Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2003
10/16/2003WO2003085697A2 Solder-bearing articles and method of retaining a solder mass thereon
10/16/2003WO2003085062A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
10/16/2003WO2003084861A2 Method of manufacturing an electronic device in a cavity with a cover
10/16/2003WO2003062311A8 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
10/16/2003WO2003062129A3 Method and apparatus for detecting a liquid spray pattern
10/16/2003WO2003052798A3 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
10/16/2003WO2003036763A3 Bending a tab flex circuit via cantilevered leads
10/16/2003WO2003036689A3 Anti-tombstoning structures and methods of manufacture
10/16/2003WO2003035281B1 Ultrasonic printed circuit board transducer
10/16/2003WO2003030248A3 Method of mounting an electronic device on a substrate by a laser beam
10/16/2003WO2002073685A3 Multi-layer circuit assembly and process for preparing the same
10/16/2003US20030196181 Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes
10/16/2003US20030195566 Protection apparatus for implantable medical device
10/16/2003US20030195330 Functionalized $g(p)-conjugated polymers, based on 3,4-alkylenedioxythiophene
10/16/2003US20030194913 Method and apparatus to pre-form two or more integrated connectorless cables in the flexible sections of rigid-flex printed circuit boards
10/16/2003US20030194845 Method for fabricting a resistor on a printed circuit board
10/16/2003US20030194655 Method for fabricating resistors on a printed circuit board
10/16/2003US20030194573 Conductor layer, an adhesive layer, and a polymer film (especially a polyimide) layer interposed between the layers; high heat resistance, a narrow pitch wiring pattern, a small-diameter via
10/16/2003US20030194485 Alloy plating solution for surface treatment of modular printed circuit board
10/16/2003US20030193793 Board-to-board electrical coupling with conductive band
10/16/2003US20030193790 Substrate, connecting structure and electronic equipment
10/16/2003US20030193788 Single-piece molded module housing
10/16/2003US20030193787 Structure of mounting flexible wiring board
10/16/2003US20030193786 Compact circuit carrier package
10/16/2003US20030193326 Test method for characterizing currents associated with powered components in an electronic system
10/16/2003US20030193286 Hermetic encapsulation of organic, electro-optical elements
10/16/2003US20030193117 Method of laser machining materials with minimal thermal loading
10/16/2003US20030193113 Apparatus and method for protecting an electronic circuit
10/16/2003US20030193094 Semiconductor device and method for fabricating the same
10/16/2003US20030193093 Dielectric interposer for chip to substrate soldering
10/16/2003US20030193092 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
10/16/2003US20030193085 Semiconductor assembly with a semiconductor module
10/16/2003US20030193042 Mixtures comprising thiophene/anion dispersions and certain additives for producing coatings exhibiting improved conductivity, and methods related thereto
10/16/2003US20030192938 Printed circuit board and restoration thereof
10/16/2003US20030192868 Method for determining the accuracy of processing machines
10/16/2003US20030192716 Printed circuit board having through-hole protected by barrier and method of manufacturing the same
10/16/2003US20030192476 Sputtered spring films with low stress anisotropy
10/16/2003US20030192182 Process for producing a multi-layer printed wiring board
10/16/2003US20030192181 Method of making an electronic contact
10/15/2003EP1353541A1 Circuit board and production method therefor
10/15/2003EP1353540A1 Production method of circuit board module
10/15/2003EP1353539A2 PWB manufacture
10/15/2003EP1353443A2 Spring contact
10/15/2003EP1353343A2 Electronic device with external terminals and method of production of the same
10/15/2003EP1353123A2 Light emitting unit, lighting unit, and method for manufacturing lighting unit
10/15/2003EP1352549A2 High-g mounting arrangement for electronic chip carrier
10/15/2003EP1352548A1 Method of forming electrically conductive elements and patterns of such elements
10/15/2003EP1351820A2 Multi-level web structure in use for thin sheet processing
10/15/2003EP1216453B1 Method for producing a chip card and chip card produced according to said method
10/15/2003EP1105950B1 Laser repetition rate multiplier
10/15/2003CN2580735Y Shielding structure for protecting from jamming by noise
10/15/2003CN2580728Y Structure of frame shape clamp
10/15/2003CN2580727Y Two edge adjustable type circuit board frame clamp
