| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/26/2004 | US20040037044 Heat sink for surface mounted power devices |
| 02/26/2004 | US20040036833 Flexible substrate, LCD module using same, and manufacturing method of same |
| 02/26/2004 | US20040036830 An active matrix substrate includes: an insulative substrate; an insulating film provided on a layer of line terminals on the insulative substrate and including a contact hole extending in the terminal arrangement direction so that the |
| 02/26/2004 | US20040036818 Folder type multi display device |
| 02/26/2004 | US20040036731 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 02/26/2004 | US20040036551 High-frequency module substrate device |
| 02/26/2004 | US20040036521 Low resistance contact for an integrated circuit |
| 02/26/2004 | US20040036181 Connection of integrated circuit to a substrate |
| 02/26/2004 | US20040036170 Double bumping of flexible substrate for first and second level interconnects |
| 02/26/2004 | US20040036164 Semiconductor device and its manufacturing method |
| 02/26/2004 | US20040036137 Nickel bonding cap over copper metalized bondpads |
| 02/26/2004 | US20040036068 Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration |
| 02/26/2004 | US20040035933 Long range optical reader |
| 02/26/2004 | US20040035917 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 02/26/2004 | US20040035909 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing |
| 02/26/2004 | US20040035908 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 02/26/2004 | US20040035841 Method and process of contact to a heat softened solder ball array |
| 02/26/2004 | US20040035717 Electrolysis reduction by the cathode, electrochemical process by dipping in an acidic solution, etching chromium-based undercoatings away; forming a carrier tape for semiconductor chips |
| 02/26/2004 | US20040035714 Electrodepositing, alloying in presence of alkyl- or alkanol-sulfonic acid, free of cyanide ions, preventing tin oxidation |
| 02/26/2004 | US20040035711 Method of manufacturing printed circuit board and multi-layered PCB |
| 02/26/2004 | US20040035710 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 02/26/2004 | US20040035708 A surface treatment by forming an ultra-thin metal seed layer on the barrier layer, manufacture of integrated circuits, electrochemical application of the copper interconnect structures, metallization |
| 02/26/2004 | US20040035706 Method for manufacturing probes of a probe card |
| 02/26/2004 | US20040035695 Flow diffuser to be used in electro-chemical plating system |
| 02/26/2004 | US20040035693 Method for removing voids in a ceramic substrate |
| 02/26/2004 | US20040035606 Method and apparatus for supporting a circuit component having solder column interconnects using an external support |
| 02/26/2004 | US20040035605 Electrically active patterns are applied using colloidal suspension of nanoparticles that exhibit a desired electrical characteristic; nanoparticles are surrounded by insulative shells that may be removed by application of energy |
| 02/26/2004 | US20040035604 Circuit board and method of manufacturing same |
| 02/26/2004 | US20040035520 Multilayer flexible wiring circuit board and its manufacturing method |
| 02/26/2004 | US20040035306 Solder paste printing apparatus and printing method |
| 02/26/2004 | US20040035247 Method and apparatus for manufacturing minutes metalic sphere |
| 02/26/2004 | US20040034997 Vertical surface mount assembly and methods |
| 02/26/2004 | US20040034996 Fabricating fence configured for placement on surface of interposer, including receptacle configured to receive semiconductor device to align conductive elements protruding therefrom with corresponding contact pads, consolidating |
| 02/26/2004 | US20040034995 Method of producing electronic unit of radio system automatically, electronic unit of radio system and electronic component used for its production |
| 02/26/2004 | US20040034993 Method for plasma etching to manufacture electrical devices having circuit protection |
| 02/26/2004 | DE20317307U1 Printed circuit board (PCB) assembly for electric equipment has a circuit and components partly fitted on the PCB's components side and linked with each other and the PCB on the opposite solder side |
| 02/26/2004 | DE20316241U1 Illumination implement for circuit structure manufacture on circuit board, using photomask exposing circuit structure image on circuit board, in which illumination member is formed by number of punctiform light sources on support plate |
| 02/26/2004 | DE20315828U1 Printed-board assembly for making up a T5/T8/T12 power-saving lamp has a magnetic choke device with a T5 fluorescent long-field lamp |
| 02/26/2004 | DE20023380U1 Manufacture procedure for stencil for circuit board assembly by welding metal stencil to pretensioned frame to tension stencil |
| 02/26/2004 | DE10334863A1 Vorrichtung und Verfahren zur Herstellung von elektrischen Verbindern Device and method for the production of electrical connectors |
| 02/26/2004 | DE10331532A1 Beleuchtungsvorrichtung Lighting device |
| 02/26/2004 | DE10325023A1 Optoelektronisches Packungssubstrat sowie dessen Herstellungsverfahren The optoelectronic packaging substrate and its manufacturing method |
| 02/26/2004 | DE10237716A1 Elektronik-Einheit mit wärmeleitender Folie Electronic unit with thermally conductive film |
