| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/24/2003 | CN1131883C Epoxy resin compsn. adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 12/24/2003 | CN1131777C Screen printing appts. |
| 12/24/2003 | CN1131733C Soup treatment appts. |
| 12/23/2003 | US6668067 Electroacoustic transducer |
| 12/23/2003 | US6667857 Head gimbal assembly having a flexible printed circuit |
| 12/23/2003 | US6667561 Integrated circuit capable of operating in multiple orientations |
| 12/23/2003 | US6667559 Ball grid array module and method of manufacturing same |
| 12/23/2003 | US6667556 Flip chip adaptor package for bare die |
| 12/23/2003 | US6667550 Installation structure and method for optical parts and electric parts |
| 12/23/2003 | US6667443 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 12/23/2003 | US6667256 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part |
| 12/23/2003 | US6667250 Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method |
| 12/23/2003 | US6667229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip |
| 12/23/2003 | US6667190 Method for high layout density integrated circuit package substrate |
| 12/23/2003 | US6667143 Wherein active primer is disposed between thermal transfer donor sheet and receptor to assist selective thermal transfer; binder improves adhesion |
| 12/23/2003 | US6667094 Paste for screenprinting electric structures onto carrier substrates |
| 12/23/2003 | US6667090 Coupon registration mechanism and method |
| 12/23/2003 | US6667072 Sustains surface flattening method by employing participation of porous materials such as zeolites, zeolite like, mesoporous and mesoporous composites; planarized substrate comprises ceramic substrate, buffer layer, nanostructure layer |
| 12/23/2003 | US6666994 Conductive adhesive and packaging structure using the same |
| 12/23/2003 | US6666987 Mixtures of sulfuric acid, hydrogen peroxide and 5-amino tetrazole, used for cleaning or texturing surfaces of foils to improve acid resistance and bonding strength of multilayer printed circuits laminations |
| 12/23/2003 | US6666980 Method for manufacturing a resistor |
| 12/23/2003 | US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics |
| 12/23/2003 | US6666960 Electroplating current supply system |
| 12/23/2003 | US6666729 Joint connector having plural connecting units and a joint plate |
| 12/23/2003 | US6666689 Electrical connector with interspersed entry ports for pins of different LEDs |
| 12/23/2003 | US6666392 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization |
| 12/23/2003 | US6666369 Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment |
| 12/23/2003 | US6666368 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 12/23/2003 | US6665931 Wiring method for forming conductor wire on a substrate board |
| 12/23/2003 | US6665930 Printed circuit board with SMD components |
| 12/23/2003 | CA2310711C Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
| 12/23/2003 | CA2302798C Solderless pin connection |
| 12/18/2003 | WO2003105548A1 Metallised parts made from plastic material |
| 12/18/2003 | WO2003105547A1 Plotting device and plotting method |
| 12/18/2003 | WO2003105546A1 Method and device for treating flat and flexible work pieces |
| 12/18/2003 | WO2003105545A1 Flexible printed circuit board and process for producing the same |
| 12/18/2003 | WO2003105160A1 Conductive paste, multilayer board including the conductive paste and process for producing the same |
| 12/18/2003 | WO2003105063A2 Cross-reference |
| 12/18/2003 | WO2003104901A2 Microelectronic cleaning and arc remover compositions |
| 12/18/2003 | WO2003104854A2 Long range optical reader |
| 12/18/2003 | WO2003104527A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 12/18/2003 | WO2003104526A1 Process for metallising support media made from plastic material |
| 12/18/2003 | WO2003104285A1 Resin particle, conductive particle and anisotropic conductive adhesive containing the same |
| 12/18/2003 | WO2003103965A1 Screen printing |
| 12/18/2003 | WO2003081725A3 A miniaturized contact spring |
| 12/18/2003 | WO2003078153A3 Lamination of high-layer-count substrates |
| 12/18/2003 | WO2003075337A8 Fluxless assembly of chip size semiconductor packages |
| 12/18/2003 | WO2003034636A3 High speed, controlled impedance air dielectric electronic backplane systems |
| 12/18/2003 | WO2003028103A3 Multi-stack surface mount light emitting diodes |
| 12/18/2003 | US20030233134 Biocompatible bonding method and electronics package suitable for implantation |