10/15/2003CN2580726Y Movable supporting edge for printed circuit board
10/15/2003CN1449499A Method and device for testing printed circuit boards with a parallel tester
10/15/2003CN1449427A Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board
10/15/2003CN1449241A Electronic-component mounting apparatus
10/15/2003CN1449234A Device and method for film base plate processing and method for film base plate moving out
10/15/2003CN1449233A Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/15/2003CN1449029A Circuit base plate, electronic machine, and and method of manufacture
10/15/2003CN1449005A Method for manufacturing semiconductor device
10/15/2003CN1448966A Manufacturing installation for multi-layered electronic parts
10/15/2003CN1448537A Nonconductor surface metallization method
10/15/2003CN1124780C Solidified glue silk-screen printing screen frame for circuit board and its processing method
10/15/2003CN1124644C Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape
10/15/2003CN1124631C High frequency switching device
10/15/2003CN1124576C Semiconductor equipment with multi-layered coductor configuration
10/15/2003CN1124520C Water-dispersible negative photosensitive composition
10/15/2003CN1124517C Method and apparatus for bonding adhesive tape of liquid crystal panel
10/15/2003CN1124367C Composition and method for stripping solder and tin from printed circuit boards
10/15/2003CN1124292C Polymeric films having controlled viscosity response to temp. and shear
10/15/2003CN1124203C Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
10/14/2003US6633490 Electronic board assembly including two elementary boards each carrying connectors on an edge thereof
10/14/2003US6633489 Dynamic isolating mount for processor packages
10/14/2003US6633488 Printed circuit board unit with correction member
10/14/2003US6633487 Method for manufacturing hybrid circuit board
10/14/2003US6633361 LCD panel in which signal line terminals have slits to allow inspection of alignment of the terminals and the TCP leads
10/14/2003US6633078 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal
10/14/2003US6633045 Assembly part with wiring and for manufacturing system, method of manufacturing such assembly part, and semiconductor manufacturing system constituted using assembly part
10/14/2003US6633021 Soldering iron with heated gas flow
10/14/2003US6633002 Tape carrier having high flexibility with high density wiring patterns
10/14/2003US6632734 Parallel plane substrate
10/14/2003US6632732 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/14/2003US6632690 Method of fabricating reliable laminate flip-chip assembly
10/14/2003US6632591 Multi-layer laminate for forming thin layer capacitors, resistors or combinations thereof comprising layers of resistive material and dielectric material layer interposed between layers of resistive material
10/14/2003US6632588 Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates
10/14/2003US6632575 Rapid, accurate alignment
10/14/2003US6632532 Particle material anisotropic conductive connection and anisotropic conductive connection material
10/14/2003US6632380 Polyanilines with metals, printed circuits, corrosion resistant coatings
10/14/2003US6632372 Method of forming via-holes in multilayer circuit boards
10/14/2003US6632345 Filling voids in noncontinuous copper seed layer to form conformal layer covering all of first layer by contacting with alkaline copper solution, electroplating copper onto seed layer in acidic copper solution to fill microrecesses
10/14/2003US6632344 Conductive oxide coating process
10/14/2003US6632343 Applying plating voltage to partially conductive printed circuit board substrate bearing metal traces, performing electrolytic plating operation on substrate, curing substrate thereby rendering it substantially nonconductive
10/14/2003US6632341 Method for producing a self-supporting metal film
10/14/2003US6632335 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
10/14/2003US6632323 Method and apparatus having pin electrode for surface treatment using capillary discharge plasma
10/14/2003US6632320 Connecting protuberant electrode of electronic component to terminal electrode of circuit board using adhesive containing curable resin and inorganic particles with specific surface area and particle sizes satisfying specified equations
10/14/2003US6632314 Method of making a lamination and surface planarization for multilayer thin film interconnect
10/14/2003US6632115 Method for forming transparent conductive film using chemically amplified resist
10/14/2003US6631838 Method for fabricating printed circuit board
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