Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2003
10/14/2003US6631675 Applying mask with recessed blind opening for protecting a previously screened feature
10/14/2003US6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
10/14/2003US6631559 Intermittently supplying flat cables in a common direction and transporting in parallel to heat bonding device; synchronization, cutting
10/14/2003US6631558 Blind via laser drilling system
10/09/2003WO2003084297A1 Wiring structure and its manufacturing method
10/09/2003WO2003084296A1 Circuit transmission characteristic correcting method, correcting structure thereof, and holder used for the correcting structure
10/09/2003WO2003084295A2 Inductor and decoupling structures for filters and design method thereof
10/09/2003WO2003084026A1 Regulator and rectifier for an electric machine and electric machine
10/09/2003WO2003083940A1 Method of manufacturing heat conductive substrate
10/09/2003WO2003083882A1 Self-leaded surface mount component holder
10/09/2003WO2003083581A1 Resist releasing agent
10/09/2003WO2003083545A2 Assembly of active optical devices on a substrate
10/09/2003WO2003083543A1 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
10/09/2003WO2003083185A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/09/2003WO2003083182A2 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
10/09/2003WO2003082977A1 Resin containing dielectric filler for formation of built-in capacitor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
10/09/2003WO2003082937A2 Polymerisable composition
10/09/2003WO2003082605A1 Method of stripping silver from a printed circuit board
10/09/2003WO2003082604A1 Inverted micro-vias
10/09/2003WO2003041462A3 Method for the treatment of electrically conductive substrates and printed circuit boards and the like
10/09/2003WO2003038159A3 Method and conveyorized system for electrolytically processing work pieces
10/09/2003WO2003030247A3 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
10/09/2003WO2003015482A3 A system and method for unveiling targets embedded in a multi-layered electrical circuit
10/09/2003US20030190837 Battery holder having means for securely retaining battery in position
10/09/2003US20030190827 Electrical connector having retention contact tails and non-retention contact tails for retaining to a pcb prior to soldering as well as reducing force of inserting the contact tails to the pcb
10/09/2003US20030190799 Pattern formation process for an integrated circuit substrate
10/09/2003US20030190769 Method of supporting a substrate film
10/09/2003US20030190533 Manufacture of masks and electronic parts
10/09/2003US20030190479 Thermosetting resin compositions comprising epoxy resins, adhesion promoters and curatives based on the combination of nitrogen compounds and transition metal complexes
10/09/2003US20030190419 Method for forming a film, film forming device, liquid discharge device, method for manufacturing a color filter, display device having a color filter, method for manufacturing a display device, display device, and electronic apparatus
10/09/2003US20030190071 Multi-layer printed circuit board fabrication system and method
10/09/2003US20030189831 Light irradiating unit , lighting unit and method for manufacturing lighting unit
10/09/2003US20030189817 Electronic device with external terminals and method of production of the same
10/09/2003US20030189816 Semiconductor module
10/09/2003US20030189814 Electronic device
10/09/2003US20030189746 Photo apparatus comprising substrates having photosensitive multilayers on the surfaces, pulsed radiation source, acoustic and optical modulators, and scanners, having improve image quality and accuracy
10/09/2003US20030189619 Ink jet print head
10/09/2003US20030189517 Multi-layer-substrate and satellite broadcast reception apparatus
10/09/2003US20030189260 Flip-chip bonding structure and method thereof
10/09/2003US20030189214 Techniques for joining an opto-electronic module to a semiconductor package
10/09/2003US20030189161 System for compensating for chip-to-chip gap widths in a multi-chip photosensitive scanning array
10/09/2003US20030189140 Snap structure
10/09/2003US20030189083 Solderless test interface for a semiconductor device package
10/09/2003US20030188958 Micro-electro mechanical system
10/09/2003US20030188890 Printed wiring board
10/09/2003US20030188888 Multilayer printed wiring board and method for manufacturing same
10/09/2003US20030188887 Integrated lead suspension and method of construction
10/09/2003US20030188886 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces
10/09/2003US20030188646 Screen printing method
10/09/2003US20030188645 Screen printing method
10/09/2003US20030188430 Ball grid array module
10/09/2003US20030188429 Method for producing a double-sided wiring board
10/09/2003US20030188428 Comprises drilling with YAG solid-state laser; protective masks
10/09/2003CA2480433A1 Self-leaded surface mount component holder
10/09/2003CA2469880A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/08/2003EP1351562A2 Electromagnetic interference shield for overmolded packaging of an electronic assembly
10/08/2003EP1351560A2 Electronic apparatus and method for making the same
10/08/2003EP1351332A1 Shield case or planar antenna on pcb
10/08/2003EP1351302A2 Power semiconductor module
10/08/2003EP1351299A2 Fexible and thin circuit construction
10/08/2003EP1351296A1 Electronic parts mounting substrate and process for manufacturing the same
10/08/2003EP1351289A1 Method and apparatus for forming fine circuit interconnects
10/08/2003EP1351279A1 Device for transporting substrates in an oven
10/08/2003EP1350807A1 Etchant for thermoplastic polyimide resin
10/08/2003EP1350588A2 Method of manufacturing semiconductor device
10/08/2003EP1350418A1 Method for producing interconnection in a multilayer printed circuits
10/08/2003EP1350417A2 Method for the production of an electronic component
10/08/2003EP1350287A1 Method and device for connecting conductors
10/08/2003EP1350270A1 Stacked die package
10/08/2003EP1350140A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same
10/08/2003EP1349696A1 Method of laser welding
10/08/2003EP1196830B1 A printed circuit production method
10/08/2003EP1100647B1 Device for the laser processing of flat workpieces
10/08/2003EP1090537B1 Method and apparatus for drilling microvia holes in electrical circuit interconnection packages
10/08/2003EP1072176B1 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
10/08/2003EP1032482B1 Method and device for thermally bonding connecting surfaces of two substrates
10/08/2003CN2579136Y Melting connection device of multilayer printed circuit board
10/08/2003CN1447846A Process for improving polymer to metal adhesion
10/08/2003CN1447646A Method of producing plants, plant cultivating device, and light-emitting panel
10/08/2003CN1447640A Mfg. appts. of laminator
10/08/2003CN1447639A Method for fabricating multiplayer circuit boards
10/08/2003CN1447638A Welding method and welded parts
10/08/2003CN1447637A Connection structure of distribution substrate and its display device
10/08/2003CN1447423A Diaphragm bearing belt for mounting electronic device and its mfg. method
10/08/2003CN1447408A Mfg. appts. of electronic device, its mfg. method and mfg. program
10/08/2003CN1447407A Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device
10/08/2003CN1447406A Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device
10/08/2003CN1447293A Circuit board connection structure, method of forming, circuit board connection structure and display device
10/08/2003CN1123931C Electronic module
10/08/2003CN1123845C Portable electronic device
10/08/2003CN1123590C Polybenzoxazole resin and its precursor
10/07/2003US6631509 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise
10/07/2003US6631078 Electronic package with thermally conductive standoff
10/07/2003US6631071 Capacitor module
10/07/2003US6630839 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor
10/07/2003US6630837 Apparatus for testing bumped die
10/07/2003US6630836 CSP BGA test socket with insert
10/07/2003US6630743 Copper plated PTH barrels and methods for fabricating
10/07/2003US6630742 Method for forming bumps, semiconductor device, and solder paste
10/07/2003US6630738 Deflectable interconnect
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