Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2003
10/29/2003CN1452450A Device mfg. method and apparatus, device and electronic machine
10/29/2003CN1452449A Printed circuit board and method for repairing same
10/29/2003CN1452235A Coating forming method, apparatus and device, method for mfg. device and electronic apparatus
10/29/2003CN1452213A Conductive film pattern and forming method thereof, distributing substrate, electronic device, electronic machine and noncontact card medium
10/29/2003CN1452041A Substrate, connection structure and electronic apparatus
10/29/2003CN1451733A Cleaning solvent and applicator
10/29/2003CN1451504A Return soldering method
10/29/2003CN1451483A Device for forming corrosion-resistant agent layer on coductive substrate
10/29/2003CN1126245C Surface mount filter with polymer layers
10/29/2003CN1126214C IC socket
10/29/2003CN1126170C Solder terminal and making method thereof
10/29/2003CN1126168C Electronic element assembly having package material and formation method therefor
10/29/2003CN1126167C Semiconductor chip mounting board and mounting method for semiconductor chip
10/29/2003CN1126163C Film carrier tape and semiconductor device, and method for manufacturing them
10/29/2003CN1125963C Improved chemical drying and cleaning system
10/28/2003US6640332 Wiring pattern decision method considering electrical length and multi-layer wiring board
10/28/2003US6640084 Complete outdoor radio unit for LMDS
10/28/2003US6639809 Photodiode/laser mounting bracket
10/28/2003US6639785 Capacitor component
10/28/2003US6639589 Tape carrier package and a liquid crystal display panel having the same
10/28/2003US6639315 Semiconductor device and mounted semiconductor device structure
10/28/2003US6639311 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
10/28/2003US6639179 Apparatus for producing microbore holes
10/28/2003US6639177 Method and system for processing one or more microstructures of a multi-material device
10/28/2003US6639155 High performance packaging platform and method of making same
10/28/2003US6639154 Apparatus for forming a connection between a circuit board and a connector, having a signal launch
10/28/2003US6638858 Hole metal-filling method
10/28/2003US6638831 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
10/28/2003US6638790 Leadframe and method for manufacturing resin-molded semiconductor device
10/28/2003US6638785 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making
10/28/2003US6638690 Method for producing multi-layer circuits
10/28/2003US6638689 Photoresist compositions and flexible printed wiring boards with protective layer
10/28/2003US6638681 X-ray printing personalization technique
10/28/2003US6638680 Material and method for making an electroconductive pattern
10/28/2003US6638642 Copper foil excellent in laser beam drilling performance and production method therefor
10/28/2003US6638638 Hollow solder structure having improved reliability and method of manufacturing same
10/28/2003US6638607 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
10/28/2003US6638592 Ceramic/metal substrate, especially composite substrate
10/28/2003US6638438 Printed circuit board micro hole processing method
10/28/2003US6638411 Method and apparatus for plating substrate with copper
10/28/2003US6638410 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
10/28/2003US6638378 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
10/28/2003US6638374 Device produced by a process of controlling grain growth in metal films
10/28/2003US6638363 Method of cleaning solder paste
10/28/2003US6638359 Deposited film forming apparatus and deposited film forming method
10/28/2003US6638114 Sectional connector substituting for PC104 and PC104 PLUS industrial computer connectors
10/28/2003US6638082 Pin-grid-array electrical connector
10/28/2003US6638080 Integrated ball grid array-pin grid array-flex laminate test assembly
10/28/2003US6638077 Shielded carrier with components for land grid array connectors
10/28/2003US6638052 Drilling apparatus for flexible sheet made of thick thermoplastic material
10/28/2003US6637641 Systems and methods for manufacturing a circuit board
10/28/2003US6637638 System for fabricating solder bumps on semiconductor components
10/28/2003US6637637 Reflow apparatus
10/28/2003US6637326 Method and apparatus for controlling pushing pressure applied to printing material
10/28/2003US6637105 Method of manufacturing a multilayer printed wiring board
10/28/2003US6637102 Process for producing an industrial member having throughholes of high aspect ratio
10/23/2003WO2003088726A1 Fast production method for printed board
10/23/2003WO2003088725A1 Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil
10/23/2003WO2003088724A1 Circuit board and method for manufacturing the same
10/23/2003WO2003088464A1 Switching power supply unit
10/23/2003WO2003088421A1 Mounting of led devices to circuit board or ribbon
10/23/2003WO2003088370A2 Hermetic encapsulation of organic electro-optical elements
10/23/2003WO2003088356A1 Voltage variable material for direct application and devices employing same
10/23/2003WO2003088354A2 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003WO2003088347A2 Method for connecting substrates and composite element
10/23/2003WO2003088340A2 Method for the production of structured layers on substrates
10/23/2003WO2003088336A1 Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter
10/23/2003WO2003088276A1 Resistor film laminate, method for manufacturing resistor film laminate, component comprising resistor film laminate, and method for manufacturing component comprising resistor film laminate
10/23/2003WO2003087937A2 Waterborne printed circuit board coating compositions
10/23/2003WO2003087590A2 Method of self-assembly and self-assembled structures
10/23/2003WO2003087424A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003WO2003087423A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003WO2003087235A1 Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish
10/23/2003WO2003087186A1 Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
10/23/2003WO2003086958A2 Method for producing a product having a structured surface
10/23/2003WO2003059535B1 Cleaning roller device with vertical movement mechanism
10/23/2003WO2003041461A3 Method and device for treating objects by means of a liquid
10/23/2003WO2001033927A8 Inter-circuit encapsulated packaging for power delivery
10/23/2003US20030199180 Connector integrated with a LED element, method for manufacturing the same, and a LED including the same connector
10/23/2003US20030199162 System and methods for fabrication of a thin pattern
10/23/2003US20030199160 Use of palladium in IC manufacturing with conductive polymer bump
10/23/2003US20030199121 Wafer scale thin film package
10/23/2003US20030198897 Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
10/23/2003US20030198828 Flexible circuit substrate
10/23/2003US20030198824 Photocurable compositions containing reactive polysiloxane particles
10/23/2003US20030198789 Layer forming method, layer forming apparatus, device, manufacturing method for device, and electronic apparatus
10/23/2003US20030198734 System and method for curing printed circuit board coatings
10/23/2003US20030198467 Camera body, camera and method for assembling same
10/23/2003US20030198024 Expansion board apparatus and removing method
10/23/2003US20030198022 Power converter package with enhanced thermal management
10/23/2003US20030198020 Vertical surface mount apparatus with thermal carrier and method
10/23/2003US20030197827 Method for connecting a printed circuit to a liquid crystal display
10/23/2003US20030197670 Display apparatus and assembly of its driving circuit
10/23/2003US20030197463 Electron source, image forming apparatus, and manufacture method for electron source
10/23/2003US20030197289 Controlling spacings; separating detector and bonding zones
10/23/2003US20030197286 Flip-chip package containing a chip and a substrate having differing pitches for electrical connections
10/23/2003US20030197277 Semiconductor device and a method of manufacturing the same
10/23/2003US20030197264 Header for electronic components board in surface mount and through-hole assembly
10/23/2003US20030197255 Semiconductor device
10/23/2003US20030197199 Semiconductor device and semiconductor module
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