| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/08/2004 | US20040005443 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| 01/08/2004 | US20040005412 Organometallic precursor mixture for forming metal alloy pattern and method of forming metal alloy pattern using the same |
| 01/08/2004 | US20040005109 Optoelectronic packaging substrate and production method of the same |
| 01/08/2004 | US20040004823 COF flexible printed wiring board and method of producing the wiring board |
| 01/08/2004 | US20040004816 Method for waterproofing power circuit section and power module |
| 01/08/2004 | US20040004808 Electronic control device |
| 01/08/2004 | US20040004293 Semiconductor package |
| 01/08/2004 | US20040004292 Non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads. |
| 01/08/2004 | US20040004285 BGA substrate via structure |
| 01/08/2004 | US20040004280 Semiconductor device and system having semiconductor device mounted thereon |
| 01/08/2004 | US20040004216 Test assembly including a test die for testing a semiconductor product die |
| 01/08/2004 | US20040004001 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry |
| 01/08/2004 | US20040003999 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
| 01/08/2004 | US20040003943 Multilayer circuit board and method of manufacturing the same |
| 01/08/2004 | US20040003942 System and method for minimizing a loading effect of a via by tuning a cutout ratio |
| 01/08/2004 | US20040003941 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 01/08/2004 | US20040003940 Resin core layer; laser-etched openings penetrating through the cover layer, correspond in position to the bond pads, allowing the bond pads to be exposed via the openings, and the cover layer is made of a second resin |
| 01/08/2004 | US20040003908 Method of making an integrated mold product |
| 01/08/2004 | US20040003891 Apparatus and method for application of adhesive substances to objects |
| 01/08/2004 | US20040003882 Method and composition for mounting an electronic component and device formed therewith |
| 01/08/2004 | US20040003734 Method and apparatus for printing using an electrically conductive ink |
| 01/08/2004 | US20040003496 Interposer to couple a microelectronic device package to a circuit board |
| 01/08/2004 | US20040003494 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 01/08/2004 | DE10325569A1 IC Karte und Verfahren zu ihrer Herstellung IC card and processes for their preparation |
| 01/08/2004 | DE10243961A1 Metallfüllverfahren und Gegenstand aufweisend metallgefüllte Löcher Metallfüllverfahren and article comprising metal-filled holes |
| 01/08/2004 | DE10235234B3 Vorrichtung zum Halten und Positionieren eines Substrats in einer Laserbearbeitungsmaschine Device for holding and positioning a substrate in a laser processing machine |
| 01/08/2004 | DE10227649A1 Plattenpresse Platen press |
| 01/08/2004 | DE10227362A1 Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen Complexing agents for the treatment of metal and plastic surfaces |
| 01/08/2004 | DE10224057A1 Kontaktverbindung und Verfahren zu deren Herstellung Contact compound and processes for their preparation |
| 01/08/2004 | CA2489313A1 Releasable protective insulating layers for substrates |
| 01/07/2004 | EP1379113A2 Circuit board with a conductive reinforcement element |
| 01/07/2004 | EP1378347A1 Method for reducing shrinkage during sintering low-temperature ceramic |
| 01/07/2004 | EP1378346A1 High polymer plate and conductive plate connecting body, and part using the connecting plate |
| 01/07/2004 | EP1378309A2 Soldering apparatus, and agent and method for seperating solder and solder oxides |
| 01/07/2004 | EP1378295A2 Resin coated carrier fabrication method and the related apparatus for the fabrication |
| 01/07/2004 | EP1378152A2 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 01/07/2004 | EP1378151A1 Connecting method for structure with implantable electrodes |
| 01/07/2004 | EP1378150A1 Retainer element for electrical components for assembly on circuit supports |
| 01/07/2004 | EP1378025A1 Circuit board connector |
| 01/07/2004 | EP1377992A1 Component with a winding support for assembly on a circuit support |
| 01/07/2004 | EP1377984A1 Conductive paste, article produced therewith with a conductive coating on glass, ceramics or enameled steel and method for the production thereof |
| 01/07/2004 | EP1377696A1 Back-end metallisation process |
| 01/07/2004 | EP1377638A1 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 01/07/2004 | EP1377407A1 Solder and solder connection |
| 01/07/2004 | EP1218178B1 An adhesion promoting layer for use with epoxy prepregs |
| 01/07/2004 | EP1097478B9 Semiconductor component in a chip format and method for the production thereof |
