| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/01/2003 | CN1445087A Liquid filling method of drop spray nozzle and spray device, photoelectric device manufacturing method |
| 10/01/2003 | CN1445086A Jet image data generating method, forming device, drop spray device, scanning device, liquid crystal display device |
| 10/01/2003 | CN1445085A Equipment and method for laminating film by microwave |
| 10/01/2003 | CN1445049A Soldering tin paste, welding finished product and welding method |
| 10/01/2003 | CN1445048A Solder without lead and paste solder composite |
| 10/01/2003 | CN1123280C Composition and process for filling vias |
| 10/01/2003 | CN1123279C Printed circuit board |
| 10/01/2003 | CN1123068C Lead frame manufacturing method |
| 10/01/2003 | CN1123067C Semiconductor device having semiconductor chip electrically connected to wiring substrate |
| 10/01/2003 | CN1123066C Apparatus and method for manufacturing electronic components with project electrodes |
| 10/01/2003 | CN1123029C Thermal release for fixing on circuit substrate |
| 10/01/2003 | CN1123015C Resistor and its producing method |
| 10/01/2003 | CN1122866C Flexible printing wiring substrate, electrooptics arrangement, and electronic device |
| 10/01/2003 | CN1122602C Silk-screen printing machine |
| 10/01/2003 | CN1122583C Assembly for dispensing resisting medium drop and its connecting device and changing method |
| 09/30/2003 | US6629307 Method for ensuring correct pin assignments between system board connections using common mapping files |
| 09/30/2003 | US6629305 Placement/net wiring processing system |
| 09/30/2003 | US6629061 Automatic concealment of product serialization information |
| 09/30/2003 | US6628543 Low temperature system for attaching magnetoresistive random access memory (MRAM) |
| 09/30/2003 | US6628531 Multi-layer and user-configurable micro-printed circuit board |
| 09/30/2003 | US6628527 Mounting structure for electronic parts and manufacturing method thereof |
| 09/30/2003 | US6628526 Electronic device manufacturing method, electronic device and resin filling method |
| 09/30/2003 | US6628179 Surface acoustic wave device with a window for adjustment of the device |
| 09/30/2003 | US6628178 Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof |
| 09/30/2003 | US6628133 Methods of testing integrated circuitry |
| 09/30/2003 | US6628128 CSP BGA test socket with insert and method |
| 09/30/2003 | US6627998 Wafer scale thin film package |
| 09/30/2003 | US6627993 Semiconductor device having an electrical contact and a dielectric lining in a contact region |
| 09/30/2003 | US6627844 Method of laser milling |
| 09/30/2003 | US6627823 Multilayered connection plate |
| 09/30/2003 | US6627822 Electronic assembly with separate power and signal connections |
| 09/30/2003 | US6627821 Circuit board and method of manufacturing therefor |
| 09/30/2003 | US6627684 Comprising an epoxy resins with two or more epoxy groups, an aromatic diamine curing agent containing asymmetric chemical structures with different reactivity and an inorganic powder; printed circuits; controlling the thickness; workability |
| 09/30/2003 | US6627544 Method of making a metal film pattern |
| 09/30/2003 | US6627483 Method for mounting an electronic component |
| 09/30/2003 | US6627118 Ni alloy particles and method for producing same, and anisotropic conductive film |
| 09/30/2003 | US6627092 Method for the fabrication of electrical contacts |
| 09/30/2003 | US6627091 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
| 09/30/2003 | US6627021 Method of manufacturing laminated ceramic electronic component and method of manufacturing laminated inductor |
| 09/30/2003 | US6627020 Method for sinter distortion control |
| 09/30/2003 | US6626680 Wire bonding surface |
| 09/30/2003 | US6626656 Apparatus for encasing array packages |
| 09/30/2003 | US6626518 Bending a tab flex circuit via cantilevered leads |
| 09/30/2003 | US6626196 Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing |
| 09/30/2003 | US6626106 Cleaning apparatus in a stencil printer |
| 09/30/2003 | US6626099 Partial printing process and apparatus |
| 09/30/2003 | US6626097 Apparatus for dispensing material in a printer |
| 09/30/2003 | US6625883 Method for making a bump structure |
| 09/30/2003 | US6625881 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards |
| 09/30/2003 | US6625880 Method for producing printed wiring board |
| 09/30/2003 | US6625857 Method of forming a capacitive element |
