| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/21/2004 | CN1135577C Method for producing transponder coil |
| 01/21/2004 | CN1135538C Object lens activator |
| 01/21/2004 | CN1135533C Method for producing suspension device for magnetic head |
| 01/21/2004 | CN1135424C Display device and electronic device |
| 01/21/2004 | CN1135423C Liquid crystal device and electronic machine |
| 01/21/2004 | CN1135417C Liquid crystal display device, flat type display apparatus and electronic device fitted with the same device |
| 01/20/2004 | US6681375 Check system for wiring structure of printed circuit board |
| 01/20/2004 | US6680853 Systems and methods for mounting components to circuit assemblies |
| 01/20/2004 | US6680759 Electrode structure of display panel and electrode forming method using dummy electrode |
| 01/20/2004 | US6680546 Electrical circuits |
| 01/20/2004 | US6680536 Probe unit having resilient metal leads |
| 01/20/2004 | US6680457 Reflowing of solder joints |
| 01/20/2004 | US6680441 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device |
| 01/20/2004 | US6680440 Using permanent plating resist, which is not degraded by conventional baths, to protect substrate areas, including metallized features on substrate, from deposition of metal during plating |
| 01/20/2004 | US6680436 Reflow encapsulant |
| 01/20/2004 | US6680434 Terminal locating means assembly |
| 01/20/2004 | US6680218 Fabrication method for vertical electronic circuit package and system |
| 01/20/2004 | US6680217 Apparatus for providing mechanical support to a column grid array package |
| 01/20/2004 | US6680152 Photosensitive resin composition |
| 01/20/2004 | US6680128 Method of making lead-free solder and solder paste with improved wetting and shelf life |
| 01/20/2004 | US6680123 Embedding resin |
| 01/20/2004 | US6680081 Conductive powder and making process |
| 01/20/2004 | US6680007 Suitable for use in electrical and mechanical connection of electronic parts as a substitute for the existing solder; adhesion, heat resistance, moisture resistance, flexibility and impact resistance |
| 01/20/2004 | US6679996 Metal oxide pattern forming method |
| 01/20/2004 | US6679727 Electrical connector having improved board lock |
| 01/20/2004 | US6679709 Connector and method for manufacturing same |
| 01/20/2004 | US6679707 Land grid array connector and method for forming the same |
| 01/20/2004 | US6679307 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 01/20/2004 | US6679146 Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool |
| 01/20/2004 | US6678952 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof |
| 01/20/2004 | US6678949 Process for forming a multi-level thin-film electronic packaging structure |
| 01/20/2004 | US6678948 Method for connecting electronic components to a substrate, and a method for checking such a connection |
| 01/20/2004 | US6678946 Method of manufacturing a circuit unit |
| 01/15/2004 | WO2004006638A1 Selective area solder placement |
| 01/15/2004 | WO2004006637A1 Wiring pattern structure and method for forming bump |
| 01/15/2004 | WO2004006636A1 Component for assembling a printed circuit board |
| 01/15/2004 | WO2004006635A1 Method and apparatus for printing using an electrically conductive ink |
| 01/15/2004 | WO2004006634A1 Ball grid array jumper |
| 01/15/2004 | WO2004006389A1 Connector, method for manufacturing the same, and wiring board structure employing it |
| 01/15/2004 | WO2004006333A1 Multi electric device package |
| 01/15/2004 | WO2004006332A1 Modular board device and high frequency module and method for producing them |
| 01/15/2004 | WO2004006331A1 Multilayer wiring circuit module and method for fabricating the same |
| 01/15/2004 | WO2004006329A1 Thin-film substrate having post via |
| 01/15/2004 | WO2004006325A1 Flexible wiring base material and process for producing the same |
| 01/15/2004 | WO2004006173A2 Method for the production of electrically-conducting connections on chipcards |
| 01/15/2004 | WO2004005588A1 Electrolytic copper foil with carrier foil |
| 01/15/2004 | WO2004005578A1 Method for forming fine structure of a group of metal fine particles |
| 01/15/2004 | WO2004004967A1 Solder and packaging therefrom |
| 01/15/2004 | WO2003096777A3 Adapter for surface mount devices to through hole applications |
| 01/15/2004 | WO2003053895A3 Copper deposition using copper formate complexes |
| 01/15/2004 | US20040009729 Woven electronic textile, yarn and article |
| 01/15/2004 | US20040009683 Method for connecting electronic device |
| 01/15/2004 | US20040009666 a die, an attached lead frame, and an encapsulating bow resistant plastic body |
| 01/15/2004 | US20040009629 Electrode forming method in circuit device and chip package and multilayer board using the same |
