| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/05/2004 | US20040022947 Method for creating microstructure patterns by contact transfer technique |
| 02/05/2004 | US20040022934 Undesired electroless metal plating of through holes not designed to be plated reduced or eliminated by use of a cleaning bath with an organosulfur compound containing a divalent sulfur atom having a carbon-sulfur single bond |
| 02/05/2004 | US20040022046 Methods of manufacturing a printed circuit board shielded against interfering radiation |
| 02/05/2004 | US20040022043 Laminated ceramic electronic component and method of producing the same |
| 02/05/2004 | US20040022042 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 02/05/2004 | US20040022040 Multi-axis compliance spring |
| 02/05/2004 | US20040022037 Electronic part mounting apparatus and method |
| 02/05/2004 | US20040022029 Power module and power module with heat sink |
| 02/05/2004 | US20040022003 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/05/2004 | US20040022000 Method for producing a large-mass ohmic resistor for protecting eletronic assemblies from surges, and an electronic assembly |
| 02/05/2004 | US20040021535 Automated dielectric resonator placement and attachment method and apparatus |
| 02/05/2004 | US20040021476 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 02/05/2004 | US20040021218 Module component |
| 02/05/2004 | US20040021212 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
| 02/05/2004 | US20040021211 Microelectronic adaptors, assemblies and methods |
| 02/05/2004 | US20040021131 Enhanced adhesion and resolution of printed films; electrical conductivity; useful in printing conductive portions of thin film transistors such as sources and drains |
| 02/05/2004 | US20040020990 Optical reader having a plurality of imaging modules |
| 02/05/2004 | US20040020972 Printed circuit board and soldering structure for electronic parts thereto |
| 02/05/2004 | US20040020901 Circuit singulation system and method |
| 02/05/2004 | US20040020782 Depositing portion of a layer onto the substrate; forming a plurality of layers such that each successive layer is formed adjacent to and adhered to a previously deposited layer |
| 02/05/2004 | US20040020690 Via connector and method of making same |
| 02/05/2004 | US20040020689 Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus |
| 02/05/2004 | US20040020688 Bonding pads of printed circuit board capable of holding solder balls securely |
| 02/05/2004 | US20040020673 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/05/2004 | US20040020566 For pretreating a copper surface for protecting the surface from oxidation |
| 02/05/2004 | US20040020513 Methods of thinning a silicon wafer using HF and ozone |
| 02/05/2004 | US20040020047 Multilayered circuit board forming method and multilayered circuit board |
| 02/05/2004 | US20040020046 Deforming conductive particles by application of a stress; mixing the deformed conductive particles with a binder that includes a thermosetting resin as a main component |
| 02/05/2004 | US20040020045 Method for connecting electronic parts |
| 02/05/2004 | US20040020044 Apparatus and method for making electrical connectors |
| 02/05/2004 | US20040020031 Method for manufacturing membranes |
| 02/05/2004 | DE4405578B4 Elektronische Baueinheit The electronic package |
| 02/05/2004 | DE19800234B4 Bürstenloser Motor Brushless motor |
| 02/05/2004 | DE10331811A1 Leiterpaste, Verfahren zum Drucken der Leiterpaste und Verfahren zur Herstellung einer Keramikleiterplatte Conductor paste method for printing the conductor paste and method of manufacturing a ceramic circuit board |
| 02/05/2004 | DE10317355A1 Elektrisch leitfähige Struktur und Verfahren zum Implementieren von Schaltungsänderungen auf gedruckten Schaltungsplatinen Electrically conductive structure and method for implementing circuit changes on printed circuit boards |
| 02/05/2004 | DE10234395A1 Electronic or electrical component e.g. miniature light bulb or LED for automobile or domestic lighting, has knife clamp connector terminal element providing push-fit electrical connection |
| 02/05/2004 | DE10234222A1 Electrical contact element for connecting conductor path structures of circuit board and circuit foil, has pressure region with lateral pressure tongues holding conductor path structures in contact |
| 02/05/2004 | DE10234081A1 Vorrichtung mit einer Schaltungsanordnung mit induktivem Element A device with a circuit with inductive element |
| 02/05/2004 | DE10232612A1 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process |
| 02/05/2004 | DE10135393B4 Elektronisches Bauteil, Herstellverfahren, sowie Verfahren zum Herstellen einer elektrischen Verbindung zwischen dem Bauteil und einer Leiterplatte An electronic component manufacturing method, and to methods for making an electrical connection between the component and a printed circuit board |
