| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/18/2004 | CN1476287A Copper size and wiring board using same |
| 02/18/2004 | CN1476114A Battery with connector |
| 02/18/2004 | CN1476100A Camera module and mfg. method thereof |
| 02/18/2004 | CN1476049A Pattern forming method |
| 02/18/2004 | CN1475834A 显示装置 Display device |
| 02/18/2004 | CN1139308C Mfg. method of movable microelectronic machine |
| 02/18/2004 | CN1139152C Edge interface electrical connector |
| 02/18/2004 | CN1139124C Imaging system and method |
| 02/18/2004 | CN1139121C Electronic part and making method thereof |
| 02/18/2004 | CN1139118C Method and apparatus for isolating wet sensitive plastic ball grid array device |
| 02/18/2004 | CN1139116C Integrated circuit package and computer system with the same |
| 02/18/2004 | CN1138631C Screen printing apparatus |
| 02/18/2004 | CN1138629C Multilayer base plate |
| 02/18/2004 | CN1138608C Ultrasonic vibration welding apparatus |
| 02/17/2004 | US6693870 Optical pickup device with high-frequency superposition circuit |
| 02/17/2004 | US6693793 Double-sided copper clad laminate for capacitor layer formation and its manufacturing method |
| 02/17/2004 | US6693674 Solid-state image-pickup device and method of mounting solid-state image-pickup device |
| 02/17/2004 | US6693370 Electric junction box for vehicle |
| 02/17/2004 | US6693362 Chips are densely mounted, have high operating frequencies, are mounted in arrangement that is easy to repair, and have good heat radiation property |
| 02/17/2004 | US6693359 Conducting members are provided at positions above conductor pattern, so that more conducting members can be arranged within same interval and distance between conducting members and die bonded thereon will be shorter |
| 02/17/2004 | US6693346 Semiconductor memory module having double-sided stacked memory chip layout |
| 02/17/2004 | US6693243 Surface mounting component and mounted structure of surface mounting component |
| 02/17/2004 | US6693162 Obtained by reaction of tetracarboxylic acid anhydride containing ester groups with an aromatic amine; coatings for superconductive wire |
| 02/17/2004 | US6693031 Formation of a metallic interlocking structure |
| 02/17/2004 | US6693029 Method of forming an insulative substrate having conductive filled vias |
| 02/17/2004 | US6692993 Windowed non-ceramic package having embedded frame |
| 02/17/2004 | US6692894 Composite film for near field light generation having nonlinear optical material such as antimony sandwiched between two dielectric layers; rapid formation; reuse |
| 02/17/2004 | US6692818 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 02/17/2004 | US6692816 Abrasion resistant electrode and device |
| 02/17/2004 | US6692664 Printed wiring board conductive via hole filler having metal oxide reducing capability |
| 02/17/2004 | US6692611 Method of producing a laminated structure |
| 02/17/2004 | US6692581 Flux and metallic alloy powder |
| 02/17/2004 | US6692269 Circuit module with universal connectivity |
| 02/17/2004 | US6692265 Electrical connection device |
| 02/17/2004 | US6692263 Spring connector for electrically connecting tracks of a display screen with an electrical circuit |
| 02/17/2004 | US6692094 Apparatus and method of material deposition using compressed fluids |
| 02/17/2004 | US6691912 Methods of avoiding blowhole formation by conditioning through holes and glass |
| 02/17/2004 | US6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/17/2004 | US6691409 Method of producing a circuit board |
| 02/17/2004 | US6691408 Printed circuit board electrical interconnects |
| 02/17/2004 | US6691407 Methods for retaining assembled components |
| 02/17/2004 | CA2177708C Method of making a printed circuit board |
| 02/12/2004 | WO2004014117A1 Part mounting recognition mark recognition device and method |
| 02/12/2004 | WO2004014116A1 Electronics housing with integrated thermal dissipater |
| 02/12/2004 | WO2004014114A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 02/12/2004 | WO2004013929A1 Automated dielectric resonator placement and attachment method |
| 02/12/2004 | WO2004013910A1 Microelectronic adaptors, assemblies and methods |
| 02/12/2004 | WO2004013876A1 Device comprising a circuit arrangement with an inductive element |
| 02/12/2004 | WO2003091138A3 Sheeted roll and methods and apparatus for sheeting a roll |
| 02/12/2004 | WO2003086958A3 Method for producing a product having a structured surface |
| 02/12/2004 | WO2003062726A9 Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation |
| 02/12/2004 | WO2002089541A3 Defferential connector footprint for a multi-layer circuit board |
