Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2003
12/11/2003US20030226901 IC card and manufacturing method thereof
12/11/2003US20030226895 Long range optical reader
12/11/2003US20030226877 Thermal solder writing eutectic bonding process and apparatus
12/11/2003US20030226758 Tin plating method
12/11/2003US20030226688 Vented circuit board for cooling power components
12/11/2003US20030226687 Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method
12/11/2003US20030226252 Packaging method for X-ray image sensory systems
12/11/2003US20030226249 Riveting method
12/11/2003DE20312475U1 Device for attaching, preparing accumulator cells has circuit board with conducting tracks, soldering surfaces for soldering individual accumulator cells onto board and fixing stack by shaping board
12/11/2003DE20211560U1 Leiterplattenelement mit einer Stromversorgungsvorrichtung für auf der Leiterplatte angeordnete elektrische und elektronische Bauelemente Printed circuit board element with a power supply apparatus for arranged on the printed circuit board electrical and electronic components
12/11/2003DE20121996U1 Sub chip-on-board for optical mouse, has sub PCB attached with optical sensor die, which is fixed to main PCB by inserting pins into pin holes of both PCBs
12/11/2003DE10222285C1 Flat and flexible ribbon cable has the insulation extruded in two stages, to fix the conductor paths in defined positions in relation to each other within the insulation
12/10/2003EP1370123A2 Metal/ceramic bonding article and method for producing same
12/10/2003EP1369921A2 Semiconductor package and method for packaging a semiconductor
12/10/2003EP1369917A2 Electronic component mounting board, method of manufacturing the same, electronic component module, and communications equipment
12/10/2003EP1369816A1 Tuning capacitors for IC module in wireless IC card
12/10/2003EP1369737A2 Liquid crystal display device and manufacturing method thereof
12/10/2003EP1369546A1 Flexible electronic module for door handle, in particular for motor vehicle
12/10/2003EP1369402A1 Tape composition and process for constrained sintering of low temperature co-fired ceramic
12/10/2003EP1369004A1 Method and protective device for mounting a temperature-sensitive electronic component
12/10/2003EP1369003A1 Transfer printing
12/10/2003EP1369002A2 Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
12/10/2003EP1368813A2 Method for patterning metal using nanoparticle containing precursors
12/10/2003EP1196966B1 Connector and method for establishing solderfree connections between a rigid main pcb and associated conductors
12/10/2003EP0938447B1 Method for reducing copper oxide to metallic copper
12/10/2003EP0800753B1 Microelectronic bonding with lead motion
12/10/2003EP0749673B1 Fabrication multilayer combined rigid/flex printed circuit board
12/10/2003CN2591867Y Larger power thermal connect-and-disconnect frequency modulation power amplifier
12/10/2003CN1461584A Improved adhesion of polymeric materials to metal surfaces
12/10/2003CN1461583A 表面安装型电子部件 Surface mount electronic components
12/10/2003CN1461517A Piezoelectric oscillator and its mfg. method
12/10/2003CN1461495A Wiring method and element arragning method using the same, and method of producing image display devices
12/10/2003CN1461427A Machine for treatment of printing plates
12/10/2003CN1461412A Module of testing device for testing printed circuit boards
12/10/2003CN1461183A Wiring base board, its manufacturing method and semiconductor device
12/10/2003CN1461182A Rigidity flexible base board and camera using the same
12/10/2003CN1461181A Distributing base board and electronic device using it
12/10/2003CN1130799C Connector for flat flexible circuit
12/10/2003CN1130427C Epoxy resin composition and semi-solidified sheet and multilayer printed board produced therewith
12/09/2003US6662353 System and program for estimating person-hours required to prepare a pattern film of a circuit to be printed on a board
12/09/2003US6662351 Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern
12/09/2003US6662345 Method and apparatus for designing printed-circuit board
12/09/2003US6661690 High capacity memory module with built-in performance enhancing features
12/09/2003US6661674 System comprising at least two printed circuit boards
12/09/2003US6661642 Dielectric structure
12/09/2003US6661641 Monolithic ceramic capacitor
12/09/2003US6661318 Radio frequency circuit module on multi-layer substrate
12/09/2003US6661316 High frequency printed circuit board via
12/09/2003US6661247 Semiconductor testing device
