Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2003
10/07/2003US6630737 Integrated circuit package, ball-grid array integrated circuit package
10/07/2003US6630631 Apparatus and method for interconnection between a component and a printed circuit board
10/07/2003US6630630 Multilayer printed wiring board and its manufacturing method
10/07/2003US6630629 Wiring substrate
10/07/2003US6630628 High-performance laminate for integrated circuit interconnection
10/07/2003US6630627 Multilayered wiring substrate with dummy wirings in parallel to signal wirings and with
10/07/2003US6630451 Benzimidazolone peptidometics as thrombin receptor antagonist
10/07/2003US6630370 Process for manufacturing IC card
10/07/2003US6630365 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
10/07/2003US6630287 Method for forming thick film pattern and photosensitive paste used therefor
10/07/2003US6630251 Containing tin and lead with copper and/or nickel
10/07/2003US6630203 Electroless process for the preparation of particle enhanced electric contact surfaces
10/07/2003US6630036 Flux for Pb-free Sn-based alloy solders
10/07/2003US6629850 Electrical connection box for a vehicle
10/07/2003US6629848 Method for providing uniform pressure
10/07/2003US6629484 Cutter wheel for brittle sheets
10/07/2003US6629367 Punching apertures through alumina or zirconia layers, filling with curable and conductor pastes, then hardening and sintering to form monolithic structures; connecting electrical and electronic apparatus
10/07/2003US6629366 Method of producing a multilayer wiring board
10/07/2003US6629363 Process for mechanically attaching a temporary lid to a microelectronic package
10/07/2003US6629362 Method of manufacturing a circuit print board
10/07/2003US6629348 Etching polyimide surfaces than laminating and joining metal foils onto thin films comprising polyimides, polyesters, polyethers, polyanilines, copolymers or mixtures forming high density printed circuits having flexibility
10/02/2003WO2003081969A1 Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board
10/02/2003WO2003081967A1 Flexible interconnect structures for electrical devices and light sources incorporating the same
10/02/2003WO2003081966A2 Process and apparatus for manufacturing printed circuit boards
10/02/2003WO2003081725A2 A miniaturized contact spring
10/02/2003WO2003081723A1 Test and burn-in connector
10/02/2003WO2003081641A2 Support clip
10/02/2003WO2003081611A1 Surface mounting chip network component
10/02/2003WO2003081606A1 Conductive particle and adhesive agent
10/02/2003WO2003081535A1 A method for storing layers' information of a layers-made object
10/02/2003WO2003080285A1 Device and method for laser structuring functional polymers and the uses thereof
10/02/2003WO2003080282A1 Simultaneous laser soldering method
10/02/2003WO2003047037A9 Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors
10/02/2003WO2002103789A3 Electronic assembly with laterally connected capacitors and manufacturing method
10/02/2003US20030186674 High quality factor (Q) planar spiral inductor based CATV diplexer and telephony module
10/02/2003US20030186572 Self compensating design for elastomer interconnects
10/02/2003US20030186571 Electronic component and structure of terminals thereof
10/02/2003US20030186569 . Component mounting structure
10/02/2003US20030186568 Ganged land grid array socket contacts for improved power delivery
10/02/2003US20030186540 Method and apparatus for forming fine circuit interconnects
10/02/2003US20030186528 Method for producing tin/lead alloy balls for packaging semiconductors
10/02/2003US20030186527 Method for producing a contact substrate and corresponding contact substrate
10/02/2003US20030186484 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
10/02/2003US20030186476 Packaging of multiple active optical devices
10/02/2003US20030186166 Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board
10/02/2003US20030186119 Methodology for making electrical contact from a button cell battery to a printed circuit board and a process for manufacturing the same
10/02/2003US20030186072 Electron device and semiconductor device
10/02/2003US20030186068 Suitable for an electronic part such as a flexible printed wiring board
10/02/2003US20030185971 Forming suspension comprising liquid vehicle and particulate conductive material such that suspension is ink-jettable; jetting from ink-jet pen a predetermined pattern of suspension onto substrate; heating to provide conductive path
10/02/2003US20030184987 Multi-layer integrated circuit package
