| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/17/2003 | CN1462236A Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them |
| 12/17/2003 | CN1462227A Method for deburring in punching operation and method of manufacturing punched product |
| 12/17/2003 | CN1462173A Manufacturing method of multilayer printed circuit board |
| 12/17/2003 | CN1462172A Printing circuit board having fixed antiwelding layer |
| 12/17/2003 | CN1462171A Electronic device, printed substrate and method for fixing connector |
| 12/17/2003 | CN1462088A Manufacturing method of radio circuit and radio circuit |
| 12/17/2003 | CN1462065A Wiring forming system and wiring forning method for wiring on wiring board |
| 12/17/2003 | CN1461822A Stripping lqiuid nickel or nickel alloy |
| 12/17/2003 | CN1461779A Substance for forming electrically-conducting film and electrically-conducting film and its manufacturing method |
| 12/17/2003 | CN1461773A Composition of epoxy resin |
| 12/17/2003 | CN1131576C Elastic electric interconnector with varied lateral sections |
| 12/17/2003 | CN1131563C Semiconductor assembly |
| 12/17/2003 | CN1131553C Plastic substrate with heat disspation function for package and its making method |
| 12/17/2003 | CN1131122C Laser Holing device and two-step holing method |
| 12/16/2003 | US6665194 Semiconductor package able to accommodate a large number of connections with improved electrical characteristics |
| 12/16/2003 | US6665193 Electronic circuit construction, as for a wireless RF tag |
| 12/16/2003 | US6665192 Synthetic resin capping layer on a printed circuit |
| 12/16/2003 | US6665170 Light emitting diode illumination system |
| 12/16/2003 | US6665164 Surface mountable over-current protecting apparatus |
| 12/16/2003 | US6665025 Liquid crystal display device and a method for manufacturing a grounding device |
| 12/16/2003 | US6664944 Rear electrode structures for electrophoretic displays |
| 12/16/2003 | US6664942 Signal transmission film and a liquid crystal display panel having the same |
| 12/16/2003 | US6664874 Mounting structure of high-frequency wiring board |
| 12/16/2003 | US6664864 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same |
| 12/16/2003 | US6664649 Lead-on-chip type of semiconductor package with embedded heat sink |
| 12/16/2003 | US6664647 Semiconductor device and a method of manufacturing the same |
| 12/16/2003 | US6664645 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 12/16/2003 | US6664637 Flip chip C4 extension structure and process |
| 12/16/2003 | US6664625 Mounting structure of a semiconductor device |
| 12/16/2003 | US6664622 Header for electronic components board in surface mount and through-hole assemble |
| 12/16/2003 | US6664620 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 12/16/2003 | US6664502 Workpiece holder with multiple recesses to further support workpiece in parallel laser drilling |
| 12/16/2003 | US6664485 Full additive process with filled plated through holes |
| 12/16/2003 | US6664484 Components with releasable leads |
| 12/16/2003 | US6664483 Electronic package with high density interconnect and associated methods |
| 12/16/2003 | US6664482 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges |
| 12/16/2003 | US6664481 Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 12/16/2003 | US6664480 Singulation methods and substrates for use with same |
| 12/16/2003 | US6664479 Flexible printed circuit board |
| 12/16/2003 | US6664131 Method of making ball grid array package with deflectable interconnect |
| 12/16/2003 | US6664128 Bump fabrication process |
| 12/16/2003 | US6664127 Manufacturing highly dense multi-layer printed wiring board by using laser drilling. |
| 12/16/2003 | US6664029 Method of forming pattern |
| 12/16/2003 | US6664027 Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
| 12/16/2003 | US6664001 Layered substrate with battery |
| 12/16/2003 | US6663980 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame |
| 12/16/2003 | US6663946 Multi-layer wiring substrate |
| 12/16/2003 | US6663915 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate |
| 12/16/2003 | US6663799 For use in electrical connection between circuit devices and electrical connection between wirings in a circuit device |
| 12/16/2003 | US6663786 Structure having embedded flush circuitry features and method of fabricating |
| 12/16/2003 | US6663761 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same |
| 12/16/2003 | US6663741 Stabilization of electrical and electronic apparatus using pressure sensitive adhesives comprising acrylic polymers on substrates, then cutting the lamination, peeling the chips and cooling; stress relieving |
