Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2003
12/04/2003WO2003064495A3 Planarized microelectronic substrates
12/04/2003WO2003030186A3 Nickel coated copper as electrodes for embedded passive devices
12/04/2003WO2003017722A3 Micro-electro mechanical system and method of making
12/04/2003WO2002086910A3 A method and system for forming electrically conductive pathways
12/04/2003US20030224627 Probe card, probe card manufacturing method, and contact
12/04/2003US20030224568 Method of fabricating capacitor
12/04/2003US20030224558 Method and system for assembling a printed circuit board using a land grid array
12/04/2003US20030224555 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
12/04/2003US20030224266 High-precision that can perform the design, testing, and formation of wiring easily and at high speed, can reduce the cost involved in the formation and design, can accommodate further miniaturization, and can cope with design changes.
12/04/2003US20030224199 Metal/ceramic bonding article and method for producing same
12/04/2003US20030224197 Solder
12/04/2003US20030224187 Surface of the polyimide film contacting with the metal seed layer is modified so as to have a thickness of not more than 200 Angstrom; copper plated layer over seed layer
12/04/2003US20030224177 Epoxy resin composition
12/04/2003US20030224152 Conductive film forming composition, conductive film, and method for forming the same
12/04/2003US20030223210 Modular LED circuit board
12/04/2003US20030223207 Laminated substrate structure composed of a plurality of dielectric layers and a plurality of circuit layers stacked with each other. Each of the dielectric layers has a plurality of via studs, and the circuit layers are electrically coupled
12/04/2003US20030223206 Connection structure for radio frequency circuit that exceeds in RF characteristics
12/04/2003US20030223205 Method of producing an electronic device and electronic device
12/04/2003US20030223204 Electronic apparatus, printed wiring board, and connector fixing method
12/04/2003US20030223203 Method of mounting a butterfly package on a PCB
12/04/2003US20030223202 Electronic circuit board
12/04/2003US20030222738 Miniature RF and microwave components and methods for fabricating such components
12/04/2003US20030222668 Micro-fabrication forms a plurality of stiff vertical micro probes on the front surface of a ceramic substrate and a plurality of contacts on the back surface of the ceramic substrate. Photolithography, various etching technologies and
12/04/2003US20030222667 Probe card assembly
12/04/2003US20030222379 Method of manufacturing metal clad laminate for printed circuit board
12/04/2003US20030222343 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
12/04/2003US20030222340 Enhancement of current-carrying capacity of a multilayer circuit board
12/04/2003US20030222335 Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production
12/04/2003US20030222314 High capacitance package substrate
12/04/2003US20030222282 Direct-connect signaling system
12/04/2003US20030222126 Method of manufacturing semiconductor device
12/04/2003US20030222125 Solder printing using a stencil having a reverse-tapered aperture
12/04/2003US20030222124 Radio wave soldering method for semiconductor device
12/04/2003US20030222051 Process for forming printed circuit film used in waterproof keyboard
12/04/2003US20030221969 Copper sulfate plating bath is used which contains a polyether containing at least five ether oxygen atoms in molecule, and a compound represented by formula of R1-S-(CH2O)n-R2-SO3M (wherein, R1 is a hydrogen atom, -(S)n-(CH2O)n-R2-SO3M, or
12/04/2003US20030221967 Filling is provided, wherein after flash plating, a PPR current is applied for a cycle of 1 to 50 msec positive electrolysis time and 0.2 to 5 msec reverse electrolysis time until an F/R ratio representing the ratio of positive
12/04/2003US20030221966 A patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC
12/04/2003US20030221864 Printed board assembly and method of its manufacture
12/04/2003US20030221853 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
12/04/2003US20030221748 Solder paste flux system
12/04/2003US20030221314 Method for manufacturing double-sided circuit board
12/04/2003DE19934709C2 Kontaktelement zum Einpressen in ein Loch einer Leiterplatte Contact element for pressing into a hole of a printed circuit board
12/04/2003CA2487294A1 Method for patterning carbon nanotube coating and carbon nanotube wiring
12/04/2003CA2485185A1 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
