| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/09/2004 | US6701835 Method for placing indicia on substrates |
| 03/09/2004 | US6701614 Method for making a build-up package of a semiconductor |
| 03/09/2004 | US6701613 Multilayer circuit board and method of manufacturing the same |
| 03/09/2004 | US6701612 Method and apparatus for shaping spring elements |
| 03/09/2004 | US6701605 Conductive electrical element and antenna with ink additive technology |
| 03/04/2004 | WO2004019670A1 Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| 03/04/2004 | WO2004019668A1 Perforated substrate, method for manufacturing same and full wafer contact board |
| 03/04/2004 | WO2004019667A1 Method for forming bump on electrode pad with use of double-layered film |
| 03/04/2004 | WO2004019666A1 Process for preparing a substantially transparent conductive layer configuration |
| 03/04/2004 | WO2004019665A1 Method for producing electric conductive structures for use in high-frequency technology |
| 03/04/2004 | WO2004019134A1 Removing solution |
| 03/04/2004 | WO2004018719A1 Negative volume expansion lead-free electrical connection |
| 03/04/2004 | WO2004018195A1 Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil |
| 03/04/2004 | WO2004018146A1 Tin-zinc lead-free solder and solder-joined part |
| 03/04/2004 | WO2004018145A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 03/04/2004 | WO2004018142A1 Method and device for the punctiform machining of a workpiece by means of a laser beam |
| 03/04/2004 | WO2004001495A3 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit |
| 03/04/2004 | WO2002103718A3 Uv-curable inks for ptf laminates (including flexible circuitry) |
| 03/04/2004 | WO2002079542A8 Improved adhesion of polymeric materials to metal surfaces |
| 03/04/2004 | US20040044102 Mixture of addition polymer and epoxy resin |
| 03/04/2004 | US20040043645 Connection structure between bus bars and relay terminals |
| 03/04/2004 | US20040043644 Coaxial and linear power delivery devices |
| 03/04/2004 | US20040043643 Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same |
| 03/04/2004 | US20040043537 Method of manufacturing a semiconductor device having a flexible wiring substrate |
| 03/04/2004 | US20040043334 Method of manufacturing for conductive pattern substrate |
| 03/04/2004 | US20040043327 Mixture of epoxy and phenolic resins, latent curing agents and photosensitive acid generator |
| 03/04/2004 | US20040043242 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/04/2004 | US20040043232 Laminate and use thereof |
| 03/04/2004 | US20040043190 Laminated electronic component |
| 03/04/2004 | US20040043159 Brightness, uniform thickness of silver layer |
| 03/04/2004 | US20040043139 Printer and method for manufacturing electronic circuits and displays |
| 03/04/2004 | US20040042706 Optical communication device |
| 03/04/2004 | US20040042179 PCB heatsink |
| 03/04/2004 | US20040042141 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 03/04/2004 | US20040041994 Balanced positioning system for use in lithographic apparatus |
| 03/04/2004 | US20040041796 Touch panel device and method of fabricating the same |
| 03/04/2004 | US20040041576 Stress relieved contact array |
| 03/04/2004 | US20040041393 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 03/04/2004 | US20040041309 Ceramic component and production method therefor |
| 03/04/2004 | US20040041277 Multilayer board and a semiconductor device |
| 03/04/2004 | US20040041276 Electrical assembly and method for manufacturing the electrical assembly |
| 03/04/2004 | US20040041270 Semiconductor package, method of production of same, and semiconductor device |
| 03/04/2004 | US20040041256 Semiconductor device |
| 03/04/2004 | US20040041243 Thin film circuit board device and its manufacturing method |
| 03/04/2004 | US20040041241 Packaged semiconductor with coated leads and method therefore |
| 03/04/2004 | US20040041002 Alignment weight for floating pin field design |
| 03/04/2004 | US20040041001 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges |
| 03/04/2004 | US20040040857 Forming a ultra-thin seed barrier layer; overcoating recess structures |
| 03/04/2004 | US20040040856 Method for making plastic packages |
| 03/04/2004 | US20040040852 Plating method |
| 03/04/2004 | US20040040744 Technique for reducing the number of layers in a multilayer circuit board |
| 03/04/2004 | US20040040743 Multilayer modules with flexible substrates |
| 03/04/2004 | US20040040742 Mounting board and electronic device using the same |
| 03/04/2004 | US20040040739 Multilayer wiring board and method of manufacturing the same |
| 03/04/2004 | US20040040738 Multilayer wiring board |
| 03/04/2004 | US20040040735 Wire bonding surface for connecting an electrical energy storage device to an implantable medical device |
| 03/04/2004 | US20040040651 Multi-layer circuit board and method of making the same |
| 03/04/2004 | US20040040645 Touch screen with an applied edge electrode pattern |
| 03/04/2004 | US20040040455 Screen printing method |
| 03/04/2004 | US20040040327 Power module and air conditioner |
| 03/04/2004 | US20040040149 Probe card , e.g., for testing microelectronic components, and methods for making same |
| 03/04/2004 | US20040040148 High speed; continuous rolls; sputtering metal; drilling apertures; plating mask; controlling thickness |
| 03/04/2004 | DE20316711U1 Viscose paste printing apparatus e.g. for solder paste for mounting components on circuit boards, has massive pressing piece, printing stencil made of flexible material and substrate carrier |
| 03/04/2004 | DE20315513U1 End cap for energy-saving electric lamp used in damp environment e.g. for aquarium, wet room, refrigerator, or food plant, with sealing of socket pins |
| 03/04/2004 | DE10334557A1 Verbinder für eine in einer elektronischen Vorrichtung enthaltene Knopfbatterie Connector for a button battery contained in an electronic device |
| 03/04/2004 | DE10327581A1 Konstruktion zum Montieren eines Aschlusses, ein Leiterplattenverbinder und Verfahren zum Montieren desselben The same structure for mounting a Aschlusses, a printed circuit board connector and method for mounting |
| 03/04/2004 | DE10296619T5 Leistungsmodul Power module |
| 03/04/2004 | DE10238913A1 Mounting of multiple pin electrical connectors onto an electronic circuit board has pins positioned to wedge in contact holes |
| 03/04/2004 | DE10238884A1 Elektronische Baugruppe Electronic assembly |
| 03/04/2004 | DE10237013A1 Verfahren zur Herstellung einer festen Verbindung zweier Schichten eines Mehrschichtensystems sowie Mehrschichtensystem A method for producing a solid connection between two layers of a multilayer system and the multi-layer system |
| 03/04/2004 | DE10234614B3 Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess A method for processing substrate by heavy ion irradiation and subsequent etching process |
| 03/04/2004 | DE10234585A1 Optoelectronic surface mounted device component for receiving electromagnetic radiation, especially sunlight in a motor vehicle has angled supports on a carrier plate |
| 03/04/2004 | DE10160710A1 Soldering process uses robot mounted tool that positions soldering tool that operates with a protective gas atmosphere |
| 03/04/2004 | DE10041622B4 Siebdruckvorrichtung Screen printing apparatus |
| 03/04/2004 | CA2466949A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 03/04/2004 | CA2466948A1 Tin-zinc lead-free solder and solder-joined part |
| 03/03/2004 | EP1395103A2 PCB Heatsink |
| 03/03/2004 | EP1395102A2 Multi-layer circuit board and method of making the same |
| 03/03/2004 | EP1395101A1 Method of manufacturing electronic part and electronic part obtained by the method |
| 03/03/2004 | EP1395100A1 Process for treating and manufacturing of circuit boards and such a circuit board |
| 03/03/2004 | EP1395099A1 Electronic component−use material and electronic componsnet usint it |
| 03/03/2004 | EP1394857A2 Semiconductor device |
| 03/03/2004 | EP1394702A1 High-frequency electronic component and its designing method |
| 03/03/2004 | EP1394291A2 Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
| 03/03/2004 | EP1393896A1 Laminated plate and part using the laminated plate |
| 03/03/2004 | EP1393606A2 Polyimide adhesion enhancement to polyimide film |
| 03/03/2004 | EP1393605A2 Circuit board with at least one electronic component |
| 03/03/2004 | EP1393604A1 Printed circuit board comprising a contact sleeve that is mounted thereon |
| 03/03/2004 | EP1393603A1 Method and device for structuring printed circuit boards |
| 03/03/2004 | EP1393388A1 Method for producing conductive structures by means of a printing technique, and active components produced therefrom for integrated circuits |
| 03/03/2004 | EP1393371A2 Electronic module and method for assembling same |
| 03/03/2004 | EP1393328A2 A method and system for forming electrically conductive pathways |
| 03/03/2004 | EP1393248A1 Method for producing a contactless chip card using transfer paper |
| 03/03/2004 | EP1393109A1 Device for holding an optical fibre |
| 03/03/2004 | EP1392495A1 Three-dimensional nonwoven substrate for circuit board |
| 03/03/2004 | EP1392467A1 Method and apparatus for improving laser hole resolution |
| 03/03/2004 | EP1392449A1 Over-clocking in a microdeposition control system to improve resolution |
| 03/03/2004 | EP1226289B1 An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
| 03/03/2004 | EP1187698B1 Beam shaping and projection imaging with solid state uv gaussian beam to form vias |
| 03/03/2004 | EP1099247B1 Method for transferring solder to a device and/or testing the device |