| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/06/2004 | US6672500 Method for producing a reliable solder joint interconnection |
| 01/06/2004 | US6671951 Printed wiring board, and method and apparatus for manufacturing the same |
| 01/06/2004 | US6671950 Forming high frequence stable, high via density device |
| 01/06/2004 | US6671949 Multilayer printed wiring board and method for manufacturing same |
| 01/06/2004 | US6671948 Interconnection method using an etch stop |
| 01/06/2004 | US6671940 Method and apparatus for manufacturing electronic parts |
| 01/06/2004 | CA2245542C Composition exhibiting improved fluorescent response |
| 01/06/2004 | CA2099232C Fluoro taxols |
| 01/02/2004 | EP1377146A2 Process for manufacturing a planar circuit support |
| 01/02/2004 | EP1377145A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board |
| 01/02/2004 | EP1377144A2 Method of mounting a leadless package and structure therefor |
| 01/02/2004 | EP1377143A2 Method of producing electronic unit of radio system and electronic unit |
| 01/02/2004 | EP1377142A2 Method of producing electronic unit of radio system automatically, electronic unit of radio system and electronic component used for its production |
| 01/02/2004 | EP1377141A2 Printed circuit board, method for producing same and semiconductor device |
| 01/02/2004 | EP1376778A2 Ground connector assembly with substrate strain relief and method of making the same |
| 01/02/2004 | EP1376763A1 Electrical connector with strain relief and method of securing an electrical connector to a substrate |
| 01/02/2004 | EP1376414A2 Method and apparatus for verifying circuit board design |
| 01/02/2004 | EP1376234A1 Method for forming metal pattern |
| 01/02/2004 | EP1376212A1 Display cell, in particular comprising liquid crystals, or photovoltaic cell comprising connection means to a driver circuit |
| 01/02/2004 | EP1376180A2 Light-reception/emission module with optical and electrical wiring combined therein, method for producing the module, and assembled member including the module |
| 01/02/2004 | EP1375699A1 Method for forming metal pattern |
| 01/02/2004 | EP1375595A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 01/02/2004 | EP1375134A1 Releasing laminated film |
| 01/02/2004 | EP1375128A2 Method for producing a spreaded metal plastic foil bound and produdec substrate |
| 01/02/2004 | EP1374654A1 Heat sink |
| 01/02/2004 | EP1374297A2 Flip chip interconnection using no-clean flux |
| 01/02/2004 | EP1374255A1 Composition for filling through-holes in printed wiring boards |
| 01/02/2004 | EP1373596A2 Forming a conductor circuit on a substrate |
| 01/02/2004 | EP1035940B1 Apparatus for dispensing materials on a substrate |
| 01/02/2004 | EP0934614B1 Vehicle power distribution box |
| 01/02/2004 | EP0872099B1 A method and device to fasten a loudspeaker to a circuit board |
| 01/02/2004 | EP0710432B1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products |
| 01/01/2004 | US20040003358 Methods and apparatus for verifying circuit board design |
| 01/01/2004 | US20040002257 Jump wire structure |
| 01/01/2004 | US20040002227 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device |
| 01/01/2004 | US20040002206 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 01/01/2004 | US20040001961 Dry films; reducing dielectric interface |
| 01/01/2004 | US20040001958 Wear resistance; reducing deposit residues; masking, pretreatment with release agents, lamination; removal by stripping |
| 01/01/2004 | US20040001957 Surface treatment; ion exchnaging; cladding coating with metal; heating, transferring to substrate |
| 01/01/2004 | US20040001914 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 01/01/2004 | US20040001661 Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module |
| 01/01/2004 | US20040001325 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/01/2004 | US20040001319 Circuit-constituting member and circuit unit |
| 01/01/2004 | US20040000979 Multilayer stripline radio frequency circuits and interconnection methods |
| 01/01/2004 | US20040000711 Insitu-cooled electrical assemblage |
| 01/01/2004 | US20040000710 Printed circuit board and fabrication method thereof |
| 01/01/2004 | US20040000708 Memory expansion and chip scale stacking system and method |
| 01/01/2004 | US20040000707 Modularized die stacking system and method |
| 01/01/2004 | US20040000704 Process for grid array assembly and electronic device made thereby |
| 01/01/2004 | US20040000584 Carriers for printed circuit board marking |