| 09/30/2003 | CA2283150C Printed circuit board for electrical devices having rf components, particularly for mobile radio telecommunication devices |
| 09/25/2003 | WO2003079743A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 09/25/2003 | WO2003079499A1 Plug for connection strips and method for the production thereof |
| 09/25/2003 | WO2003079495A1 Flexible good conductive layer and anisotropic conductive sheet comprising same |
| 09/25/2003 | WO2003079110A1 Method for producing micro probe tips |
| 09/25/2003 | WO2003078494A1 Curable resins and curable resin compositions containing the same |
| 09/25/2003 | WO2003078353A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate |
| 09/25/2003 | WO2003078153A2 Lamination of high-layer-count substrates |
| 09/25/2003 | WO2003078115A1 Punching machine |
| 09/25/2003 | WO2003007670B1 Method for manufacturing ceramic multilayer circuit board |
| 09/25/2003 | WO2002098598A3 Improved solder printing method |
| 09/25/2003 | US20030182180 Certification method for manufacturing process |
| 09/25/2003 | US20030181537 Process for producing dielectric layers by using multifunctional carbosilanes |
| 09/25/2003 | US20030181104 Grouped element transmission channel link termination assemblies |
| 09/25/2003 | US20030181097 Connector and fixing structure of connector and board |
| 09/25/2003 | US20030181080 Guide insert for PCI connector receptacle |
| 09/25/2003 | US20030181071 Separable electrical interconnect with anisotropic conductive elastomer and a rigid adapter |
| 09/25/2003 | US20030181046 Inhibiting removal of silicon dioxide during metal layer removal by bonding with organic polymer |
| 09/25/2003 | US20030181038 Process and apparatus for manufacturing printed circuit boards |
| 09/25/2003 | US20030180987 Stacked die package |
| 09/25/2003 | US20030180664 Photoimageable, aqueous acid soluble polyimide polymers |
| 09/25/2003 | US20030180512 Circuit board and method of manufacturing the same |
| 09/25/2003 | US20030180510 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board |
| 09/25/2003 | US20030180508 Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
| 09/25/2003 | US20030180451 Using writing tools; low temperature substrate; oxidation and electromigration resistance |
| 09/25/2003 | US20030180448 Multialyer patterned printed circuit; applying solution of metal compound, drying, applying laser radiation |
| 09/25/2003 | US20030180010 Optical module |
| 09/25/2003 | US20030179741 High-speed router with single backplane distributing both power and signaling |
| 09/25/2003 | US20030179559 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
| 09/25/2003 | US20030179558 Transmission line with integrated connection pads for circuit elements |
| 09/25/2003 | US20030179557 Process and apparatus for manufacturing printed circuit boards |
| 09/25/2003 | US20030179552 Printed circuit board and method of producing the same |
| 09/25/2003 | US20030179551 Circuit board connection structure, method for forming the same, and display device having the circuit board connection structure |
| 09/25/2003 | US20030179548 Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 09/25/2003 | US20030179532 High-speed electrical router backplane with noise-isolated power distribution |
| 09/25/2003 | US20030179158 Wiring substrate connected structure, and display device |
| 09/25/2003 | US20030179055 System and method of providing highly isolated radio frequency interconnections |
| 09/25/2003 | US20030179050 Grouped element transmission channel link with power delivery aspects |
| 09/25/2003 | US20030179049 Passive transmission line equalization using circuit-board thru-holes |
| 09/25/2003 | US20030178726 Semiconductor device built-in multilayer wiring board and method of manufacturing same |
| 09/25/2003 | US20030178725 Multi-piece substrate and method of manufacturing the substrate |
| 09/25/2003 | US20030178724 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same |
| 09/25/2003 | US20030178722 Molded substrate stiffener with embedded capacitors |
| 09/25/2003 | US20030178713 Wiring board, method for manufacturing wiring board and electronic component using wiring board |
| 09/25/2003 | US20030178708 Leadframe and method for manufacturing resin-molded semiconductor device |
| 09/25/2003 | US20030178691 Wing-shaped surface mount package for light emitting diodes |
| 09/25/2003 | US20030178477 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
| 09/25/2003 | US20030178476 Solder paste, electronic -component assembly and soldering method |
| 09/25/2003 | US20030178473 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |