| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/24/2004 | US6696318 Methods for forming a die package |
| 02/24/2004 | US6696305 Metal post manufacturing method |
| 02/24/2004 | US6696173 Palladium containing base comprising nuclei formed by breaking non-conductive organic palladium complex; pyrogenic silicic acid or aerogel support |
| 02/24/2004 | US6696163 Liquid crystal polymers for flexible circuits |
| 02/24/2004 | US6696139 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board |
| 02/24/2004 | US6696133 Wiring boards and processes for manufacturing wiring boards |
| 02/24/2004 | US6695961 Three elongate electric current conductors, disposed parallel to one another |
| 02/24/2004 | US6695634 Method and system for coupling circuit boards in a parallel configuration |
| 02/24/2004 | US6695623 Enhanced electrical/mechanical connection for electronic devices |
| 02/24/2004 | US6695200 Bumps made with adhesive film instead of gold plating |
| 02/24/2004 | US6695020 Fluid material filling apparatus and related filling methods |
| 02/24/2004 | US6694875 Screen printing method and screen printing apparatus |
| 02/24/2004 | US6694637 Flux collection method and system |
| 02/24/2004 | US6694627 Printed circuit board processing machine |
| 02/24/2004 | US6694614 Laser processing method and equipment for printed circuit board |
| 02/24/2004 | US6694613 Method for producing a printed-circuit board having projection electrodes |
| 02/24/2004 | US6694612 Mask film having a non-parting portion |
| 02/24/2004 | US6694611 Method for manufacturing a thin-film structure having a reliably removable oxide layer |
| 02/24/2004 | US6694610 Method of producing electronic component |
| 02/24/2004 | US6694583 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 02/19/2004 | WO2004016063A1 Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board |
| 02/19/2004 | WO2004016056A1 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board |
| 02/19/2004 | WO2004016055A1 An electronic product, a body and a method of manufacturing |
| 02/19/2004 | WO2004016054A1 Wiring substrate and wiring substrate connection structure |
| 02/19/2004 | WO2004015816A1 Establishment of electrical contact between a component and a flexible line circuit |
| 02/19/2004 | WO2004015775A1 Stacking substrate for at least one ic and system comprising such a substrate |
| 02/19/2004 | WO2004015770A1 Multi-layer circuit carrier and production thereof |
| 02/19/2004 | WO2004015765A1 Multilayer printed wiring board |
| 02/19/2004 | WO2004015597A1 System and method for modifying electronic design data |
| 02/19/2004 | WO2004015441A2 Radio frequency identificaton device and method |
| 02/19/2004 | WO2004015161A1 Method and array for processing carrier materials by means of heavy ion radiation and subsequent etching |
| 02/19/2004 | WO2004014647A1 Method for producing a ceramic substrate |
| 02/19/2004 | WO2004014595A1 Laser processing device, processing method, and method of producing circuit substrate using the method |
| 02/19/2004 | WO2004014479A2 Insulated implantable electrical circuit |
| 02/19/2004 | WO2003107413A3 Method and device for producing an electronic component having external contact surfaces |
| 02/19/2004 | WO2002069053A3 Method and apparatus for registration control in production by imaging |
| 02/19/2004 | WO2002069048A3 Method and apparatus for printing patterns on substrates |
| 02/19/2004 | US20040034842 Systems and methods for ensuring correct connectivity between circuit designs |
| 02/19/2004 | US20040034489 High frequency module board device |
| 02/19/2004 | US20040033724 Housing part for an electrical adjusting drive |
| 02/19/2004 | US20040033717 Connecting device for connecting electrically a flexible printed board to a circuit board |
| 02/19/2004 | US20040033706 Device and method using a flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events |
| 02/19/2004 | US20040033446 Pre-bonding and main-bonding by use of an adhesive tape; improved flatness and precise alignment without causing chemical or thermal damage |
| 02/19/2004 | US20040033433 Useful for color proofing and printing, security coding of documents and production of masks for graphic arts and printed circuits |
| 02/19/2004 | US20040033376 Thin-film layer, thin-film layer fabrication apparatus and thin-film device |
| 02/19/2004 | US20040033375 Thin-film layer, method for forming a thin-film layer, thin-film layer fabrication apparatus and thin-film device |
| 02/19/2004 | US20040033283 Apparatus for encasing array packages |
| 02/19/2004 | US20040032562 Method and apparatus for adjusting contrast during assembly of liquid crystal displays and similar devices |
| 02/19/2004 | US20040032468 Printhead corrosion protection |
| 02/19/2004 | US20040032304 Energy conditioning circuit assembly |
| 02/19/2004 | US20040032028 Laminated multilayer package |
| 02/19/2004 | US20040032024 Low fabrication cost, high performance, high reliability chip scale package |
| 02/19/2004 | US20040032018 Method and device for forming module electronic component and module electronic component |
| 02/19/2004 | US20040032014 Substrate for semiconductor package |
| 02/19/2004 | US20040031619 Flexible strip cable |
| 02/19/2004 | US20040031568 Device for connecting multi-layer boards |
| 02/19/2004 | US20040031555 Method of embedding optical fiber in multilayer printed circuit board |