| 01/01/2004 | US20040000580 Forming solder structure with exterior tin oxide layer over under bump metallurgy; exposure to hydrogen, carbon tetrafluoride, and/or sulfur tetrafluoride; heating and cooling semiconductor |
| 01/01/2004 | US20040000579 Forming contact arrays on substrates |
| 01/01/2004 | US20040000489 Electrochemistry; forming three-dimensional multilayer structures; measurement voltage profile |
| 01/01/2004 | US20040000429 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus |
| 01/01/2004 | US20040000428 Socketless package to circuit board assemblies and methods of using same |
| 01/01/2004 | US20040000427 Process for creating vias for circuit assemblies |
| 01/01/2004 | US20040000426 Process for creating holes in polymeric substrates |
| 01/01/2004 | US20040000425 Methods for fabricating three-dimensional all organic interconnect structures |
| 01/01/2004 | US20040000371 Embedded metallic deposits |
| 01/01/2004 | US20040000355 Solder powder mixed with flux; vaporization in presence of solvent; thixotropic agent; storage stability |
| 01/01/2004 | US20040000049 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 01/01/2004 | US20040000047 Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as in PCB manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby |
| 12/31/2003 | WO2004002204A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 12/31/2003 | WO2004002203A1 Circuit board device and method for board-to-board connection |
| 12/31/2003 | WO2004001906A1 Connection device for flexible circuit |
| 12/31/2003 | WO2004001904A2 Stabilized wire bonded electrical connections and method of making same |
| 12/31/2003 | WO2004001807A2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| 12/31/2003 | WO2004001773A2 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 12/31/2003 | WO2004001495A2 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit |
| 12/31/2003 | WO2004001099A2 Complexing agent for treating metallic and plastic surfaces |
| 12/31/2003 | WO2004000850A1 Dicopper(i)oxalate complexes for use as precursor substances in metallic copper deposition |
| 12/31/2003 | WO2004000500A1 Method and apparatus for supporting a substrate |
| 12/31/2003 | WO2003088347A3 Method for connecting substrates and composite element |
| 12/31/2003 | WO2003075623A3 Digital application of protective soldermask to printed circuit boards |
| 12/31/2003 | WO2003038146A3 High resolution patterning method |
| 12/31/2003 | WO2002063682A3 Lithographic type microelectronic spring structures with improved contours |
| 12/31/2003 | WO2002056123A3 Incremental step drilling system and method |
| 12/31/2003 | CN2596714Y Clamp for mounting parts on circuit board |
| 12/31/2003 | CN2596713Y 电路板维修固定夹具 Circuit board repair the fixture |
| 12/31/2003 | CN1465220A Method for manufacturing multilayer wiring board |
| 12/31/2003 | CN1465219A Method for producing multilayer wiring circuit board |
| 12/31/2003 | CN1465218A Method and material for manufacturing circuit formed substrate |
| 12/31/2003 | CN1465217A Method for manufacturing ceramic multilayer circuit board |
| 12/31/2003 | CN1465216A Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| 12/31/2003 | CN1465215A Circuit board, circuit board use member and production method therefor and method of laminating fexible film |
| 12/31/2003 | CN1465214A Circuit module |
| 12/31/2003 | CN1465213A Circuit formed substrate and method of manufacturing circuit formed substrate |
| 12/31/2003 | CN1465099A Power module and air conditioner |
| 12/31/2003 | CN1465098A Semiconductor device and its manufacturing method |
| 12/31/2003 | CN1465076A Method for producing nanocomposite magnet using atomizing method |
| 12/31/2003 | CN1465075A Production method for conductive paste and production method for printed circuit board |
| 12/31/2003 | CN1464996A Resist curable resin composition and cured article thereof |
| 12/31/2003 | CN1464919A Surface treatment for copper foil |
| 12/31/2003 | CN1464838A Capacitor layer forming both side copper clad laminated heet and production method therefor |
| 12/31/2003 | CN1464837A Laminate and its producing method |
| 12/31/2003 | CN1464829A Method and device for forming module electronic component and module electronic component |
| 12/31/2003 | CN1464769A Radiating structure of lead frame package and method for improving radiating performance of the same package |
| 12/31/2003 | CN1464768A Method for making printed circuit membrane of water-proof keyboard |
| 12/31/2003 | CN1464767A Method for making base plate conducting hole and wiring of circuit using printing mode |
| 12/31/2003 | CN1464018A Conductive binding agent, multiplayer printed circuit board and process for making the latter |