| 02/05/2004 | DE10109542B4 Anordung zur Verbindung eines auf einer Leiterplatte angebrachten Bauelementes mit einer flexiblen Schichtanordnung Arrangement for connecting a mounted component on a circuit board with a flexible layer arrangement |
| 02/05/2004 | DE10034648B4 Druckschablone sowie Verfahren zu deren Herstellung Printing stencil and to processes for their preparation |
| 02/05/2004 | CA2493754A1 Liquid crystalline polymer compositions |
| 02/04/2004 | EP1387605A2 Multilayered printed wiring board |
| 02/04/2004 | EP1387604A1 Bonding pads of printed circuit board capable of holding solder balls securely |
| 02/04/2004 | EP1387603A1 Electronic assembly and method of manufacture thereof |
| 02/04/2004 | EP1387602A1 A method of forming an electrically conductive coating on support sheets for printed circuit cards |
| 02/04/2004 | EP1387442A1 Method of mounting camera module on wiring board |
| 02/04/2004 | EP1387393A2 Improved chemical drying and cleaning system |
| 02/04/2004 | EP1387369A1 High-frequency module device |
| 02/04/2004 | EP1387367A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 02/04/2004 | EP1387179A2 Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same |
| 02/04/2004 | EP1387174A1 Contact probe |
| 02/04/2004 | EP1386743A1 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink |
| 02/04/2004 | EP1386726A1 A process and device for pressing multi-layered cards |
| 02/04/2004 | EP1386689A1 Method and device for laser beam machining of laminated material |
| 02/04/2004 | EP1386526A1 Substrate adhesion enhancement to film |
| 02/04/2004 | EP1386356A2 Fluxless flip chip interconnection |
| 02/04/2004 | EP1385666A1 Circle laser trepanning |
| 02/04/2004 | EP1228266B1 Method for electrochemically metallising an insulating substrate |
| 02/04/2004 | EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 02/04/2004 | CN2601838Y Junction device of circuit board and integrated circuit chip and print cartridge adopting said chip |
| 02/04/2004 | CN1473379A Wiring board with terminal |
| 02/04/2004 | CN1473378A Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance |
| 02/04/2004 | CN1473002A 电子机器 Electronic equipment |
| 02/04/2004 | CN1473001A Metal substrate repairing method and apparatus thereof |
| 02/04/2004 | CN1473000A Interlayer arrangement structure for multilayer circuit board |
| 02/04/2004 | CN1472805A Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof |
| 02/04/2004 | CN1472783A Noise shielded multi-layer substrates and manufacture thereof |
| 02/04/2004 | CN1472558A Photoelectric assembling line module, production and assemblies thereof |
| 02/04/2004 | CN1472528A System and method for preventing mistakes in optical inspection |
| 02/04/2004 | CN1472253A Optical solidifying-thermo solidifying resin composition and its solidified products |
| 02/04/2004 | CN1137613C Printed-wiring board and production method thereof |
| 02/04/2004 | CN1137612C Soldering method for electric connection between mother board and electronic elements |
| 02/04/2004 | CN1137611C Layout structure of mounting two connectors on two sides of printed circuit board |
| 02/04/2004 | CN1137610C Connection method for printing insulating layer of laminated electronic device |
| 02/04/2004 | CN1137515C 芯片卡模块 Chip Card Module |
| 02/04/2004 | CN1137506C Laminated substrate board |
| 02/04/2004 | CN1137505C Method for producing, processing and mountiong flip chip carrier on memory surface |
| 02/04/2004 | CN1137385C Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 02/04/2004 | CN1137011C Laser processing device |
| 02/03/2004 | US6687459 FPC mounting structure |
| 02/03/2004 | US6687135 Electronic component with shield case |
| 02/03/2004 | US6687108 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways |
| 02/03/2004 | US6686987 Liquid crystal display device |
| 02/03/2004 | US6686824 Toroidal printed coil |
| 02/03/2004 | US6686766 Technique to reduce reflections and ringing on CMOS interconnections |
| 02/03/2004 | US6686758 Engagement probe and apparatuses configured to engage a conductive pad |
| 02/03/2004 | US6686722 Battery pack containing a circuit breaker |
| 02/03/2004 | US6686665 Solder pad structure for low temperature co-fired ceramic package and method for making the same |
| 02/03/2004 | US6686664 Structure to accommodate increase in volume expansion during solder reflow |
| 02/03/2004 | US6686607 Structure and method for mounting a semiconductor element |
| 02/03/2004 | US6686566 Infrared drying and curing system for circuit boards |
| 02/03/2004 | US6686565 Method of an apparatus for heating a substrate |
| 02/03/2004 | US6686256 Method of manufacturing chip type electronic parts including forming a photo-sensitive film on the chips and irradiating the end surfaces with light |
| 02/03/2004 | US6686222 Stacked semiconductor device manufacturing method |
| 02/03/2004 | US6686128 Method of fabricating patterned layers of material upon a substrate |
| 02/03/2004 | US6686122 Production of photoresist coatings |
| 02/03/2004 | US6686030 Metal/ceramic circuit board |
| 02/03/2004 | US6686029 Circuit board and method for manufacturing the same |