| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/03/2004 | EP0929999B1 A protective device for shielding an electrical apparatus against environmental conditions |
| 03/03/2004 | EP0811480B1 Metal film bonded body, bonding agent layer and bonding agent |
| 03/03/2004 | CN1480015A Method for making solder between metallic balls of electronic components and mounting lands of circuit and soldering furnace therefor |
| 03/03/2004 | CN1480014A Circuit board, electronic equipment using the circuit board and method of sorting circuit board |
| 03/03/2004 | CN1479926A Mountable electrical conductors |
| 03/03/2004 | CN1479773A Liquid crystal polymers for flexible circuits |
| 03/03/2004 | CN1479661A Working device and working method, and production equipment using it |
| 03/03/2004 | CN1479568A Wave soldering equipment |
| 03/03/2004 | CN1479567A Wiring base plate, semconductor device and its manufacturing mtehod, circuit board and electronic instrument |
| 03/03/2004 | CN1479566A Laminated ceramic electronic component and manufacturing method thereof |
| 03/03/2004 | CN1479565A 布线基板及其制造方法 Wiring board and manufacturing method thereof |
| 03/03/2004 | CN1479413A Electric connector for printed circuit board |
| 03/03/2004 | CN1478824A Electronic element for high frequency using low-dielectric loss angle tangent insulating material |
| 03/03/2004 | CN1478626A Multilayer circuit board, detector for measuring, location hole processing device and its method |
| 03/03/2004 | CN1140378C Composition for preventing creeping of flux for soldering and its used welding method and welding products |
| 03/03/2004 | CN1140373C Welding method |
| 03/02/2004 | US6701197 System and method for side to side registration in a printed circuit imager |
| 03/02/2004 | US6700800 Retainer for circuit board assembly and method for using the same |
| 03/02/2004 | US6700795 Scalable, modular architecture for automotive power distribution and body control functions |
| 03/02/2004 | US6700790 Circuit board with integrated circuit |
| 03/02/2004 | US6700789 High-frequency wiring board |
| 03/02/2004 | US6700748 Methods for creating ground paths for ILS |
| 03/02/2004 | US6700650 Holder for holding a printed circuit for exposure to light |
| 03/02/2004 | US6700643 Device for exposure of a peripheral area of a film circuit board |
| 03/02/2004 | US6700455 Electromagnetic emission reduction technique for shielded connectors |
| 03/02/2004 | US6700448 High performance dual range oscillator module |
| 03/02/2004 | US6700204 Substrate for accommodating passive component |
| 03/02/2004 | US6700196 Programmable multi-chip module |
| 03/02/2004 | US6700188 Low-pin-count chip package having concave die pad and/or connections pads |
| 03/02/2004 | US6700182 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 03/02/2004 | US6700177 Compact, surface-mounting-type, electronic-circuit unit |
| 03/02/2004 | US6700079 Discrete solder ball contact and circuit board assembly utilizing same |
| 03/02/2004 | US6700078 Formation of multisegmented plated through holes |
| 03/02/2004 | US6700077 Packaging substrate with electrostatic discharge protection |
| 03/02/2004 | US6700076 Multi-layer interconnect module and method of interconnection |
| 03/02/2004 | US6700074 Electrical component housing structures and their method of manufacture |
| 03/02/2004 | US6700072 Electrical connection with inwardly deformable contacts |
| 03/02/2004 | US6700071 Multi-layer circuit board having at least two or more circuit patterns connected |
| 03/02/2004 | US6700070 Alignment mark for placement of guide hole |
| 03/02/2004 | US6700069 Circuit board or other multilayer electrical device made by forming teeth to join layers |
| 03/02/2004 | US6700068 Adhesive-less cover on area array bonding site of circuit board |
| 03/02/2004 | US6699780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching |
| 03/02/2004 | US6699748 Method of fabricating capacitor having a photosensitive resin layer as a dielectric |
| 03/02/2004 | US6699736 Electrical coupling of a stiffener to a chip carrier |
| 03/02/2004 | US6699732 Pitch compensation in flip-chip packaging |
| 03/02/2004 | US6699731 Substrate of semiconductor package |
| 03/02/2004 | US6699646 Handled under bright sodium safelight for inspection of coatings |
| 03/02/2004 | US6699605 Glass ceramic laminate becoming relatively high in bending strength after fired |
| 03/02/2004 | US6699395 Method of forming alignment features for conductive devices |
