| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/11/2004 | US20040048414 Method for the production of an electronic component |
| 03/11/2004 | US20040048202 Metal bump with an insulating sidewall and method of fabricating thereof |
| 03/11/2004 | US20040048132 Fuel cell and electronic device using fuel cell |
| 03/11/2004 | US20040048079 Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof |
| 03/11/2004 | US20040048050 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 03/11/2004 | US20040048047 Carrier-attached copper foil and printed board using the copper foil |
| 03/11/2004 | US20040048001 Pattern formation method and substrate manufacturing apparatus |
| 03/11/2004 | US20040047991 Resin coated carrier fabrication method and the related apparatus for the fabrication |
| 03/11/2004 | US20040047637 Transponder assembly for use with parallel optics modules in fiber optic communications systems |
| 03/11/2004 | US20040047138 Electronic component mounting circuit board and electronic component replacing method |
| 03/11/2004 | US20040047136 Wiring board having terminal |
| 03/11/2004 | US20040047127 Method of mounting chip |
| 03/11/2004 | US20040047125 Module support for electrical/electronic components |
| 03/11/2004 | US20040047118 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 03/11/2004 | US20040046948 Exposure apparatus and method of conveying mask and work |
| 03/11/2004 | US20040046835 A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. |
| 03/11/2004 | US20040046582 Contacting component, method of producing the same, and test tool having the contacting component |
| 03/11/2004 | US20040046507 Lamp base comprising an eletronic component and a method for producing a lamp base |
| 03/11/2004 | US20040046265 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly |
| 03/11/2004 | US20040046252 Formation of solder balls having resin member as reinforcement |
| 03/11/2004 | US20040046244 Multilayered substrate for semiconductor device |
| 03/11/2004 | US20040046238 Semiconductor chip grid array package design and method of manufacture |
| 03/11/2004 | US20040046236 Semiconductor package method |
| 03/11/2004 | US20040046006 Method and arrangement for providing vias in printed circuit boards |
| 03/11/2004 | US20040045832 Methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to |
| 03/11/2004 | US20040045738 Audio coding and decoding |
| 03/11/2004 | US20040045737 Processes for manufacturing flexible wiring boards |
| 03/11/2004 | US20040045736 Mechatronic transmission control |
| 03/11/2004 | US20040045657 Method for forming a multi-layer ceramic electronic device |
| 03/11/2004 | US20040045656 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 03/11/2004 | US20040045655 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 03/11/2004 | US20040045642 Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor |
| 03/11/2004 | US20040045578 Selective preparation (cleaning and modification) of a critical substrate surface prior to, during, or following manufacturing and assembly operations such as coating, bonding, patterning, sealing, dicing, cutting, drilling, |
| 03/11/2004 | US20040045458 Method and apparatus for releasing materials from stencils |
| 03/11/2004 | US20040045455 Position adjustment in laser-assisted pressing |
| 03/11/2004 | US20040045161 Capacitor plate for substrate components |
| 03/11/2004 | US20040045160 Methods for trimming electrical parameters in an electrical circuit |
| 03/11/2004 | US20040045159 Electrical connection with inwardly deformable contacts |
| 03/11/2004 | US20040045157 Flexible wiring boards |
| 03/11/2004 | DE20319185U1 Kleine Stapel-Speicherkarte Small stack memory card |
| 03/11/2004 | DE20319173U1 Kleine Speicherkarte Small memory card |
| 03/11/2004 | DE20317524U1 T5 fluorescent energy saving lamp is used in unit for larger tube and has adapter and fittings for assembly and transportation. |
| 03/11/2004 | DE10336517A1 Verbindungsstruktur zwischen Busschienen und Relaisanschlüssen Connecting structure between busbars and relay terminals |
| 03/11/2004 | DE10241891A1 Electronic switching part for high frequency applications, e.g. a distance radar in a vehicle, comprises an electrical/electronic component with contact elements arranged on a substrate |
| 03/11/2004 | DE10240105A1 Herstellung organischer elektronischer Schaltkreise durch Kontaktdrucktechniken Production of organic electronic circuits by contact printing techniques |
| 03/11/2004 | DE10217214B4 Kühlanordnung für eine Schaltungsanordnung Cooling arrangement for a circuit |
| 03/11/2004 | DE10059234B4 Elektrisch leitende Paste und Verfahren zur Bildung eines Schaltkreises Electrically conductive paste and process for forming a circuit |
| 03/11/2004 | CA2496654A1 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 03/11/2004 | CA2496557A1 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| 03/10/2004 | EP1397031A2 Circuit board for mounting electronic parts |
| 03/10/2004 | EP1396885A1 Resin moulded automotive electronic control unit |
| 03/10/2004 | EP1396557A1 Metal cleaning composition and process |
| 03/10/2004 | EP1396050A2 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 03/10/2004 | EP1395633A2 Method for producing thin homogeneous layers with the help of screen printing technology, device for carrying out said method and the use thereof |
| 03/10/2004 | EP0931366B1 Low profile connector |
| 03/10/2004 | EP0800754B1 Compliant interface for a semiconductor chip |
| 03/10/2004 | CN2606513Y Improved waterproof structure for printing circuit board |
| 03/10/2004 | CN1481661A Element for electromagnetic shielding and method for mfg. thereof |
| 03/10/2004 | CN1481658A Method for mfg. mulfilayer circuit board for semiconductor device |
| 03/10/2004 | CN1481603A Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 03/10/2004 | CN1481548A Method/appts. for folding thin flexible |
| 03/10/2004 | CN1481535A System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture |
| 03/10/2004 | CN1481448A Plating method of metal film on surface of polymer |
| 03/10/2004 | CN1480961A Resistance wiring board and its mfg. method |
| 03/10/2004 | CN1480342A Laser thermal transfer donor contg separated adulterant coating |
| 03/10/2004 | CN1480304A Cut-off method of laminated board, and half-cutting appts. used by such method |
| 03/10/2004 | CN1141739C Clad plate for lead frame's lead frame using the same, and method of manufacturing lead frame |
| 03/09/2004 | US6704919 Printed circuit board wiring structure checkup system |
| 03/09/2004 | US6704430 Electroacoustic transducer |
| 03/09/2004 | US6704248 High density power module incorporating passive components distributed in a substrate |
| 03/09/2004 | US6704209 Aggregate of electronic components and mounting method thereof |
| 03/09/2004 | US6704208 Printed circuit board and manufacturing method thereof |
| 03/09/2004 | US6704207 Printed circuit board comprising one layer having device mounted on surface and second layer, in which one of interiorsurfaces includes recessed portion for securedly holding interstitial component with lead coupled through via |
| 03/09/2004 | US6704203 Power supply module |
| 03/09/2004 | US6704189 Electronic device with external terminals and method of production of the same |
| 03/09/2004 | US6704165 Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film |
| 03/09/2004 | US6703706 Concurrent electrical signal wiring optimization for an electronic package |
| 03/09/2004 | US6703705 Semiconductor device and method for packaging same |
| 03/09/2004 | US6703697 Having stand-off disposed on second substrate surface, sized to maintain distance between capacitor and another substrate and to allow electrical connection element to directly connect substrate surfaces when stand-off is mounted to other surface |
| 03/09/2004 | US6703603 Controller for optical scanner |
| 03/09/2004 | US6703567 Conductor track layer structure and prestage thereof |
| 03/09/2004 | US6703566 Bonding structure for a hard disk drive suspension using anisotropic conductive film |
| 03/09/2004 | US6703565 Wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring is flat, glass-epoxy prepreg |
| 03/09/2004 | US6703564 Printing wiring board |
| 03/09/2004 | US6703560 Stress resistant land grid array (LGA) module and method of forming the same |
| 03/09/2004 | US6703313 Printing plates |
| 03/09/2004 | US6703262 Method for planarizing circuit board and method for manufacturing semiconductor device |
| 03/09/2004 | US6703259 System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
| 03/09/2004 | US6703186 Method of forming a conductive pattern on a circuit board |
| 03/09/2004 | US6703133 Polyimide silicone resin, its solution composition, and polyimide silicone resin film |
| 03/09/2004 | US6703124 Epoxy resin composition and laminate using the same |
| 03/09/2004 | US6703114 Laminate structures, methods for production thereof and uses therefor |
| 03/09/2004 | US6703113 Pb-free solder composition and soldered article |
| 03/09/2004 | US6702968 Printed circuit techniques for polyethylene surfaces |
| 03/09/2004 | US6702916 Very ultra thin conductor layers for printed wiring boards |
| 03/09/2004 | US6702594 Electrical contact for retaining solder preform |
| 03/09/2004 | US6702592 Printed circuit board assembly with secondary side rigid electrical pin to mate with compliant contact |
| 03/09/2004 | US6702176 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 03/09/2004 | US6702175 Method of soldering using lead-free solder and bonded article prepared through soldering by the method |
| 03/09/2004 | US6702173 Reflow apparatus in continuous printing and mounting apparatus for film-like printing body |