| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685485 Electrical connector |
| 02/03/2004 | US6685484 Electrical connector and terminal for flat circuitry |
| 02/03/2004 | US6685080 Individual selective rework of defective BGA solder balls |
| 02/03/2004 | US6684766 Wiper blades for screen printing |
| 02/03/2004 | US6684765 Universal shaft design for automatic wiping |
| 02/03/2004 | US6684499 Masking metal films on release agents, then applying coatings and selectively etching so that stress variations cause segments of the films to bend; microstructure electrical connectors used in detector cards; photolithography |
| 02/03/2004 | US6684497 Manufacturing methods for printed circuit boards |
| 02/03/2004 | US6684495 Method of making a circuit board not having solder failures |
| 02/03/2004 | US6684494 Parts replacing method and parts replacing apparatus |
| 02/03/2004 | US6684493 Vertically mountable interposer, assembly and method |
| 02/03/2004 | CA2290764C Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 01/29/2004 | WO2004010758A1 Part inserting head device, part inserting device, and part inserting method |
| 01/29/2004 | WO2004010753A1 Jetting device and method at a jetting device |
| 01/29/2004 | WO2004010752A1 Method for fastening microtool components to objects |
| 01/29/2004 | WO2004010751A1 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 01/29/2004 | WO2004010750A1 Printed circuit board element comprising a power supply device for electric and electronic components that are arranged on said board |
| 01/29/2004 | WO2004010499A1 Module component |
| 01/29/2004 | WO2004010487A1 Semiconductor abrasive, process for producing the same and method of polishing |
| 01/29/2004 | WO2004010440A1 Chip resistor and method for producing the same |
| 01/29/2004 | WO2004010226A2 Machine for exposing printed circuit boards |
| 01/29/2004 | WO2004010011A1 Fastener for assembly and disassembly |
| 01/29/2004 | WO2004009480A1 Shatterproof ultra-thin glass and the handling thereof |
| 01/29/2004 | WO2004008832A2 Attachable modular electronic systems |
| 01/29/2004 | WO2002099851A3 Temperature controlled vacuum chuck |
| 01/29/2004 | US20040018767 Cable assembly module with compressive connector |
| 01/29/2004 | US20040018763 Zipper connector |
| 01/29/2004 | US20040018753 Flexible electric-contact structure for IC package |
| 01/29/2004 | US20040018726 Patterned thin film and method of forming same |
| 01/29/2004 | US20040018709 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 01/29/2004 | US20040018675 Nickel plating process having controlled hydrogen concentration |
| 01/29/2004 | US20040018658 Noise shield type multi-layered substrate and munufacturing method thereof |
| 01/29/2004 | US20040018652 Modification of circuit features that are interior to a packaged integrated circuit |
| 01/29/2004 | US20040018373 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 01/29/2004 | US20040018348 Multilayered printed wiring board |
| 01/29/2004 | US20040018308 Plating method |
| 01/29/2004 | US20040018297 Conductive inks for metalization in integrated polymer microsystems |
| 01/29/2004 | US20040018131 Improved adhesion; irradiation polymerization; electroless plating |
| 01/29/2004 | US20040017672 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 01/29/2004 | US20040017670 Multilayer ceramic substrate with a cavity |
| 01/29/2004 | US20040017669 Apparatus and method for harnessing optical fiber to a circuit board |
| 01/29/2004 | US20040017560 Method of determining a minimum pulse width for a short pulse laser system |
| 01/29/2004 | US20040017536 Display device |
| 01/29/2004 | US20040017408 Apparatus and method of material deposition using comressed fluids |
| 01/29/2004 | US20040017013 Semiconductor device having a step-like section on the back side of the substrate, and method for manufacturing the same |
| 01/29/2004 | US20040017006 Support assembly for an integrated circuit package having solder columns |
| 01/29/2004 | US20040017001 Film carrier tape for semiconductor package and manufacturing method thereof |
| 01/29/2004 | US20040016913 Radiation detector assembly |
| 01/29/2004 | US20040016911 Anisotropic conductive compound |
| 01/29/2004 | US20040016794 Method of making a circuitized substrate and the resultant circuitized substrate |
| 01/29/2004 | US20040016752 Solder reflow with microwave energy |
| 01/29/2004 | US20040016742 Electric component removing device |
