| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/12/2004 | US20040026033 High speed flip chip assembly process |
| 02/12/2004 | US20040025855 Ignition coil driver chip on printed circuit board for plughole coil housing |
| 02/12/2004 | US20040025743 Halogen-free flame retarders; mixture with polymer, curing agents and solvent; laminate of dielectric overcoating substrate |
| 02/12/2004 | US20040025333 Multilayered printed circuit board and manufacturing method therefor |
| 02/12/2004 | US20040025332 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 02/12/2004 | US20040025324 Process for producing resonant tag |
| 02/12/2004 | DE20214126U1 Elektrische Schaltungsanordnung Electrical circuitry |
| 02/12/2004 | DE20122015U1 Print template e.g. for SMD processes, has thin glass disc outer edge firmly joined to frame |
| 02/12/2004 | DE19908574B4 In ein Befehls- oder Meldegerät einrastbares Funktionselement mit einer Leuchtdiode In a command or indicating device can engage functional element with a light emitting diode |
| 02/12/2004 | DE10335439A1 Device for manipulating flexible material for printed circuits and flat cables stretches it over a curved support to apply a known pressure |
| 02/12/2004 | DE10330044A1 Separation of circuit boards from old electrical products, comprises melt pressing the boards using a cylindrical member with a cover, a shaft and a drive |
| 02/12/2004 | DE10235047A1 Elektronikgehäuse mit integriertem Wärmeverteiler Electronics housing with integrated heat spreader |
| 02/12/2004 | DE10234995A1 Light diode arrangement including laser diodes for illumination and signaling has thermal chip connection and light diode module |
| 02/12/2004 | DE10224132A1 Laminated printed circuit board structure for coating printed circuit boards covers printed circuit boards with conductive sheet steel instead of copper foil |
| 02/12/2004 | DE10120692B4 Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte A mounting arrangement of the electrical and / or electronic components on a printed circuit board |
| 02/11/2004 | EP1388911A1 Interconnection of at least two flat cables and method for electrically interconnecting at least two flat cables |
| 02/11/2004 | EP1388757A1 Base pattern forming material for forming electrodes and wiring , electrode and wiring forming method and method of manufacturing image forming apparatus |
| 02/11/2004 | EP1388738A1 Inspection data producing method and board inspection apparatus using the method |
| 02/11/2004 | EP1388667A1 Ignition coil driver chip on printed circuit board for plughole coil housing |
| 02/11/2004 | EP1388465A1 Electrical Control Unit |
| 02/11/2004 | EP1388261A1 Device for arranging a photoelectric transducer at an electric signal processing device |
| 02/11/2004 | EP1388187A1 Connector and contact wafer |
| 02/11/2004 | EP1388186A1 Electrically conductive patterns, antennas and methods of manufacture |
| 02/11/2004 | EP1388019A1 Device for arranging a photoelectric transducer at an electric signal processing device |
| 02/11/2004 | EP0975464B1 Silicon nitride coating compositions |
| 02/11/2004 | CN2602874Y Holder for printed circuit board |
| 02/11/2004 | CN1475039A Holding element for holding carrier board |
| 02/11/2004 | CN1475017A Conductive power and conductive composition |
| 02/11/2004 | CN1474961A Positive type photosensitive epoxy resin composition and printed circuit board using same |
| 02/11/2004 | CN1474742A Multi-layered structures and method for manufacturing multi-layered structures |
| 02/11/2004 | CN1474642A Multilayer printed circuit board and its producing method,filling resin composition for through hole |
| 02/11/2004 | CN1474481A Electric connerctor with termiual tail aligning device |
| 02/11/2004 | CN1474421A Forming element by coating technology |
| 02/11/2004 | CN1138463C Electronic component and mounting method and device thereof |
| 02/11/2004 | CN1138461C Process for wave soldering components on printed circuit board in temperature controlled nonoxidizing atmosphere |
| 02/11/2004 | CN1138460C Method for mounting semiconductor element to circuit board, and semiconductor device |
| 02/11/2004 | CN1138302C Method for producing semiconductor device and package for semiconductor device |
| 02/11/2004 | CN1138166C Device for generating several laser beams |
| 02/11/2004 | CN1138152C Combined testing system and testing method using same |
| 02/11/2004 | CN1137797C Nickel alloy film used for reducing formation of compound between metals in soldering flux |
| 02/10/2004 | US6691296 Circuit board design aiding |
| 02/10/2004 | US6690581 Connection structure of flexible board arranged in camera |
| 02/10/2004 | US6690258 Surface-mount positive coefficient thermistor and method for making the same |
| 02/10/2004 | US6690254 Housing for an electronic component |
| 02/10/2004 | US6690024 Laser inspection apparatus |
| 02/10/2004 | US6689985 Laser drill for use in electrical circuit fabrication |
| 02/10/2004 | US6689678 Process for fabricating ball grid array package for enhanced stress tolerance |
| 02/10/2004 | US6689670 High-frequency module |
| 02/10/2004 | US6689641 Wiring board and method of producing wiring board |