| 12/16/2003 | US6663740 Manufacturing method and manufacturing apparatus of thin-film laminate |
| 12/16/2003 | US6663712 Dual track stenciling system with solder gathering head |
| 12/16/2003 | US6663509 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core |
| 12/16/2003 | US6663442 High speed interconnect using printed circuit board with plated bores |
| 12/16/2003 | US6663414 Lead wire-processing structure |
| 12/16/2003 | US6663400 Wiring board having connector and method of manufacturing the same |
| 12/16/2003 | US6663399 Surface mount attachable land grid array connector and method of forming same |
| 12/16/2003 | US6662841 Low profile vacuum press |
| 12/16/2003 | US6662812 Method for acoustic and vibrational energy for assisted drying of solder stencils and electronic modules |
| 12/16/2003 | US6662673 Linear motion apparatus and associated method |
| 12/16/2003 | US6662443 Blind via site is filled with a conductive material by electrolytic plating; laminating conductive layer to connect |
| 12/16/2003 | US6662442 Forming insulator layer having through-hole; conductive passageway formed by electroplating metal; flat conductive layer for good adhesion; accuracy |
| 12/16/2003 | US6662441 Method for making multi-layer printed circuit board registration |
| 12/16/2003 | US6662440 Z-axis electrical contact for microelectric devices |
| 12/16/2003 | US6662439 Ablating through metallic layer to form an interlacing electrode pattern; forming into an electrochemical biosensor strip |
| 12/16/2003 | US6662431 Electronic surface mount package |
| 12/16/2003 | CA2254106C Composition and method for reducing copper oxide to metallic copper |
| 12/11/2003 | WO2003103355A1 Composite multi-layer substrate and module using the substrate |
| 12/11/2003 | WO2003103354A1 Electronic module |
| 12/11/2003 | WO2003103353A1 Solder printing using a stencil having a reverse-tapered aperture |
| 12/11/2003 | WO2003103352A1 Board for printed wiring, printed wiring board, and method for manufacturing them |
| 12/11/2003 | WO2003103350A1 Conductive sheet |
| 12/11/2003 | WO2003103334A1 An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure |
| 12/11/2003 | WO2003103125A1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck |
| 12/11/2003 | WO2003102859A1 Optical reader having a plurality of imaging modules |
| 12/11/2003 | WO2003102601A1 Sensor package |
| 12/11/2003 | WO2003102277A1 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 12/11/2003 | WO2003102267A1 Method for electroless metalisation of polymer substrate |
| 12/11/2003 | WO2003101737A1 Screen printing machine having a replaceable ink jet printing unit |
| 12/11/2003 | WO2003101661A1 Solder paste flux system |
| 12/11/2003 | WO2003067604A3 Circuit system with a printed board comprising a programmable memory element |
| 12/11/2003 | WO2003049500A3 Method and device for producing an electrical strip conductor on a substrate |
| 12/11/2003 | WO2003036685A3 Method and apparatus for applying conductive ink onto semiconductor substrates |
| 12/11/2003 | WO2003023823A3 Stacking of multilayer modules |
| 12/11/2003 | WO2002057100A3 Electric heating system for a motor vehicle |
| 12/11/2003 | US20030228776 Right angle board-to-board connector with balanced impedance |
| 12/11/2003 | US20030228748 Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
| 12/11/2003 | US20030228743 Pattern forming method and pattern forming device |
| 12/11/2003 | US20030228543 Exposure, discharging, scanning; high speed forming patterns |
| 12/11/2003 | US20030228502 Resin-packaged protection circuit module for rechargeable batteries and method of making the same |
| 12/11/2003 | US20030228485 Molded article, injection molding method and apparatus |
| 12/11/2003 | US20030228049 Apparatus and method for inspecting pattern |
| 12/11/2003 | US20030227764 Method of manufacturing vehicle electric power distribution system |
| 12/11/2003 | US20030227593 Liquid crystal display device and manufacturing method of liquid crystal display device |
| 12/11/2003 | US20030227592 Wiring substrate, display device, and manufacturing method of wiring substrate |
| 12/11/2003 | US20030227083 Semiconductor package and method for packing a semiconductor |
| 12/11/2003 | US20030227077 Microelectronic package having a bumpless laminated interconnection layer |
| 12/11/2003 | US20030227066 Microelectronic packaging and methods for thermally protecting package interconnects and components |