Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2003
09/25/2003US20030178471 Solid conductive element insertion apparatus
09/25/2003US20030178470 Method of recovering lead-free solder from printed circuit boards
09/25/2003US20030178466 Solder paste stenciling apparatus for minimizing residue of solder paste
09/25/2003US20030178403 Method and system for locally connecting microstructures and devices formed thereby
09/25/2003US20030178398 Machining device and machining method
09/25/2003US20030178395 Method and apparatus for fabrication of miniature structures
09/25/2003US20030178391 Composition for producing metal surface topography
09/25/2003US20030178388 Inverted micro-vias
09/25/2003US20030178317 Electrolytic deposition of silicate containing coating/film onto metal substrate; improved corrosion/electrical/heat resistance, flexibility, and resistance to stress cracks
09/25/2003US20030178229 Multilayered printed wiring board
09/25/2003US20030178228 Method for scalable architectures in stackable three-dimentsional integrated circuits and electronics
09/25/2003US20030178227 Transfer sheet and production method of the same and wiring board and production method of the same
09/25/2003US20030178221 Anisotropically conductive film
09/25/2003US20030178174 Thermal pouch interface
09/25/2003US20030178139 Protective coatings for improved tarnish resistance in metal foils
09/25/2003US20030178138 Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
09/25/2003US20030178132 Method for manufacturing connection structure
09/25/2003US20030178131 Apparatus and method for laminating dry film using microwave
09/25/2003US20030178101 Lead-free solder, and paste solder composition
09/25/2003US20030177639 Process and apparatus for manufacturing printed circuit boards
09/25/2003US20030177638 Method of fabricating a high-layer-count backplane
09/25/2003US20030177637 Impedance matching connection scheme for high frequency circuits
09/25/2003US20030177635 Printed circuit board with mixed metallurgy pads and method of fabrication
09/25/2003US20030177634 Subtractive process for fabricating cylindrical printed circuit boards
09/25/2003DE10211826C1 Terminal rail connector plug has contact elements cooperating with terminal rails provided by metallised structure within plastics lower half of connector plug
09/24/2003EP1347674A2 Technique for reducing the number of layers in a multilayer circuit board
09/24/2003EP1347476A2 Ceramic electronic device and method of production of same
09/24/2003EP1347475A1 Laminated circuit board and production method for electronic part, and laminated electronic part
09/24/2003EP1347470A1 Electrical devices comprising a conductive polymer
09/24/2003EP1347468A1 Method for patterning electroconductive tin oxide film
09/24/2003EP1346825A2 Apparatus and method for laminating dry film using microwave
09/24/2003EP1346617A2 Multilayered hybrid electronic module
09/24/2003EP1346616A1 Production of antenna devices
09/24/2003EP1346615A1 A multi-chip integrated circuit carrier
09/24/2003EP1346613A1 Via-in-pad with off-center geometry and methods of manufacture
09/24/2003EP1346410A1 Flexible electronic device
09/24/2003EP1346083A2 Electrochemical co-deposition of metals for electronic device manufacture
09/24/2003EP1090535A4 Flip chip devices with flexible conductive adhesive
09/24/2003EP1003645B1 Method of making electronic parts
09/24/2003EP0998550B1 n-PROPYL BROMIDE BASED CLEANING SOLVENT AND IONIC RESIDUE REMOVAL PROCESS
09/24/2003CN2575932Y Cyclone powder machine
09/24/2003CN1444840A 填充装置 Filling device
09/24/2003CN1444839A Filling method
09/24/2003CN1444838A Electronic supports and methods and apparatus for forming apertures in electronic supports
09/24/2003CN1444437A Through-hole filling method
09/24/2003CN1444436A Printed circuit board and making method thereof
09/24/2003CN1444435A Printed circuit board producing method
09/24/2003CN1444434A Method for making laminated plate covered with metal for printed circuit board
09/24/2003CN1444433A Production method of printed circuit borad with built-in resistor
09/24/2003CN1444424A Device making method and apparatus, device and electronic machine thereof
09/24/2003CN1444273A 电子装置 Electronic devices
09/24/2003CN1444270A COF flexible printed circuit board and method for making said circuit board
09/24/2003CN1444269A Multi-layer semiconductor device and its mfg. method
09/24/2003CN1444261A Soldered ball embedding device
09/24/2003CN1444240A Ceramic electronic element and mfg. method thereof
09/24/2003CN1444239A Ceramic electronic part, coating method and device
09/24/2003CN1444073A Liquid display deivce and mfg. method thereof
09/24/2003CN1444050A Low-intensity magnetic field and its mfg. method using printed circuit board mfg. technology
09/24/2003CN1444049A Low-intensity magnetic field sensor using printed circuit board mfg. thchnology and its mfg. method
09/24/2003CN1443625A Soldering flux
09/24/2003CN1122310C Static electricity removing structure for portable electronic devices
09/24/2003CN1122083C Thermally reworkable binders for flip chip devices
09/24/2003CN1121924C Laser pocessing method
09/23/2003US6625682 Electromagnetically-coupled bus system
09/23/2003US6625038 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout
09/23/2003US6625037 Printed circuit board and method manufacturing the same
09/23/2003US6625036 Infrared data communication module and method of making the same
09/23/2003US6625032 Aqueous dispersion forming conductive layer, conductive layer, electronic compent, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same
09/23/2003US6625031 Module part and electronic device
09/23/2003US6624703 Terminal arrangement for an electrical device
09/23/2003US6624650 Impedance measuring device for printed wiring board
09/23/2003US6624648 Probe card assembly
09/23/2003US6624573 Fluorescent display device
09/23/2003US6624512 Semiconductor integrated circuit device and printed wired board for mounting the same
09/23/2003US6624511 Hybrid integrated circuit device
09/23/2003US6624500 Thin-film electronic component and motherboard
09/23/2003US6624382 Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure
09/23/2003US6624071 Pattern of an organic molecular film is formed on a substrate, a solution for forming a thin film applied, and the thin film is selectively formed on the organic molecular film pattern
09/23/2003US6624008 Semiconductor chip installing tape, semiconductor device and a method for fabricating thereof
09/23/2003US6624004 Flip chip interconnected structure and a fabrication method thereof
09/23/2003US6623906 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same
09/23/2003US6623903 Material and method for making an electroconductive pattern
09/23/2003US6623844 Multi-layer wiring board and method of producing the same
09/23/2003US6623843 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board
09/23/2003US6623842 Surface electrode structure on ceramic multi-layer substrate and process for producing the same
09/23/2003US6623803 Copper interconnect stamping
09/23/2003US6623787 Method to improve the stability of dispersions of carbon
09/23/2003US6623663 Contains copper; for forming via hole conductors to be converted to external electrode terminals
09/23/2003US6623651 Circuit board and a method for making the same
09/23/2003US6623306 Solder mask configuration for a printed circuit board of a modular jack
09/23/2003US6623298 CPU socket connector
09/23/2003US6623293 Battery holder having means for securely retaining battery in position
09/23/2003US6623284 Electrical connector
09/23/2003US6623283 Connector with base having channels to facilitate surface mount solder attachment
09/23/2003US6623282 Component retention socket
09/23/2003US6623280 Dual compliant pin interconnect system
09/23/2003US6623279 Separable power delivery connector
09/23/2003US6623219 Printed board processing machine
09/23/2003US6623152 Display element capable of being mounted on a printed circuit board
09/23/2003US6623111 Multilayer piezoelectric device and method of producing the same and piezoelectric actuator
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