| 02/10/2004 | US6689635 Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes |
| 02/10/2004 | US6689634 Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability |
| 02/10/2004 | US6689543 Adding a dye with energy absorption at the emission wave lengths of lasers used to ablate epoxy based resins then coating onto a substrate and curing |
| 02/10/2004 | US6689538 Thermal mass transfer donor element |
| 02/10/2004 | US6689488 Lead-free solder and solder joint |
| 02/10/2004 | US6689482 Preventing damage; heating and low pressure welding |
| 02/10/2004 | US6689471 Thermal management device and method of making such a device |
| 02/10/2004 | US6689426 Photochemically; using a capillary method to apply liquid to surface; laser; making fluoroplastic surface adhesive |
| 02/10/2004 | US6689412 Method for making connection balls on electronic circuits or components |
| 02/10/2004 | US6689268 Release layer of an admixture of a metal and nonmetal such as an oxide, phosphate or chromate between a support layer and a metal foil layer; desired peel strength for sufficient adhesion but to prevent premature separation |
| 02/10/2004 | US6689235 Hot rolling an ingot repeating cold rolling and annealing alternately, and recrystallized grains have a diameter of </= 20 mu m, the reduction ration being beyong 90% |
| 02/10/2004 | US6688897 Electrical connector |
| 02/10/2004 | US6688892 Clip-type lead frame for electrically connecting two substrates or devices |
| 02/10/2004 | US6688528 Compact display assembly |
| 02/10/2004 | US6687990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby |
| 02/10/2004 | US6687986 Method of programming a programmable electronic device by an in-line programming system |
| 02/10/2004 | US6687984 Method for manufacturing flexible multilayer circuit board |
| 02/10/2004 | US6687978 Method of forming tester substrates |
| 02/10/2004 | US6687969 Methods of fixturing flexible substrates and methods of processing flexible substrates |
| 02/10/2004 | CA2196770C Method for directly depositing metal containing patterned films |
| 02/05/2004 | WO2004012491A1 Apparatus and method for insepecting cream solder printed on a substrate |
| 02/05/2004 | WO2004012489A1 Circuit substrate, multi-layer wiring plate, circuit substrate manufacturing method, and multi-layer wiring plate manufacturing method |
| 02/05/2004 | WO2004012488A1 Multiwire board, its manufacturing method, and electronic apparatus having multiwire board |
| 02/05/2004 | WO2004012487A1 Method of manufacturing printed wiring boards and substrate used for the method |
| 02/05/2004 | WO2004012486A1 Conductive inks for metalization in integrated polymer microsystems |
| 02/05/2004 | WO2004012301A2 Method of curing an anisotropic conductive compound |
| 02/05/2004 | WO2004012300A2 Anisotropic conductive compound |
| 02/05/2004 | WO2004011969A1 Method for determining a minimum pulse width for a short pulse laser system |
| 02/05/2004 | WO2004011705A2 Optical filament scribing of circuit patterns |
| 02/05/2004 | WO2004011698A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 02/05/2004 | WO2004011557A1 Functional fluorescent dyes |
| 02/05/2004 | WO2004011526A1 Liquid crystalline polymer compositions |
| 02/05/2004 | WO2004011512A1 Dyed fluoropolymers |
| 02/05/2004 | WO2004011356A1 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape |
| 02/05/2004 | WO2004011247A1 Metal laminate and method of etching the same |
| 02/05/2004 | WO2004011187A1 System and method of laser drilling using a continuously optimized depth of focus |
| 02/05/2004 | WO2004011182A2 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
| 02/05/2004 | WO2004011177A2 Building a three-dimensional structure by manipulating individual particles |
| 02/05/2004 | WO2003090258A3 Laser machining |
| 02/05/2004 | WO2003082937A3 Polymerisable composition |
| 02/05/2004 | WO2003062136A3 Method and system for locally connecting microstructures |
| 02/05/2004 | WO2003034446A3 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 02/05/2004 | US20040024100 Derived from fluorochemical (meth)acrylate monomers and one or more (meth)acrylate functional dyes; coated circuit board assembly; use in conformal coatings used in high temperature applications and that contain a fluorescent tracer |
| 02/05/2004 | US20040023530 Z-axis connection of multiple substrates by partial insertion of bulges of a pin |
| 02/05/2004 | US20040023481 Electrolytic contact pads |
| 02/05/2004 | US20040023435 Process for manufacturing IC card |
| 02/05/2004 | US20040023120 Prepolymer having a carboxyl group in combination with at least two unsaturated bonds in its molecule, a polymerization initiator, a diluent, a di- or polyoxetane compound, and a curing promoter |
| 02/05/2004 | US20040023059 Lubricant layer of high and lower molecular weight polyethylene glycol and trimethylolpropane; undercoating of partially saponified polyviyl acetate or vinyl acetate - vinyl chloride copolymer |
| 02/05/2004 | US20040023057 Patterned thin film and method of forming same |
| 02/05/2004 | US20040022959 Method of marking substandard parts |
| 02/05/2004 | US20040022957 Process for deposition of metal on a surface |