Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2003
11/13/2003US20030211246 Printed circuits; forming patterns; multilayer
11/13/2003US20030211234 Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards
11/13/2003US20030210300 Inkjet printhead with hollow drop ejection chamber formed partly of actuator material
11/13/2003US20030209977 Thermal management in electronic displays
11/13/2003US20030209954 Electronic component and method for forming substrate electrode of the same
11/13/2003US20030209837 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
11/13/2003US20030209813 Semiconductor device and manufacturing method of the same
11/13/2003US20030209806 Method for manufacturing semiconductor device
11/13/2003US20030209799 Copper plated PTH barrels and methods for fabricating
11/13/2003US20030209798 Apparatus for providing mechanical support to a column grid array package
11/13/2003US20030209796 Manufacturing method of multilayer substrate
11/13/2003US20030209794 Card manufacturing technique and resulting card
11/13/2003US20030209790 Semiconductor memory module
11/13/2003US20030209789 Coplanar mounting member for a mem sensor
11/13/2003US20030209788 Semiconductor device with chamfered substrate and method of making the same
11/13/2003US20030209785 Semiconductor package having solder joint of improved reliability
11/13/2003US20030209732 Apparatus for routing signals
11/13/2003US20030209679 Method and program for obtaining positioning errors of printed-wiring board, and electronic-circuit-component mounting system
11/13/2003US20030209590 SMT passive device noflow underfill methodology and structure
11/13/2003US20030209585 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions
11/13/2003US20030209446 Method for enhancing the solderability of a surface
11/13/2003US20030209362 IC card and method of manufacturing the same
11/13/2003DE20220468U1 Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region
11/13/2003DE10225465C1 Ribbon cable conductors contacting method with incorporation of optical process control for ensuring contacting quality
11/13/2003DE10019713C2 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems
11/12/2003EP1361480A1 Residue reducing stable concentrate
11/12/2003EP1361034A2 Chip card and method of manufacturing a chip card
11/12/2003EP1360885A1 Element for electromagnetic shielding and method for manufacturing thereof
11/12/2003EP1360881A1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures
11/12/2003EP1360720A2 Process for the manufacture of printed circuit boards with plated resistors
11/12/2003EP1360717A1 Lead-free solder structure and method for high fatigue life
11/12/2003EP1360067A1 Lightweight circuit board with conductive constraining cores
11/12/2003EP1238446B1 An electrical contact device for interconnecting electrical components
11/12/2003EP0972432B1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations
11/12/2003EP0763228B1 Plasma addressed liquid crystal display with etched electrodes
11/12/2003CN2586332Y Tool for preventing circuit board from bended
11/12/2003CN2586331Y Carbon fiber strip lamp
11/12/2003CN2586191Y Automatic tin feeder
11/12/2003CN1456035A Circuit board and production method therefor
11/12/2003CN1456034A Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration
11/12/2003CN1456033A Method of fixing electronic part
11/12/2003CN1456032A Method for generating conductive structure on non-plane surface and use thereof
11/12/2003CN1456031A Circuit board and production method thereof
11/12/2003CN1456030A Laminating double-side circuit board and prouction method therefor and multi-layer printed circuit board using it
11/12/2003CN1455956A Circuit board and production method therefor
11/12/2003CN1455933A Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
11/12/2003CN1455889A Ultraviolet-curing resin composition and photo solder resist ink containing the same
11/12/2003CN1455719A Entry board for use in drilling small holes
11/12/2003CN1455288A Light-emitting assembly
11/12/2003CN1127782C Controlling heat expansion of electrical couplings
11/12/2003CN1127780C High density electrical connector
11/11/2003US6647311 Coupler array to measure conductor layer misalignment
11/11/2003US6647036 Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
11/11/2003US6646888 Low inductance multiple resistor EC capacitor pad
11/11/2003US6646886 Power connection structure
11/11/2003US6646884 Sandwich-structured intelligent power module
11/11/2003US6646708 Electrooptic device, manufacturing method therefor with visual confirmation of compression bonding to terminals and electronic apparatus
11/11/2003US6646662 Patterning method, patterning apparatus, patterning template, and method for manufacturing the patterning template
11/11/2003US6646622 Combination instrument
11/11/2003US6646608 Center electrode assembly, nonreciprocal circuit device, communication device, and method of producing the center electrode assembly
11/11/2003US6646533 Photolithographically-patterned out-of-plane coil structures and method of making
11/11/2003US6646521 Connection for conducting high frequency signal between a circuit and a discrete electric component
11/11/2003US6646358 Device for transferring and supporting panels
11/11/2003US6646356 Apparatus for providing mechanical support to a column grid array package
11/11/2003US6646355 Structure comprising beam leads bonded with electrically conductive adhesive
11/11/2003US6646350 Semiconductor device
11/11/2003US6646349 Ball grid array semiconductor package
11/11/2003US6646338 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
11/11/2003US6646337 Wiring circuit substrate and manufacturing method therefor
11/11/2003US6646332 Semiconductor package device
11/11/2003US6646331 Semiconductor device and semiconductor module
11/11/2003US6646325 Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same
11/11/2003US6646279 Apparatus for exposing a face of a printed circuit panel
11/11/2003US6645685 Process for producing printed wiring board
11/11/2003US6645630 Phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having particles,
11/11/2003US6645607 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
11/11/2003US6645606 Electrical device having metal pad bonded with metal wiring and manufacturing method thereof
11/11/2003US6645557 Treating surface with silver compound before plating; preferably surface is sensitized with a stanous compound before silver treatment
11/11/2003US6645549 Sheet is immersed in immersion tin solution for a time sufficient to provide a thin tin deposit operative in conjunction with the first tin deposit to enhance subsequent bonding of the sheet to an organic polymer layer
11/11/2003US6645337 Technique for partially joining copper foils and separator sheets
11/11/2003US6645297 Roll coater for coating and method of manufacturing printed wiring board employing the roll coater
11/11/2003US6644982 Method and apparatus for the transport and tracking of an electronic component
11/11/2003US6644536 Solder reflow with microwave energy
11/11/2003US6643923 Processes for manufacturing flexible wiring boards
11/11/2003US6643921 Circuit-component mounting method and circuit-component mounting system
11/11/2003US6643916 Method to assemble a capacitor plate for substrate components
11/11/2003CA2088123C Process for through-hole plating of two-layer circuit boards and multilayers
11/06/2003WO2003092347A1 Electromagnetically shielded circuit device and shielding method therefor
11/06/2003WO2003092345A1 Modified aperture for surface mount technology (smt) screen printing
11/06/2003WO2003092344A1 Production of via hole in flexible circuit printable board
11/06/2003WO2003092343A1 Connection structure between printed boards
11/06/2003WO2003092174A2 Manufacturing method for a wireless communication device and manufacturing apparatus
11/06/2003WO2003092121A2 Three dimensional, high speed back-panel interconnection system
11/06/2003WO2003092073A2 Electrical contacts for flexible displays
11/06/2003WO2003092066A1 A solder interconnection having a layered barrier structure and method for forming same
11/06/2003WO2003092054A1 Mounting method and mounting system
11/06/2003WO2003091788A2 Process for forming a patterned thin film conductive structure on a substrate
11/06/2003WO2003091477A1 Method for electroless deposition of a metal layer on selected portions of a substrate
11/06/2003WO2003091138A2 Sheeted roll and methods and apparatus for sheeting a roll
11/06/2003WO2003090987A1 Method of manufacturing ceramic laminated body
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