10/02/2003US20030184986 Circuit board and electronic device, and method of manufacturing same
10/02/2003US20030184985 Electronic device manufacturing method, electronic device and resin filling method
10/02/2003US20030184980 Circuit board with integrated circuit
10/02/2003US20030184979 Circuit board free of photo-sensitive material and fabrication method of the same
10/02/2003US20030184976 Electromagnetic interference shield for overmolded packaging of an electronic assembly
10/02/2003US20030184969 Electronic control unit
10/02/2003US20030184948 Self-leaded surface mount component holder
10/02/2003US20030183948 Golden unit
10/02/2003US20030183929 System and method for reconditioning electronic components
10/02/2003US20030183925 Semiconductor module
10/02/2003US20030183918 Tape Carrier Package
10/02/2003US20030183605 Method and equipment for welding conductors to substrates
10/02/2003US20030183598 Method of stripping silver from a printed circuit board
10/02/2003US20030183531 Methods and producing conductor layers on dielectric surfaces
10/02/2003US20030183526 Superior filling properties and superior planarization of the deposited metal layer is provided. This is achieved by a method having a F/R ratio, the ratio of the electric current densities between the forward electrolysis and the reverse
10/02/2003US20030183421 Apparatus and method for interconnection between a component and a printed circuit board
10/02/2003US20030183420 Circuit board with via through surface mount device contact
10/02/2003US20030183418 Electrical circuit and method of formation
10/02/2003US20030183416 Method of electrically coupling an electronic component to a substrate
10/02/2003US20030183406 Micro-spring interconnect systems for low impedance high power applications
10/02/2003US20030183405 Electrical circuit and substrate therefor
10/02/2003US20030183345 Low profile vacuum press
10/02/2003US20030183339 Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method
10/02/2003US20030183332 Method of adhering a component to a substrate with a controlled bondline, and to a device made by the method, including steps of providing a substrate; applying a first adhesive in a plurality of selected locations on a surface of
10/02/2003US20030183318 Shrinkage inhibition, dimemsional accuracy
10/02/2003US20030183165 Apparatus for manufacturing stacked type electronic part
10/02/2003US20030183120 Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring board
10/02/2003US20030182797 Fabrication method of circuit board
10/01/2003EP1349209A2 Surveying device for the temperature of electronic components
10/01/2003EP1349206A2 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
10/01/2003EP1348321A2 Manufacture of printed circuits using single layer processing techniques
10/01/2003EP1348320A1 Method for producing electroconductive structures
10/01/2003EP1348234A1 A method and an arrangement for providing vias in printed circuit boards
10/01/2003EP1348044A1 Device and method for electrochemically treating a band-shaped product
10/01/2003EP1256144B1 Method for contacting a printed circuit board to a conductor arranged on a support, and device
10/01/2003EP1036489B1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
10/01/2003EP0958621B1 Component holder for a hall sensor and process for producing a component holder
10/01/2003CN2577530Y Adhered film punching and cutting machine
10/01/2003CN1446317A Method and device for testing operativeness of printed circuit boards
10/01/2003CN1446248A Heat resistant resin composition, its heat resistant film or sheet and laminated product containing the film or sheet as base material
10/01/2003CN1446040A Method for fixation between electronic parts
10/01/2003CN1446039A Solder paste print deice for remnant stannum easy to be shed-off
10/01/2003CN1446038A Method for manufacturing electric resistances built in printing circuit board
10/01/2003CN1446028A Distribution base plate, electronic device, electrooptics device and electronic instrument
10/01/2003CN1445846A Chip ratio package and manufacturing method thereof
10/01/2003CN1445845A Chip ratio package and manufacturing method thereof
10/01/2003CN1445844A Chip ratio package and manufacturing method thereof
10/01/2003CN1445842A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/2003CN1445830A Method for manufacturing discrete type circuit components
10/01/2003CN1445551A Probe connecting terminal cladded with conducting wire on testing tool of printed circuit distributing board
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