| 03/02/2004 | US6699351 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 03/02/2004 | US6699350 Coating a multilayer lamination including a first and second cured photoimageable dielectric layers, a sticker interfaced layer of partially cured photoimageable dielectrics |
| 03/02/2004 | US6699306 Dip soldering printed circuit board with surfaced copper foil and component having a copper lead attached thereto; replenishment; lead-free solders |
| 03/02/2004 | US6699299 Composition and method for polishing in metal CMP |
| 03/02/2004 | US6699046 Pin grid array integrated circuit connecting device |
| 03/02/2004 | US6698648 Method for producing solderable and functional surfaces on circuit carriers |
| 03/02/2004 | US6698638 Printed circuit board scrap edge removal tool |
| 03/02/2004 | US6698347 Screen printing apparatus and method of screen printing |
| 03/02/2004 | US6698346 Screen-printing material replenishing device |
| 03/02/2004 | US6698093 Creating unified portion with separation films via laser beam throughhole formation |
| 03/02/2004 | US6698092 Methods and systems for forming a die package |
| 03/02/2004 | US6698091 Method and apparatus for coupling circuit boards |
| 03/02/2004 | US6698089 Device for bonding a wire conductor |
| 03/02/2004 | US6698084 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 02/26/2004 | WO2004017703A2 Method for forming printing inspection data |
| 02/26/2004 | WO2004017691A1 I-channel surface-mount connector with extended flanges |
| 02/26/2004 | WO2004017689A1 Multilayer printed wiring board and production method therefor |
| 02/26/2004 | WO2004017688A1 Depositing solid materials |
| 02/26/2004 | WO2004017687A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/26/2004 | WO2004017372A2 Method and apparatus for reducing electromagnetic emissions from electronic circuits |
| 02/26/2004 | WO2004017342A1 Capacitor circuit and method for mounting capacitor circuit |
| 02/26/2004 | WO2004016829A2 Electrolytic copper plating solutions |
| 02/26/2004 | WO2003083545A3 Assembly of active optical devices on a substrate |
| 02/26/2004 | WO2003059028A3 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 02/26/2004 | WO2003041464A3 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 02/26/2004 | WO2003030597A3 Machine and installation for tracing on a support |
| 02/26/2004 | WO2003020003A3 Horizontal component retention socket |
| 02/26/2004 | WO2003018878A3 Segmented counterelectrode for an electrolytic treatment system |
| 02/26/2004 | WO2002039498A3 Methods and systems for positioning substrates |
| 02/26/2004 | US20040040008 Determining via placement in the printed circuit board of a wireless test fixture |
| 02/26/2004 | US20040039529 System and method for assessing environmental load |
| 02/26/2004 | US20040039127 Electronic device using low dielectric loss tangent insulators for high frequency signals |
| 02/26/2004 | US20040038808 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 02/26/2004 | US20040038598 Method and device for connecting conductors |
| 02/26/2004 | US20040038585 Connector for button battery contained in electronic device |
| 02/26/2004 | US20040038583 Spring-loaded heat sink assembly for a circuit assembly |
| 02/26/2004 | US20040038559 Surface mount interconnect and device including same |
| 02/26/2004 | US20040038519 Wiring method and element arranging method using the same, and method of production image display devices |
| 02/26/2004 | US20040038497 Method for fabricating large area flexible electronics |
| 02/26/2004 | US20040038496 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 02/26/2004 | US20040038452 Connection between semiconductor unit and device carrier |
| 02/26/2004 | US20040038054 Laminate for substrate of printed wiring board |
| 02/26/2004 | US20040038050 Bonding a polymer film having a thin metal film formed on a surface to a metal foil having a given thickness without using an adhesive |
| 02/26/2004 | US20040038049 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits |
| 02/26/2004 | US20040037999 Fabrication method |
| 02/26/2004 | US20040037966 Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates |
| 02/26/2004 | US20040037950 Improving dimensional stability, matching thermal expansion of glass layer to electronic connection components, preventing thermal expansion stress |
| 02/26/2004 | US20040037516 Optical transmission module |
| 02/26/2004 | US20040037061 Method and components for manufacturing multi-layer modular electrical circuits |
| 02/26/2004 | US20040037060 Solder ball collapse control apparatus and method thereof |
| 02/26/2004 | US20040037057 Radiating structure for electronic circuit units, capable of efficiently radiating heat of heater element |