| 01/07/2004 | CN2598184Y Conducting terminal and electric connector using same |
| 01/07/2004 | CN2598183Y Conducting terminal and electric connector using same |
| 01/07/2004 | CN2598181Y Conducting terminal and electric connector using same |
| 01/07/2004 | CN2598171Y Printed board welding type cable connector |
| 01/07/2004 | CN1466861A Flexible wiring boards for double-side connection |
| 01/07/2004 | CN1466777A Semiconductor element and method of manufacturing and multi-layer printed circuit board and mfg. method |
| 01/07/2004 | CN1466706A Photosensitive resin composition |
| 01/07/2004 | CN1466679A Electronic transformer/inductor device and methods for making same |
| 01/07/2004 | CN1466517A Copper foil for high-density ultrafine wiring board |
| 01/07/2004 | CN1466410A Printed circuit board connection method |
| 01/07/2004 | CN1465447A Method and apparatus for making carrir of pressure sensitive adhesive |
| 01/07/2004 | CN1134209C Method for forming metallized pattern on top surface of printed circuit board |
| 01/07/2004 | CN1134064C Carrier element for semiconductor chip |
| 01/07/2004 | CN1134063C Assembly consisting of substrate for power components and cooling element and method for production thereof |
| 01/07/2004 | CN1134056C Device and method for producing chip-substrate connection |
| 01/07/2004 | CN1134052C Electric structure and making method |
| 01/07/2004 | CN1133912C Motherboard of computer |
| 01/07/2004 | CN1133507C Coating method and device for flater-plater coated material |
| 01/06/2004 | US6675368 Apparatus for and method of preparing pattern data of electronic part |
| 01/06/2004 | US6675313 Method and apparatus for reducing signal timing skew on a printed circuit board |
| 01/06/2004 | US6674651 Electronic equipment and board insertion/removal apparatus therefor |
| 01/06/2004 | US6674647 Low or no-force bump flattening structure and method |
| 01/06/2004 | US6674645 High frequency signal switching unit |
| 01/06/2004 | US6674644 Module and connector having multiple contact rows |
| 01/06/2004 | US6674347 Multi-layer substrate suppressing an unwanted transmission mode |
| 01/06/2004 | US6674344 Electronic device |
| 01/06/2004 | US6674338 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure |
| 01/06/2004 | US6674291 Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom |
| 01/06/2004 | US6674155 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 01/06/2004 | US6674053 Electrical, thin film termination |
| 01/06/2004 | US6674018 Grounding terminal and mounting structure of the same on a printed circuit board |
| 01/06/2004 | US6674017 Multilayer-wiring substrate and method for fabricating same |
| 01/06/2004 | US6674015 Multi-layer interconnection board |
| 01/06/2004 | US6674008 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 01/06/2004 | US6673858 Thermosetting adhesive material |
| 01/06/2004 | US6673723 Circuit board and a method for making the same |
| 01/06/2004 | US6673710 Method of connecting a conductive trace and an insulative base to a semiconductor chip |
| 01/06/2004 | US6673690 Method of mounting a passive component over an integrated circuit package substrate |
| 01/06/2004 | US6673471 Corrosion prevention for CAC component |
| 01/06/2004 | US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/06/2004 | US6673426 Transfer body and method using the same |
| 01/06/2004 | US6673388 Depositing and patterning metallo-organic and liquid dielectric material components, decomposing with laser light to evaporate the liquid and cause the metallic portion to react with oxygen |
| 01/06/2004 | US6673386 Jetting out the electrically charged particles through nozzle by electrostatic force; fixing; liquid crystals |
| 01/06/2004 | US6673310 Solder material, device using the same and manufacturing process thereof |
| 01/06/2004 | US6673227 Seeding; solvent selective removal |
| 01/06/2004 | US6673194 Method and apparatus for surface processing of printed wiring board |
| 01/06/2004 | US6673190 Lasable bond-ply materials for high density printed wiring boards |
| 01/06/2004 | US6673180 Multilayered ceramic substrate production method |
| 01/06/2004 | US6673134 Introducing a copper slurry having fine granular copper particles having an average particle size of 3 to 5 mu m dispresed in water into a medium type agitation mill and flattening the fine copper powder |
| 01/06/2004 | US6672912 Discrete device socket and method of fabrication therefor |
| 01/06/2004 | US6672901 Housing for plug-connected electrical component and method of mounting such a housing on a printed circuit board |
| 01/06/2004 | US6672883 Electrical junction box for a vehicle |
| 01/06/2004 | US6672879 Transfer film for use with a flexible circuit compression connector |
| 01/06/2004 | US6672875 Spring interconnect structures |