12/09/2003US6661098 High density area array solder microjoining interconnect structure and fabrication method
12/09/2003US6660946 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
12/09/2003US6660945 Interconnect structure and method of making same
12/09/2003US6660944 Circuit board having solder bumps
12/09/2003US6660943 One-package type thermosetting urethane comprising prepolymer obtained by reacting polyol with excessive polyisocyanate; fine powder-coated curing agent; storage stability; low temperature curing
12/09/2003US6660942 Semiconductor device with an exposed external-connection terminal
12/09/2003US6660941 Electronic parts mounting board and production method thereof
12/09/2003US6660632 Applying amorphous film of metal complex to substrate, converting to metal or its oxides by thermal, photochemical or electron beam irradiation
12/09/2003US6660625 Method of electroless plating copper on nitride barrier
12/09/2003US6660563 Method and system for assembling a printed circuit board using a land grid array
12/09/2003US6660559 Method of making a chip carrier package using laser ablation
12/09/2003US6660548 Packaging of multiple active optical devices
12/09/2003US6660457 Depositing electroconductive thermoplastic resin then positive photosensitive coating layers, irradiating with oscillating laser and simultaneously developing
12/09/2003US6660406 Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
12/09/2003US6660374 Radiation-curable compositions and cured articles
12/09/2003US6660192 Molded waveguides
12/09/2003US6660174 Method of manufacturing a microstrip edge ground termination
12/09/2003US6660153 Seed layer repair bath
12/09/2003US6660116 Capacitive filtered feedthrough array for an implantable medical device
12/09/2003US6659779 Electronic assembly having a removable power supply
12/09/2003US6659355 Method for producing a multi-layer chip card
12/09/2003US6659335 Soldering method and soldering apparatus
12/09/2003US6659334 Method for forming end-face electrode
12/09/2003US6659328 Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
12/09/2003US6659005 Screen printing method and screen printing apparatus
12/09/2003US6659004 Screen printing paste, screen printing method, and baked thick film body
12/09/2003US6659002 Screening apparatus with trailing squeegee and method of screening
12/09/2003US6658733 Method of manufacturing via interconnection of glass-ceramic wiring board
12/09/2003US6658731 Method for fabricating connectors for interconnecting etched tri-metal circuit structures
12/09/2003US6658730 Processor power delivery system
12/09/2003US6658729 Method of controlling shock and vibration of electrical interconnects
12/09/2003US6658728 Method for fabricating a spring structure on a substrate
12/09/2003US6658722 Coating polyamic acids on stainless steel, superimposing thin films of copper, patterning by etching and photolithography, then imidating to form polyimide supports for disk drives
12/09/2003CA2247404C Multi-tool positioning system
12/06/2003CA2389631A1 Frangible led motherboard
12/04/2003WO2003101166A1 Aluminum nitride sintered compact having metallized layer and method for preparation thereof
12/04/2003WO2003101165A1 Direct-write laser transfer and processing
12/04/2003WO2003101164A1 Nanoparticle filled underfill
12/04/2003WO2003101163A1 Wiring substrate, method for producing the same, and semiconductor chip inspection equipment utilizing it
12/04/2003WO2003100970A1 Lc series resonance circuit, board incorporating lc series resonance circuit, and production methods therefor
12/04/2003WO2003100859A2 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component
12/04/2003WO2003100854A2 Electronic component module and method for the production thereof
12/04/2003WO2003100853A1 Multilayer substrate with built-in coil, semiconductor chip, methods for manufacturing them
12/04/2003WO2003100852A1 Shielding wire in multilayer board, semiconductor chip, electronic circuit element, and method for producing the same
12/04/2003WO2003100850A1 Substrate, wiring board, semiconductor package-use substrate, semiconductor package and production methods for them
12/04/2003WO2003100846A2 Glass material for use at high frequencies
12/04/2003WO2003100486A1 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly
12/04/2003WO2003100138A1 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it
12/04/2003WO2003099952A1 Adhesive film and prepreg
12/04/2003WO2003099709A2 Method for patterning carbon nanotube coating and carbon nanotube wiring
12/04/2003WO2003099098A1 Dust removing cleaner
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