| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/27/2004 | US6683790 Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part |
| 01/27/2004 | US6683789 Electronic control module for a removable connector and methods of assembling same |
| 01/27/2004 | US6683684 Device for measuring relative position error |
| 01/27/2004 | US6683594 Display apparatus and assembly of its driving circuit |
| 01/27/2004 | US6683525 Electrical strain sensitive resistor |
| 01/27/2004 | US6683512 High frequency module having a laminate board with a plurality of dielectric layers |
| 01/27/2004 | US6683468 Method and apparatus for coupling to a device packaged using a ball grid array |
| 01/27/2004 | US6683387 Flip chip carrier package with adapted landing pads |
| 01/27/2004 | US6683378 System for singulating semiconductor components utilizing alignment pins |
| 01/27/2004 | US6683260 Multilayer wiring board embedded with transmission line conductor |
| 01/27/2004 | US6683259 Printed circuit board incorporating enhanced conductive ink |
| 01/27/2004 | US6683250 Protected electronic assembly |
| 01/27/2004 | US6683047 Method of inhibiting transcription utilizing nuclear receptors |
| 01/27/2004 | US6682953 Method for making a mounting structure for an electronic component having an external terminal electrode |
| 01/27/2004 | US6682946 Method of using a semiconductor chip package |
| 01/27/2004 | US6682945 Wafer level burn-in and electrical test system and method |
| 01/27/2004 | US6682875 Forming nesting contour on a fiber optic array; nesting a surface of non-planar article against contour; exposing photoresist optically connected to proximal optical fiber surface within contours; developing; etching |
| 01/27/2004 | US6682872 Comprises acrylic acid-acrylonitrile-butadiene terpolymer binder; for protective/passivative coatings, defect repair in ceramic and thin film products within printed circuits; solvent-free |
| 01/27/2004 | US6682354 Board edge launch connector |
| 01/27/2004 | US6681980 Structure of soldering iron tip |
| 01/27/2004 | US6681829 Automatic separator and method to obtain circuits for microelectronics |
| 01/27/2004 | US6681695 Continuous printing and mounting apparatus for film-like printing body |
| 01/27/2004 | US6681483 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
| 01/27/2004 | US6681480 Method and apparatus for installing a circuit device |
| 01/27/2004 | CA2092159C Process for improving the adhesiveness of electrolessly deposited metal films |
| 01/24/2004 | CA2394932A1 Manufacturing method for tempered glass circuit board |
| 01/22/2004 | WO2004008819A1 Electric/optical circuit and production method therefor |
| 01/22/2004 | WO2004008818A1 Method of forming pattern on ceramic green sheet and conductive paste for use in the method |
| 01/22/2004 | WO2004008817A2 A multi-configuration processor-memory device |
| 01/22/2004 | WO2004008802A1 Hearing aid or similar audio device and method for producing a hearing aid |
| 01/22/2004 | WO2004008251A1 Heat stable photocurable resin composition for dry film resist |
| 01/22/2004 | WO2004007811A2 Device and method for monitoring an electrolytic process |
| 01/22/2004 | WO2004007798A1 Immersion plating of silver |
| 01/22/2004 | WO2003052822A3 Method for making a non-detachable microcircuit card |
| 01/22/2004 | WO2003049183A3 Optimum power and ground bump pad and bump patterns for flip chip packaging |
| 01/22/2004 | WO2003030252A3 Process for producing interconnects |
| 01/22/2004 | WO2003025974A3 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 01/22/2004 | US20040015804 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise |
| 01/22/2004 | US20040014397 Coating removal |
| 01/22/2004 | US20040014317 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/22/2004 | US20040014270 microelectromechanical systems (MEMS); microsensors; die protects from damage; protected from galvanic attack |
| 01/22/2004 | US20040013860 Good mechanical properties together with high opacity properties, white inorganic pigment |
| 01/22/2004 | US20040012964 Light emitting module |
| 01/22/2004 | US20040012938 Interconnect module with reduced power distribution impedance |
| 01/22/2004 | US20040012937 Method for manufacturing a printed circuit board substrate with passive electrical components |
| 01/22/2004 | US20040012936 Device and method for enclosure of electronic printed circuit board based products |
| 01/22/2004 | US20040012935 Printed wiring board |
| 01/22/2004 | US20040012934 Multi-configuration processor-memory substrate device |
| 01/22/2004 | US20040012931 Flanged terminal pins for dc/dc converters |
| 01/22/2004 | US20040012930 Microelectronic devices and methods for mounting microelectronic packages to circuit boards |
| 01/22/2004 | US20040012926 Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board |
| 01/22/2004 | US20040012492 Apparatus and method for reducing electromigration |
