/27/2003US20030219576 Copper Circuit formed by kinetic spray
11/27/2003US20030219298 Keyboard assembly
11/27/2003US20030218871 Accuracy during temperature variations; laminate of dielectric and metal wire; controlling expansion
11/27/2003US20030218870 Low temperature co-fired ceramic with improved shrinkage control
11/27/2003US20030218851 Voltage variable material for direct application and devices employing same
11/27/2003US20030218515 Radio frequency circuit module on multi-layer substrate
11/27/2003US20030218261 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products
11/27/2003US20030218258 Curable thermosetting adhesive
11/27/2003US20030218252 Transfer plate; electrode overcoating dielectric; determination surface roughness
11/27/2003US20030218250 Method for high layout density integrated circuit package substrate
11/27/2003US20030218249 High-density integrated circuit package and method for the same
11/27/2003US20030218244 Miniaturized contact spring
11/27/2003US20030218243 Solder pads for improving reliability of a package
11/27/2003US20030218238 Semiconductor device and electronic device
11/27/2003US20030218233 Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit
11/27/2003US20030218190 Electronic device and method of manufacturing the same, and electronic instrument
11/27/2003US20030218055 Integrated circuit packages without solder mask and method for the same
11/27/2003US20030217996 Method for simultaneous laser beam soldering
11/27/2003US20030217462 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
11/27/2003US20030217457 Method for preparing composite materials of a positive temperature coefficient thermistor
11/27/2003US20030217450 Laser processing method of an inkjet head
11/26/2003EP1365638A2 Process for improving the electrical conductivity and the corrosion and wear resistance of a flexible circuit
11/26/2003EP1365637A2 Copper circuit formed by kinetic spray
11/26/2003EP1365451A1 Module component
11/26/2003EP1364984A1 Resin composite material and method of forming the same
11/26/2003EP1364921A1 Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate
11/26/2003EP1364788A2 Ink jet print head and method and apparatus for bonding flexible printed circuit cable for ink jet print head
11/26/2003EP1364762A1 Release film
11/26/2003EP1364566A2 Electronic component, component mounting equipment, and component mounting method
11/26/2003EP1364563A1 Method for making a multilevel circuitry comprising conductor tracks and micro-vias
11/26/2003EP1364562A1 Vacuum deposited circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same
11/26/2003EP1364401A2 Microelectronic package having bumpless laminated interconnection layer
11/26/2003EP1364222A1 Method and device for testing the quality of printed circuits
11/26/2003EP1364220A2 Electronic pressure sensitive transducer apparatus and method for manufacturing same
11/26/2003EP1363811A1 Method for producing a moulded component comprising an integrated conductor strip and moulded component
11/26/2003EP1363776A2 Printing plates
11/26/2003EP1264683B1 Copper-clad laminate
11/26/2003CN1459219A Flexible printed wiring board
11/26/2003CN1459117A Method for producing electronic parts, and member for production thereof
11/26/2003CN1459049A Ultraviolet-curable resin composition and photosolder resist ink contaning the composition
11/26/2003CN1458963A Poly ester synthetic (phenyl ether), polyester film, laminates sheet, printed wiring board, and maltilayer printed wiring board
11/26/2003CN1458873A Machining device and machining method
11/26/2003CN1458815A Metal core base plate and its producing process
11/26/2003CN1458657A Accumulator unit for plane mounting
11/26/2003CN1458304A Tin plating method
11/26/2003CN1129036C Stripping process for anti-corrosion layer
11/25/2003US6654064 Image pickup device incorporating a position defining member
11/25/2003US6653915 Coaxial transmission lines having grounding troughs on a printed circuit board
11/25/2003US6653743 Electronic component mounted on a flat substrate and padded with a fluid filler
11/25/2003US6653742 Assembly including semiconductor chip, conductive pad, conductive trace, connection joint, and insulative adhesive; conductive trace includes routing line and pillar; connection joint contacts and electrically connects routing line and pad
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