| 01/15/2004 | US20040009428 Resist curable resin composition and cured article thereof |
| 01/15/2004 | US20040009344 Pigmented alkoxyzirconium sol |
| 01/15/2004 | US20040009335 Filling material, multilayer wiring board, and process of producing multilayer wiring board |
| 01/15/2004 | US20040009298 Methods for producing submicron metal line and island arrays |
| 01/15/2004 | US20040009292 Including one or more water soluble gold compounds, gold complexing agents, organic stabilizer compounds, and carboxylic acid uniformity enhancers; for printed wiring board substrates, integrated circuits, lead frames, pads |
| 01/15/2004 | US20040009291 Using halftone, layer of silver plasma is painted on surface of glass, glass is heated to fuse glass with silver plasma to form tempered glass circuit board which is then electroplated to prevent oxidation and circuit is attached |
| 01/15/2004 | US20040008982 Camera |
| 01/15/2004 | US20040008953 Optical module and optical transceiver module |
| 01/15/2004 | US20040008812 Ball grid array x-ray orientation mark |
| 01/15/2004 | US20040008519 Lighting device |
| 01/15/2004 | US20040008498 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module |
| 01/15/2004 | US20040008495 Printed circuit board assembly |
| 01/15/2004 | US20040008466 Multi-functional energy conditioner |
| 01/15/2004 | US20040008332 Exposure device |
| 01/15/2004 | US20040008314 Display device and manufacturing method therefor |
| 01/15/2004 | US20040008243 Fabrication of functional device mounting board making use of inkjet technique |
| 01/15/2004 | US20040008237 Inkjet printhead with high nozzle area density |
| 01/15/2004 | US20040008167 Circuit array substrate for display device and method of manufacturing the same |
| 01/15/2004 | US20040007774 Compatible with surface-mount technology (SMT); reduced size; length of signal paths reduced to reduce noise and decrease power requirements; electroconductive contacts are arranged in rows and columns on the insulative substrate |
| 01/15/2004 | US20040007770 Semiconductor-mounting substrate used to manufacture electronic packages, and production process for producing such semiconductor-mounting substrate |
| 01/15/2004 | US20040007768 Field programmable gate array assembly |
| 01/15/2004 | US20040007762 Method for fabricating adaptor for aligning and electrically coupling circuit devices having dissimilar connectivity patterns |
| 01/15/2004 | US20040007611 Asymmetric plating |
| 01/15/2004 | US20040007610 Reflow soldering method |
| 01/15/2004 | US20040007472 Lead-free chemical nickel alloy |
| 01/15/2004 | US20040007470 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids |
| 01/15/2004 | US20040007468 Multistep release method for electrochemically fabricated structures |
| 01/15/2004 | US20040007386 Structure of printed circuit board (PCB) |
| 01/15/2004 | US20040007385 Selective area solder placement |
| 01/15/2004 | US20040007384 Electronic device |
| 01/15/2004 | US20040007376 Integrated thermal vias |
| 01/15/2004 | US20040007321 Lamination systems and methods |
| 01/15/2004 | US20040007313 Selectively roughening conductors for high frequency printed wiring boards |
| 01/15/2004 | DE10330045A1 Verfahren zum Wasserdichtmachen eines Leistungsschaltkreisabschnitts und eines Leistungsmoduls A method for waterproofing a power circuit section and a power module |
| 01/15/2004 | DE10329650A1 Eine Schaltung bildendes Bauteil und Schaltungseinheit A circuit-forming component and circuit unit |
| 01/15/2004 | DE10318589A1 Leiterplattenanordnung Printed circuit board assembly |
| 01/15/2004 | DE10229902A1 Verfahren zur Herstellung von elektrisch leitfähigen Verbindungen auf Chipkarten A process for the production of electrically conductive connections on chip cards |
| 01/15/2004 | DE10229606A1 Verfahren zur Herstellung elektrischer Kontakierungsbereiche an Stellantrieb und Stellantrieb Process for the manufacture of electrical Kontakierungsbereiche to actuator and actuator |
| 01/15/2004 | DE10228450A1 Kontaktelement Contact member |
| 01/15/2004 | DE10228400A1 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards |
| 01/15/2004 | DE10228373A1 Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Chipkarte A method for making an electrical connection between components of a smart card |
| 01/15/2004 | DE10228050A1 Dikupfer(I)oxolat-Komplexe als Precursor-Substanzen zur metallischen Kupferabscheidung Dicopper (I) oxolat complexes as precursor substances for metallic copper deposition |
| 01/15/2004 | DE10227658A1 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a |
| 01/15/2004 | DE10227342A1 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 01/14/2004 | EP1381261A2 Thin-sheet resin-coated carrier |
| 01/14/2004 | EP1381260A1 Method of plating connecting layers on a conductor pattern of a printed circuit board (PCB) |