| 01/22/2004 | US20040012401 Electrically conductive structure and method for implementing circuit changes on printed circuit boards |
| 01/22/2004 | US20040012383 Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance |
| 01/22/2004 | US20040012097 Structure and method for fine pitch flip chip substrate |
| 01/22/2004 | US20040012076 For use in fabrication of integrated circuit devices and integrated circuit packaging devices |
| 01/22/2004 | US20040011857 Electrical terminal tinning process |
| 01/22/2004 | US20040011856 Soldering method for mounting electric components |
| 01/22/2004 | US20040011855 Thermosetting adhesive layer is formed on a first conductor layer, opening is formed in adhesive layer and solder powders are charged in opening; second conductor layer is formed; solder powders are melted by heating to electrically connect |
| 01/22/2004 | US20040011853 Method for making a bonding tool |
| 01/22/2004 | US20040011852 Method and device for applying pieces of material to a workpiece |
| 01/22/2004 | US20040011654 Performing the regular electrolysis in a range of current density of 1 to 2 A/dm2 |
| 01/22/2004 | US20040011557 Retainer for circuit board assembly and method for using the same |
| 01/22/2004 | US20040011556 Printed circuit board and soldering structure for electronic parts thereto |
| 01/22/2004 | US20040011555 Method for manufacturing printed circuit board with stacked wires and printed circuit board manufacturing according to the mehtod |
| 01/22/2004 | US20040011283 Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
| 01/22/2004 | US20040011228 Method and stencil for extruding material on a substrate |
| 01/22/2004 | US20040010911 Method for attaching an integrated circuit package to a circuit board |
| 01/22/2004 | DE10237893B3 Verfahren und Vorrichtung zur punktuellen Bearbeitung eines Werkstücks mittels Laserstrahlung Method and apparatus for selective processing of a workpiece using laser radiation |
| 01/22/2004 | DE10228634A1 Oberflächenmontierbare Miniatur-Lumineszenz-und/oder Photo-Diode und Verfahren zu deren Herstellung A surface-mountable miniature luminescent and / or photo-diode and methods for their preparation |
| 01/22/2004 | DE10228385A1 Folienisolierter Flachleiter mit einem faltbaren Bereich Foil insulated flat conductor with a foldable area |
| 01/22/2004 | CA2491678A1 Heat stable photocurable resin composition for dry film resist |
| 01/22/2004 | CA2484757A1 Immersion plating of silver |
| 01/21/2004 | EP1383366A1 Process and apparatus for fixation of the individual layers of a multilayered circuit board |
| 01/21/2004 | EP1383365A1 Wiring board and soldering method therefor |
| 01/21/2004 | EP1383364A2 Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
| 01/21/2004 | EP1383362A2 Copper paste and wiring board using the same |
| 01/21/2004 | EP1383360A1 Injection moulded lead carrier and method of producing the same |
| 01/21/2004 | EP1382232A1 Protection of conductive connection by electrophoresis coating and structure formed thereof |
| 01/21/2004 | EP1382091A2 Connection housing for an electronic component |
| 01/21/2004 | EP1381579A1 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 01/21/2004 | CN2601002Y Adjustable line board processing clamping device |
| 01/21/2004 | CN1470069A Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture |
| 01/21/2004 | CN1469941A Method of etching as well as frame element, mask and prefabricated substrate element for use in such etching |
| 01/21/2004 | CN1469939A A method for wet etching |
| 01/21/2004 | CN1469909A Curable composition, varnish, and layered product |
| 01/21/2004 | CN1469806A Film with multilayered metal and process for producing the same |
| 01/21/2004 | CN1469805A Multilayered metal laminate and process for producing the same |
| 01/21/2004 | CN1469697A Method of fixing IC package onto circuit board |
| 01/21/2004 | CN1469696A Distributing base board, displaying device and method for producing distributing base board |
| 01/21/2004 | CN1469460A Thin film bearing belt for assembling electronic parts |
| 01/21/2004 | CN1469444A Band composition and suppressing sintering method of low-temperature cobaking ceramic |
| 01/21/2004 | CN1469400A Inductor formed between two wiring layers |
| 01/21/2004 | CN1469161A Display device and producing method thereof |
| 01/21/2004 | CN1469130A Electric conduction structure and method for realizing circuit change on printing circuit board |
| 01/21/2004 | CN1135913C Equipment and method for producing printed circuit board |
| 01/21/2004 | CN1135912C Ceramic circuit base plate |
| 01/21/2004 | CN1135911C 柔性印制电路 Flexible printed circuit |
| 01/21/2004 | CN1135611C Method for packaging semiconductor device using anisotropic conductive adhesive |
| 01/21/2004 | CN1135610C Anisotropic conductive film and packaging method of semiconductor chip and semiconductor device |