12/04/2003CA2484794A1 Glass material for use at high frequencies
12/03/2003EP1367879A2 Electrical device
12/03/2003EP1367876A1 Wiring carrier including manufacturing process and electrical device equipped with the same
12/03/2003EP1367875A1 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method
12/03/2003EP1367874A2 Printed circuit board having permanent solder mask
12/03/2003EP1367873A1 Process of producing printed circuit boards and the circuit boards formed thereby
12/03/2003EP1367872A2 Laser-activated dielectric material and method for using the same in an electroless deposition process
12/03/2003EP1367871A2 Wiring forming system and wiring forming method for forming wiring on wiring board
12/03/2003EP1367870A1 Holding device for light emitting diode for vehicle signaling system and method of making the same
12/03/2003EP1367869A2 Radio frequency circuit connection structure
12/03/2003EP1367668A1 Broadband microstrip to waveguide transition on a multilayer printed circuit board
12/03/2003EP1367614A1 Fastening device for toroidal choke coil
12/03/2003EP1367533A2 Uncovering device for uncovering of electrically conductive materials in non-conductive supports and method for controlling the uncovering device
12/03/2003EP1367443A2 Exposure apparatus
12/03/2003EP1366927A1 Thermal transfer of microstructured layers
12/03/2003EP1366544A1 Method and system for connecting a cable to a circuit board
12/03/2003EP1366511A1 Metal pattern formation
12/03/2003EP1366313A1 Mechatronic transmission control
12/03/2003EP1366207A1 Plating method of metal film on the surface of polymer
12/03/2003EP1366124A1 Conductive coating composition
12/03/2003EP1080603B1 Apparatus having an electroacoustic transducer mounted on a p.c. board with the aid of a holding means
12/03/2003CN2590327Y Circuit board frame type clamp having plate bending prevention pressure points
12/03/2003CN1460398A Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board and metal sheet for producing wiring board
12/03/2003CN1460397A High-frequency module
12/03/2003CN1460312A Demountable clamping for land grid array connectors
12/03/2003CN1460308A 微波电路 Microwave Circuits
12/03/2003CN1460135A Back-end metallisation process
12/03/2003CN1460069A Heat lamination of dry photoresist film onto board for printed circuit
12/03/2003CN1460000A Patterning process of circuit base board
12/03/2003CN1459854A Welding spot structure for increasing packing reliability
12/03/2003CN1459838A Loading plate manufacturing process for packaging using stacking type photoresist image transfer
12/03/2003CN1459405A Stripping film
12/03/2003CN1459372A Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device
12/03/2003CN1459366A Forming part, injection moulding method and device
12/03/2003CN1459352A Ink jet printer head and method and device for welding flexible printed circuit wire of printer head
12/03/2003CN1129981C Improved connector scheme for power pod power delivery system
12/02/2003US6658375 Compensation model and registration simulation apparatus and method for manufacturing of printed circuit boards
12/02/2003US6657849 Formation of an embedded capacitor plane using a thin dielectric
12/02/2003US6657767 Rearview mirror assembly construction
12/02/2003US6657707 Metallurgical inspection and/or analysis of flip-chip pads and interfaces
12/02/2003US6657697 Liquid crystal display device having an improved attachment structure of a chip component
12/02/2003US6657606 Liquid crystal display device having a flexible circuit board
12/02/2003US6657450 Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes
12/02/2003US6657377 Cylindrical electrical component having two electrodes on bottom face
12/02/2003US6657313 Dielectric interposer for chip to substrate soldering
12/02/2003US6657295 Multilayer interconnect board and multilayer semiconductor device
12/02/2003US6657292 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device
12/02/2003US6657208 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method
12/02/2003US6657159 Method for laser drilling
12/02/2003US6657137 Connection structure and connection method of for connecting two circuit boards
12/02/2003US6657136 Termination board for mounting on circuit board
12/02/2003US6657135 Connection structure and electronic circuit board
12/02/2003US6657134 Stacked ball grid array
12/02/2003US6657133 Ball grid array chip capacitor structure
12/02/2003US6657131 I/C package / thermal-solution retention mechanism with spring effect
12/02/2003US6657124 Advanced electronic package
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