Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2003
11/06/2003WO2003077618A3 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
11/06/2003WO2003073506A3 A modular integrated circuit chip carrier
11/06/2003WO2003067943A3 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/06/2003WO2003028085A3 Method for producing a ceramic substrate
11/06/2003WO2003001594A3 High-voltage module and method for producing the same
11/06/2003WO2002082584A3 Electrical terminal tail aligner
11/06/2003WO2002073278A3 Manufacturing method using solder self-alignment with optical component deformation fine alignment
11/06/2003US20030208740 System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture
11/06/2003US20030207745 Multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising
11/06/2003US20030207613 Connector structure of circuit board for power supply apparatus
11/06/2003US20030207598 Ganged land grid array socket contacts for improved power delivery
11/06/2003US20030207567 Metal film pattern and manufacturing method thereof
11/06/2003US20030207546 Mother substrate, substrate element, and method for manufacturing the same
11/06/2003US20030207489 Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints
11/06/2003US20030207478 Method of fabricating a shape memory alloy ink jet printing mechanism
11/06/2003US20030207211 Process for massively producing tape type flexible printed circuits
11/06/2003US20030207146 Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same
11/06/2003US20030207145 Method of adhering a solid polymer to a substrate and resulting article
11/06/2003US20030207114 Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers
11/06/2003US20030207073 Mounting structure for an electronic component and method for producing the same
11/06/2003US20030207048 Making a bond ply comprises treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion
11/06/2003US20030207034 Method and apparatus for improving interfacial chemical reactions
11/06/2003US20030206680 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
11/06/2003US20030206405 Circuit package for electronic systems
11/06/2003US20030206401 BGA/LGA with built in heat slug/spreader
11/06/2003US20030206388 Universial energy conditioning interposer with circuit architecture
11/06/2003US20030206376 Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication
11/06/2003US20030206266 Liquid crystal display substrate
11/06/2003US20030206263 Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment
11/06/2003US20030206210 Method of filling liquid into function liquid droplet ejection head, and ejection apparatus; method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; and method of forming spacer, metallic wiring, lens, resist, and light diffusion member
11/06/2003US20030206160 Circuit board with EMI suppression
11/06/2003US20030206084 Radio frequency circuit module on multi-layer substrate
11/06/2003US20030206030 Universal wafer carrier for wafer level die burn-in
11/06/2003US20030205813 Method of forming a multi-layered wiring structure incorporation in semiconductor intergrated circuit device and having large electromigration resistance.
11/06/2003US20030205799 Method and device for assembly of ball grid array packages
11/06/2003US20030205628 Nozzle for ejecting molten metal
11/06/2003US20030205610 Method of connecting circuit boards
11/06/2003US20030205561 Laser processing apparatus and method
11/06/2003US20030205551 Method for the manufacture of printed circuit boards with plated resistors
11/06/2003US20030205461 Removable modular cell for electro-chemical plating
11/06/2003US20030205407 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/06/2003US20030205406 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
11/06/2003US20030205240 For cleaning of semiconductor wafers
11/06/2003US20030204949 Method of forming connections on a conductor pattern of a printed circuit board
11/06/2003CA2518614A1 Manufacturing method for a wireless communication device and manufacturing apparatus
11/05/2003EP1359794A1 A method for soldering a shield can to a PCB and shield can therefor
11/05/2003EP1359792A1 Substrate with non-visible electrically conducting layers
11/05/2003EP1359627A2 Light emitting module
11/05/2003EP1359612A2 Methods of manufacturing a hybrid integrated circuit device
11/05/2003EP1359172A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition
11/05/2003EP1358675A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
11/05/2003EP1358291A2 Method for adhering substrates using light activatable adhesive film
11/05/2003EP1358041A1 Circuit board router apparatus and method thereof
11/05/2003EP1163825B1 Method for producing circuit arrangements
11/05/2003EP0934687B1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
11/05/2003EP0895486B1 Grafted thermoplastic elastomer barrier layer
11/05/2003CN2585528Y Rotary frame tray for panel turnover machine
11/05/2003CN2585416Y Semiconductor chip and wiring substrate, semiconductor wafer, semiconductor device, wire substrate and electronic machine
11/05/2003CN1454402A Self-aligned transition between a transmission line and a module
11/05/2003CN1454045A Wiring transfer sheet material and producing method thereof, wiring substrate and producing method thereof
11/05/2003CN1454044A Laminated printing circuit board and producing method thereof
11/05/2003CN1454043A Manufacture of laser-burnt multilayered circuit board
11/05/2003CN1454042A Method for producing printing circuit board
11/05/2003CN1454041A Production process and product of film-like flexible circuit board
11/05/2003CN1454040A Flexible printed circuit board on electroplated ink cartridge
11/05/2003CN1454039A Wiring plate, electronic device and mounting method of electronic elements
11/05/2003CN1453869A 半导体存储器模块 Semiconductor memory module
11/05/2003CN1453859A Mixed integrated circuit apparatus
11/05/2003CN1453857A Method for producing mixed integrated circuit apparatus
11/05/2003CN1453624A Method for forming pattern thin film electric conduction structure on base plate
11/05/2003CN1453608A Forming method of electroconductive film distribution film structural body, electrooptical apparatus and electronic instrument
11/05/2003CN1453076A Slurry conveying mechanism
11/05/2003CN1127177C Connection device for connection terminal of power circuit
11/05/2003CN1127141C Circuit interconnection adopting virtual mirror image packaging piece
11/05/2003CN1126973C Display device
11/05/2003CN1126829C Electroplating apparatus
11/05/2003CN1126629C Jet soldering trough
11/05/2003CN1126614C Rolled copper foil and producing method thereof
11/04/2003US6643839 Determining an optimum wiring pattern and component placement scheme for a printed wiring board
11/04/2003US6643434 Passive alignment using slanted wall pedestal
11/04/2003US6643135 On board mounting electronic apparatus and on board mounting electric power supply
11/04/2003US6643134 Holding and heat dissipation structure for heat generation part
11/04/2003US6643099 Transducer formed on a sacrificial metal substrate
11/04/2003US6642808 High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic
11/04/2003US6642723 Apparatus monitoring the deposition of a liquid-to-pasty medium on a substrate
11/04/2003US6642626 Ball grid array IC package and manufacturing method thereof
11/04/2003US6642625 Sockets for “springed” semiconductor devices
11/04/2003US6642624 Ball grid array type semiconductor device
11/04/2003US6642613 Techniques for joining an opto-electronic module to a semiconductor package
11/04/2003US6642612 Lead-bond type chip package and manufacturing method thereof
11/04/2003US6642609 Leadframe for a semiconductor device having leads with land electrodes
11/04/2003US6642485 System and method for mounting electronic components onto flexible substrates
11/04/2003US6642478 Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board
11/04/2003US6642460 Switch assembly employing an external customizing printed circuit board
11/04/2003US6642449 Electronic component and manufacturing method thereof
11/04/2003US6642448 Circuit card with potting containment fence apparatus
11/04/2003US6642158 Photo-thermal induced diffusion
11/04/2003US6642136 Method of making a low fabrication cost, high performance, high reliability chip scale package
11/04/2003US6641983 Coating solder films on the surfaces of substrates, drying or hardening, then selectively etching and developing using lasers; miniaturization
11/04/2003US6641899 Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same
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