| 02/26/2004 | DE10236128A1 Electrical contacting method between component, e.g. electronic control component, and flexible ribbon cable has component counter-contact zone contacting ribbon cable contact zone in flexure region of latter |
| 02/26/2004 | DE10235864A1 Production of a flat circuit support for printed circuit boards comprises applying an electrically insulating foil on a metal layer, removing the metal layer to form a conductor structure, applying a protective layer, and further processing |
| 02/26/2004 | DE10220014A1 Stamping structures on a carrier, especially hot stamping, comprises positioning a film relative to the carrier, pressing the film, and then removing residual film material |
| 02/26/2004 | DE10218451B4 Gedruckter Widerstand Printed resistance |
| 02/26/2004 | DE10216120B4 Düsen zum Besprühen von Leiterplatten Nozzles for spraying of printed circuit boards |
| 02/26/2004 | DE10212495B4 Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats A method of manufacturing a metal-ceramic substrate, preferably a copper-ceramic substrate, |
| 02/26/2004 | CA2465363A1 Electrolytic copper plating solutions |
| 02/25/2004 | EP1392093A1 Method for manufacturing ceramic multilayered board |
| 02/25/2004 | EP1392092A1 COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET |
| 02/25/2004 | EP1392091A2 Method and system for printing integrated circuit patterns |
| 02/25/2004 | EP1392089A1 Printed circuit board with self align bonding pads thereon |
| 02/25/2004 | EP1392088A2 Electronic unit with a thermally conductive sheet |
| 02/25/2004 | EP1391922A2 Semiconductor device mounting method, semiconductor device mounting structure, electro optical device, electro-optical device manufacturing method and electronic device |
| 02/25/2004 | EP1391536A2 Composition and process for plating silver onto a metallic substrate |
| 02/25/2004 | EP1391261A1 Lead-based solder alloys containing copper |
| 02/25/2004 | EP1390568A2 Direct electrolytic metallization of non-conducting substrates |
| 02/25/2004 | EP1390219A2 Electric heating system for a motor vehicle |
| 02/25/2004 | EP1390175A1 Particle lock joint |
| 02/25/2004 | CN1478373A Electrical component, arrangement for said component and method for producing said arrangement |
| 02/25/2004 | CN1478312A Process for securing microwave module to support |
| 02/25/2004 | CN1477923A 信号传输结构 Signal transmission structure |
| 02/25/2004 | CN1477922A Alloy plating liquid for modular printed circuit board surface treatment |
| 02/25/2004 | CN1477920A Production method of film circuit plate |
| 02/25/2004 | CN1477919A Method for designing printed circuit board and its equipment |
| 02/25/2004 | CN1477918A Filling material, multilayer circuit board and its manufacturing method |
| 02/25/2004 | CN1477917A Soft circuit board capable of providing for identification |
| 02/25/2004 | CN1477733A 插座 Outlet |
| 02/25/2004 | CN1477704A Elastic electroconductive resin and electronic device |
| 02/25/2004 | CN1477703A Soldering ball assembly and producing method, method for forming welding block |
| 02/25/2004 | CN1477702A Semiconductor mounting substrate for making electronic package and its production process |
| 02/25/2004 | CN1477689A Eqipment and method for mounting electronic part |
| 02/25/2004 | CN1477450A Transfer basic board platform for exposure equipment |
| 02/25/2004 | CN1140162C Ultrasonic laser flux-free soft soldering method |
| 02/25/2004 | CN1139984C semiconductor device, assembling method, and circuit baseboard and soft baseboard and mfg. method therefor |
| 02/25/2004 | CN1139625C Method and equipment for decomposition and treatment of thermosetting resin cured matter |
| 02/25/2004 | CN1139452C Apparauts and method for inerting wave welding installation |
| 02/24/2004 | US6697694 Apparatus and method for creating flexible circuits |
| 02/24/2004 | US6697621 Method and apparatus for providing services in a private wireless network |
| 02/24/2004 | US6697420 Symbol-based signaling for an electromagnetically-coupled bus system |
| 02/24/2004 | US6697262 Electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard |
| 02/24/2004 | US6697261 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 02/24/2004 | US6697259 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack |
| 02/24/2004 | US6697258 Moisture-resistant enclosure for electronic circuitry |
| 02/24/2004 | US6697217 Disk drive comprising a coating bonded to a printed circuit board assembly |
| 02/24/2004 | US6697215 Index signal output device and floppy disk drive |
| 02/24/2004 | US6697154 Microvia inspection system |
| 02/24/2004 | US6696910 Planar inductors and method of manufacturing thereof |
| 02/24/2004 | US6696909 Circuit module and method for mounting the same |
| 02/24/2004 | US6696764 Multilayer thin film wirings formed on front and back surfaces of metal/alloy, then cut to expose inner electrode pads on which chips are mounted |
| 02/24/2004 | US6696757 Contact structure for reliable metallic interconnection |
| 02/24/2004 | US6696668 Laser soldering method and apparatus |
| 02/24/2004 | US6696665 Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each side |
| 02/24/2004 | US6696648 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
| 02/24/2004 | US6696644 Polymer-embedded solder bumps for reliable plastic package attachment |
| 02/24/2004 | US6696643 Electronic apparatus |
| 02/24/2004 | US6696529 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board |
| 02/24/2004 | US6696363 Method of and apparatus for substrate pre-treatment |