| 02/12/2004 | WO2002076666A3 A laser machining system and method |
| 02/12/2004 | US20040031012 Method for ensuring correct pin assignments between system board connections using common mapping files |
| 02/12/2004 | US20040029992 Mixture of polymer and filler |
| 02/12/2004 | US20040029436 Device supporting a light-emitting diode for an automobile signalling system, and a method of manufacturing such a device |
| 02/12/2004 | US20040029425 Temporary, conformable contacts for microelectronic components |
| 02/12/2004 | US20040029413 Film material comprising spikes and method for the production thereof |
| 02/12/2004 | US20040029411 Compliant interconnect assembly |
| 02/12/2004 | US20040029383 Fixing adhesive sheet for flexible printed circuit board and method for mounting electronic parts in flexible printed circuit board |
| 02/12/2004 | US20040029329 Method for transferring and stacking of semiconductor devices |
| 02/12/2004 | US20040029304 Packaging of multiple active optical devices |
| 02/12/2004 | US20040029043 Process for producing circuit substrates |
| 02/12/2004 | US20040029039 Optical light emitting diodes; generation of heat by vaporization; electroluminescence display |
| 02/12/2004 | US20040028888 Three dimensional multilayer RF module having air cavities and method fabricating same |
| 02/12/2004 | US20040028883 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board |
| 02/12/2004 | US20040028395 Hot air removable nozzle |
| 02/12/2004 | US20040027819 Electrical device |
| 02/12/2004 | US20040027811 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board |
| 02/12/2004 | US20040027810 Technique for surface mounting electrical components to a circuit board |
| 02/12/2004 | US20040027788 Polymer-embedded solder bumps for reliable plastic package attachment |
| 02/12/2004 | US20040027771 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 02/12/2004 | US20040027767 Electrical control unit |
| 02/12/2004 | US20040027630 Method and apparatus for reading firearm microstamping |
| 02/12/2004 | US20040027527 Liquid crystal display device |
| 02/12/2004 | US20040027526 Liquid crystal display device |
| 02/12/2004 | US20040027477 Camera module and method for manufacturing the same |
| 02/12/2004 | US20040027223 Connecting pin structure for a transformer core |
| 02/12/2004 | US20040027212 Inductor topologies and decoupling structures for filters used in broadband applications, and design methodology thereof |
| 02/12/2004 | US20040027121 Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same |
| 02/12/2004 | US20040027054 Substrate having fine line, electron source and image display apparatus |
| 02/12/2004 | US20040026823 Method for encasing plastic array packages |
| 02/12/2004 | US20040026798 Electronic device with heat conductive encasing device |
| 02/12/2004 | US20040026797 Flip chip package substrate |
| 02/12/2004 | US20040026781 Printed wiring board and production method for printed wiring board |
| 02/12/2004 | US20040026780 High-frequency semiconductor device |
| 02/12/2004 | US20040026769 Mounting structure of electronic device and method of mounting electronic device |
| 02/12/2004 | US20040026767 Wiring substrate having position information |
| 02/12/2004 | US20040026754 Radio frequency identification device and method |
| 02/12/2004 | US20040026484 Multi-functional solder and articles made therewith, such as microelectronic components |
| 02/12/2004 | US20040026482 Process for the manufacture of metal-ceramic compound material in particular metal-ceramic substrates and metal-ceramic compound material especially metal-ceramic substrate manufactured according to this process |
| 02/12/2004 | US20040026479 Continuous mode solder jet apparatus |
| 02/12/2004 | US20040026363 Circuit board, circuit board-use member and production method therefor and method of laminating fexible film |
| 02/12/2004 | US20040026254 Covering dielectric with electroconductive polymer active material; laser ablation |
| 02/12/2004 | US20040026122 Printed circuit board and production method therefor, and laminated printed circuit board |
| 02/12/2004 | US20040026120 Method and apparatus for printed circuit board pads with registering feature for component leads |
| 02/12/2004 | US20040026116 Method for connecting flat film cables |
| 02/12/2004 | US20040026108 Composite substarate for use in magnetic recording-and-reproducing device |
| 02/12/2004 | US20040026107 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same |
| 02/12/2004 | US20040026100 Element for electromagnetic shielding and method for manufacturing thereof |