| 01/29/2004 | US20040016730 System and method of laser drilling using a continuously optimized depth of focus |
| 01/29/2004 | US20040016728 Method and apparatus for aligning a work piece in a laser drilling system |
| 01/29/2004 | US20040016570 Substrate and method of manufacturing the same |
| 01/29/2004 | US20040016568 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 01/29/2004 | US20040016567 Surface mounting type electronic component |
| 01/29/2004 | US20040016565 Securing electrical conductors |
| 01/29/2004 | US20040016505 An anisotropic conductive compound is cured by exposing it to heat while in the presence of an ac magnetic field followed by a static, substantially homogeneous dc magnetic field. |
| 01/29/2004 | US20040016370 Coatings, films, circuit board |
| 01/29/2004 | US20040016118 For manufacturing printed built-up wiring boards |
| 01/29/2004 | US20040016117 Technique for reducing the number of layers in a signal routing device |
| 01/29/2004 | US20040016116 Methods for modifying inner-layer circuit features of printed circuit boards |
| 01/29/2004 | US20040016115 Method of manufacturing a device, device, non-contact type card medium, and electronic equipment |
| 01/29/2004 | US20040016114 Land grid array structures and methods for engineering change |
| 01/29/2004 | US20040016113 Method and apparatus for supporting a substrate |
| 01/29/2004 | US20040016094 Method of forming capacitor with extremely wide band low impedance |
| 01/29/2004 | DE19804031B4 Gehäuse zur Verbindung eines Lichtwellenleiters mit einem optoelektrischen Wandler Housing for connecting an optical fiber with an opto-electric converter |
| 01/29/2004 | DE10230711A1 Elektrisch leitende Verbindung Electrically conductive connection |
| 01/29/2004 | DE10229953A1 Bauelement zur Leiterplattenmontage Component for PCB mounting |
| 01/29/2004 | DE10229337A1 Elektronische Baugruppe Electronic assembly |
| 01/29/2004 | DE10229118A1 Verfahren zur kostengünstigen Strukturierung von leitfähigen Polymeren mittels Definition von hydrophilen und hydrophoben Bereichen The method for cost-structuring of conductive polymers by means of definition of hydrophilic and hydrophobic regions |
| 01/29/2004 | DE10228756A1 Leiterplatte, Leiterplattenanordnung und Verwendung der Leiterplatte PCB, PCB assembly and use of the printed circuit board |
| 01/29/2004 | DE10228716A1 Verfahren zur Herstellung eines flächigen Schaltungsträgers A process for producing a sheet-like circuit carrier |
| 01/29/2004 | DE10041343B4 Siebdruckvorrichtung Screen printing apparatus |
| 01/29/2004 | CA2493009A1 Fastener for assembly and disassembly |
| 01/29/2004 | CA2492514A1 Machine for exposing printed circuit boards |
| 01/28/2004 | EP1385364A2 Patterning method |
| 01/28/2004 | EP1385363A1 Printed circuit board and production method therefor, and laminated printed circuit board |
| 01/28/2004 | EP1385234A1 Mechanical-contact adapter |
| 01/28/2004 | EP1384701A1 Manufacturing method for tempered glass circuit board |
| 01/28/2004 | EP1384302A1 Offset pathway arrangements for energy conditioning |
| 01/28/2004 | EP1384268A1 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same |
| 01/28/2004 | EP1384263A2 Support for electrical circuit elements |
| 01/28/2004 | EP1384262A2 Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies |
| 01/28/2004 | EP1383844A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 01/28/2004 | EP1135977B1 Method of manufacturing an interlayer via and a laminate precursor useful therefor |
| 01/28/2004 | EP0982385B1 Adhesive, method for bonding, and assemblies of mounted boards |
| 01/28/2004 | EP0847596B1 Imaging system and method |
| 01/28/2004 | CN1471804A Integrated circuit carrier with recesses |
| 01/28/2004 | CN1471803A A multi-chip integrated circuit carrier |
| 01/28/2004 | CN1471802A Method of manufacturing an integrated circuit carrier |
| 01/28/2004 | CN1471801A An integrated circuit carrier |
| 01/28/2004 | CN1471714A Coated particle |
| 01/28/2004 | CN1471353A Printed circuit board its manufacturing method and semiconductor device |
| 01/28/2004 | CN1471352A Distributing base board device |
| 01/28/2004 | CN1470923A Circuit array lining for display device and method for making said lining |
| 01/28/2004 | CN1470379A Two-layer copper polyimide substrate material |
| 01/28/2004 | CN1470370A Flexible printed circuit board cutting method |
| 01/28/2004 | CN1136475C Liquid crystal display and mobile phone comprising same |