| 02/19/2004 | US20040031406 Method for forming printing inspection data |
| 02/19/2004 | US20040031339 Integration of atmospheric intrusion sensors in electronic component packages |
| 02/19/2004 | US20040031148 Bonding electroluminescent displays with electrically insulating adhesive |
| 02/19/2004 | US20040031147 Method for manufacturing multilayer wiring board |
| 02/19/2004 | US20040031145 Method for forming metal contacts on a substrate |
| 02/19/2004 | US20040031136 Method and apparatus for manufacturing electronic parts |
| 02/19/2004 | DE29724785U1 Spring contact esp for printed circuits - has metal component integrated into circuit board as edge metallisation of through hole in conducting track structure or soldered on; component forms holder for elastic shaped part, pref. by shape locking |
| 02/19/2004 | DE19781558B4 Schaltungskomponente für ein IC-Gehäuse und Verfahren zu deren Herstellung Circuit component for an IC package and process for their preparation |
| 02/19/2004 | DE10236776A1 Verbund von zumindest zwei Folienleitungen und Verfahren zum elektrischen Kontaktieren von zumindest zwei Folienleitungen Composite of at least two film lines and method for electrically contacting at least two film lines |
| 02/19/2004 | DE10236466A1 Production of high frequency electrical conducting structures on a conducting structure support comprises using a combination of laser structuring methods and etching methods with a resist which is thinly applied during the methods |
| 02/19/2004 | DE10236404A1 Production of substrate for ink-jet printing conductive or light-emitting polymer solution for full-color display uses photoresists, first given high surface energy before masking with second and reducing surface energy in unmasked areas |
| 02/19/2004 | DE10235332A1 Multiple layer switch support used in flip-chip technology comprises a semiconductor chip and/or a discrete component, a rewiring layer, an insulating layer with through-structures, and outer contact surfaces |
| 02/19/2004 | DE10235311A1 Flexible electrical circuit board or ribbon cable e.g. for automobile cabling, has free space in substrate between 2 conductor path sections joined by deflection section |
| 02/19/2004 | DE10235277A1 Process for fixing a non-solderable component to an electronic circuit board comprises vaporizing a solderable metal layer onto partial regions of the non-solderable component |
| 02/19/2004 | DE10235208A1 Contact element for making contact between two conductor foil conductors, has a substrate with a locally limited projecting part and an electrical conductive coating on the substrate and the part |
| 02/19/2004 | DE10234760A1 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin |
| 02/19/2004 | DE10234751A1 Making injection molded chip card includes placing slits near antenna contacts and depressing lugs to form recessed contacts |
| 02/19/2004 | DE10234534B3 Assembly for injection molding a plastics encapsulation around small metal stampings, has an integrated stamping zone in front of the injection molding stage, with matching molding and stamping cycles |
| 02/19/2004 | DE10226328B3 Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen Acidic solution for silver deposition and process for depositing silver layers on metal surfaces |
| 02/19/2004 | DE10213577B3 Verfahren zum simultanen Laserstrahllöten A method for simultaneous laser brazing |
| 02/19/2004 | DE10043471B4 Metallschablonen Metal stencils |
| 02/19/2004 | DE10000585B4 Siebdruckvorrichtung Screen printing apparatus |
| 02/18/2004 | EP1389901A1 Shield material and method of manufacturing the shield material |
| 02/18/2004 | EP1389897A1 Printed circuit board, its manufacturing method, and csp manufacturing methdo |
| 02/18/2004 | EP1389408A1 Method for producing components for electronic devices |
| 02/18/2004 | EP1389407A1 Method for producing a contact substrate, and corresponding contact substrate |
| 02/18/2004 | EP1389406A1 A jetting device and a method at a jetting device |
| 02/18/2004 | EP1389405A1 Method for drilling microholes using a laser beam |
| 02/18/2004 | EP1389347A1 Method for contacting an electrical component with a substrate comprising a conducting structure |
| 02/18/2004 | EP1047520B1 Apparatus and method for inerting a wave soldering installation |
| 02/18/2004 | CN2603721Y Tin groove structure of stove with rotatable nozzle |
| 02/18/2004 | CN2603720Y Tin groove structure with rotatable nozzle |
| 02/18/2004 | CN1476741A Carrier-attached copper foil and printed board using copper foil |
| 02/18/2004 | CN1476740A Printed wiring board-use copper foil and copper clad laminated sheet using printed wiring board-use copper foil |
| 02/18/2004 | CN1476636A Molecule component |
| 02/18/2004 | CN1476633A High-frequency module board device |
| 02/18/2004 | CN1476632A substrate and method for producing same |
| 02/18/2004 | CN1476493A Energy enhanced process for treating conductive surface and products formed thereby |
| 02/18/2004 | CN1476492A Method of copper-plating small-diameter holes |
| 02/18/2004 | CN1476292A Printed circuitboard |
| 02/18/2004 | CN1476290A Multi-layer wiring boark, and its mfg. method and substrate material |
| 02/18/2004 | CN1476289A Welding pad structure of printed circuit board |
| 02/18/2004 | CN1476288A Electronic circuit unit |