| 12/18/2003 | US20030233133 Biocompatible bonding method and electronics package suitable for implantation |
| 12/18/2003 | US20030232534 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member |
| 12/18/2003 | US20030232524 Low current minimal alignment compression contact system |
| 12/18/2003 | US20030232522 Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board |
| 12/18/2003 | US20030232517 Electrical connector assembly |
| 12/18/2003 | US20030232489 Methods for manufacturing a hybrid integrated circuit device |
| 12/18/2003 | US20030232462 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 12/18/2003 | US20030232193 Dry film resist and printed circuit board producing method |
| 12/18/2003 | US20030232128 Disposing a liquid containing a metal particle on the base board by a liquid ejecting section; enhance a contact between the base board and the conductive layer wiring |
| 12/18/2003 | US20030231481 Retainer for circuit board assembly and method for using the same |
| 12/18/2003 | US20030231474 PCB method and apparatus for producing landless interconnects |
| 12/18/2003 | US20030231456 Energy conditioning structure |
| 12/18/2003 | US20030231451 Component carrier |
| 12/18/2003 | US20030231099 Resistor structure |
| 12/18/2003 | US20030231088 Semiconductor device and electronic device |
| 12/18/2003 | US20030230967 Visible image receiving material, conductive pattern material and organic electroluminescence element, using member having surface hydrophilicity |
| 12/18/2003 | US20030230813 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 12/18/2003 | US20030230806 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition |
| 12/18/2003 | US20030230802 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 12/18/2003 | US20030230801 Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
| 12/18/2003 | US20030230361 Lead-free solder alloy and lead-free solder paste using the same |
| 12/18/2003 | US20030230203 Paste container for screen printing and screen printing apparatus |
| 12/18/2003 | US20030229984 Method and apparatus for installing a surface mount connector on a printed circuit board |
| 12/18/2003 | DE29824945U1 Electrolytic metal foil, especially a copper transfer foil for a resistance heating element or circuit structure, is produced using an ancillary anode to deposit a metal cauliflower structure on an electrodeposited metal base layer |
| 12/18/2003 | DE20212036U1 Electronic circuit board mounted display, has metal legs that fit into holes in board, side elements pins soldered into holes and side projections for positioning unit above board |
| 12/18/2003 | CA2816324A1 Rfid label technique |
| 12/18/2003 | CA2816180A1 Rfid label technique |
| 12/18/2003 | CA2816158A1 Rfid label technique |
| 12/18/2003 | CA2488737A1 Microelectronic cleaning and arc remover compositions |
| 12/18/2003 | CA2488553A1 Process for metallising support media made from plastic material |
| 12/18/2003 | CA2488116A1 Metallised parts made from plastic material |
| 12/18/2003 | CA2481133A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 12/18/2003 | CA2473729A1 Method for manufacturing rfid labels |
| 12/17/2003 | EP1372368A1 Radiating fin and radiating method using the radiating fin |
| 12/17/2003 | EP1372364A1 Method of manufacturing circuit formed substrate |
| 12/17/2003 | EP1372219A1 Zipper connector |
| 12/17/2003 | EP1372191A2 Method for depositing a device feature on a substrate |
| 12/17/2003 | EP1372190A1 A process for mounting electronic devices onto submounts and submount therefor |
| 12/17/2003 | EP1371754A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 12/17/2003 | EP1371275A1 Circuit support element for electronic devices, in particular for communication terminals |
| 12/17/2003 | EP1371273A1 Laminate comprised of flat conductor elements |
| 12/17/2003 | EP1371272A1 Wired transmission path |
| 12/17/2003 | EP1370390A1 High capacity tool crib for a machine tool for the processing of printed circuit boards |
| 12/17/2003 | EP1370387A2 Device for applying solder globules |
| 12/17/2003 | CN2593398Y 电连接器 The electrical connector |
| 12/17/2003 | CN1462574A Multilayer printed circuit board |
| 12/17/2003 | CN1462573A Hot air removable nozzle |
| 12/17/2003 | CN1462494A Shielded carrier with components for land grid array connectors |
| 12/17/2003 | CN1462289A Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductr device |
| 12/17/2003 | CN1462240A Ink jet device, ink and method of manufacturing electronic component using the device and the ink |