| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/18/2004 | US20040050585 Method to obtain high density signal wires with low resistance in an electronic package |
| 03/18/2004 | US20040050475 Mounting apparatus and mounting method |
| 03/18/2004 | US20040050268 Methods for manufacturing printed circuit boards using a partial printing process and apparatus |
| 03/18/2004 | US20040050266 Blocking cap for use in a partial printing process and apparatus |
| 03/18/2004 | US20040049912 Embedding electrical and electronic apparatus such as integrated circuit chips, semiconductors, capacitors or resistors in printed circuits |
| 03/18/2004 | US20040049874 Screen printing squeegee for applying solder paste |
| 03/18/2004 | DE19502988B4 Verfahren zur galvanischen Beschichtung von Polymeroberflächen A method for the electrolytic coating of polymer surfaces |
| 03/17/2004 | EP1399006A2 A mounting structure of a wireless module |
| 03/17/2004 | EP1399005A2 Housing preform and electronic apparatus using the same |
| 03/17/2004 | EP1398667A1 Photosensitive resin composition comprising a halogen-free colorant |
| 03/17/2004 | EP1397946A1 Circuit elements having an embedded conductive trace and methods of manufacture |
| 03/17/2004 | EP1319198B1 Machine for the treatment of printing plates |
| 03/17/2004 | EP1218757B1 Method for making a probe card with multiple contact tips for testing integrated circuits with microsphere contacts |
| 03/17/2004 | EP1206825A4 Universal energy conditioning interposer with circuit architecture |
| 03/17/2004 | EP1023136B1 Flux management system |
| 03/17/2004 | EP0812527B2 Sealed packaging for environmental protection of electronics |
| 03/17/2004 | CN2606997Y Inner layer structure of circuit board |
| 03/17/2004 | CN1483303A Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 03/17/2004 | CN1483302A Carrier-based electronic module |
| 03/17/2004 | CN1483282A Case of folding type multi-display device |
| 03/17/2004 | CN1482956A Solder foil, semiconductor device and electronic device |
| 03/17/2004 | CN1482950A Printed circuit board recycle method and apparatus thereof |
| 03/17/2004 | CN1482850A Method and apparatus for determining fastener fabrication dimension |
| 03/17/2004 | CN1482849A Method for mfg. circuit board |
| 03/17/2004 | CN1482848A Method for mfg. circuit board |
| 03/17/2004 | CN1482847A Structure for preventing mosaic copper metal damage and method thereof |
| 03/17/2004 | CN1482845A Electric circuit board without photosensitive material |
| 03/17/2004 | CN1482710A Housing, apparatus and method for housing assembling, and connector structure having housing |
| 03/17/2004 | CN1482512A Imaging device packaging, camera module and the producing process of the camera module |
| 03/17/2004 | CN1482450A Visual check supporting device for industrial products |
| 03/17/2004 | CN1482097A Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate |
| 03/17/2004 | CN1481960A Nozzle structure for automatic welding devic |
| 03/17/2004 | CN1142711C Printed circuit board forming and hole drilling process |
| 03/17/2004 | CN1142710C Laser induced liquid-phase deposition method for making electrically conductive lines on PCB |
| 03/17/2004 | CN1142616C 印刷电路板连接器 Printed circuit board connectors |
| 03/17/2004 | CN1142615C Integrated film antenna and its preparing process |
| 03/17/2004 | CN1142590C Method and apparatus for retention of fragile conductive lead using protective clamp |
| 03/17/2004 | CN1142226C Antirust precoating paint for printed circuit board |
| 03/16/2004 | US6708243 Computer assembly with stub traces coupled to vias to add capacitance at the vias |
| 03/16/2004 | US6707687 Connection structure for radio frequency circuit that exceeds in RF characteristics |
| 03/16/2004 | US6707685 Multi-layer wiring board |
| 03/16/2004 | US6707683 Circuit board having improved soldering characteristics |
| 03/16/2004 | US6707682 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 03/16/2004 | US6707671 Power module and method of manufacturing the same |
| 03/16/2004 | US6707288 Apparatus for producing and testing electronic units |
| 03/16/2004 | US6707158 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 03/16/2004 | US6707152 Semiconductor device, electrical conductor system, and method of making |
| 03/16/2004 | US6707140 Arrayable, scaleable, and stackable molded package configuration |
| 03/16/2004 | US6707125 Solid-state imaging apparatus and manufacturing method thereof |
| 03/16/2004 | US6707022 For each chip, interpolating output of phantom photosensor disposed predetermined distance from end photosensor toward gap, thereby yielding artificial value, and adding artificial value to data stream output from chip |
| 03/16/2004 | US6706998 Simulated laser spot enlargement |
| 03/16/2004 | US6706975 Paste for filling throughhole and printed wiring board using same |
| 03/16/2004 | US6706973 Electrical connection with inwardly deformable contacts |
| 03/16/2004 | US6706564 Method for fabricating semiconductor package and semiconductor package |
| 03/16/2004 | US6706556 Making interconnections to a non-flat surface |
| 03/16/2004 | US6706547 Method of manufacturing a circuit device with trenches in a conductive foil |
| 03/16/2004 | US6706466 Heat treating without removal of moisture |
| 03/16/2004 | US6706464 Prevent short circuiting; solvent-free dielectric films; exposure to actinic radiation |
| 03/16/2004 | US6706420 Platinum and rhodium nitrite salt or ammine- nitrite salt, ammonium hydroxide, hydrazine hydrate |
| 03/16/2004 | US6706418 For use in electroplating printed circuit boards and other electronic packaging devices |
| 03/16/2004 | US6706391 Adhesive is composed of a thermoset or photosetting resin composition including a base resin (especially a polyvinyl acetal), a polymerization inhibitor, and electroconductive particles. |
| 03/16/2004 | US6706326 Process for plating plastics using a catalytic filler |
| 03/16/2004 | US6706236 Method for making holes in ceramic green sheets |
| 03/16/2004 | US6706201 Method for producing metallized substrate materials |
| 03/16/2004 | US6706165 Forming electroconductive pattern |
| 03/16/2004 | US6705876 Electrical interconnect assemblies and methods |
| 03/16/2004 | US6705513 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 03/16/2004 | US6705511 Transducer and method of manufacture |
| 03/16/2004 | US6705509 Method of recovering lead-free solder from printed circuit boards |
| 03/16/2004 | US6705506 Inert atmosphere soldering apparatus |
| 03/16/2004 | US6705505 Paste providing method, soldering method and apparatus and system therefor |
| 03/16/2004 | US6705007 Polyimide precursor layer on a first metal layer, adding second metal layer, patterning metal layer to form circuit, imidating the polyimide precursor layer to form a polyimide insulating layer. |
| 03/16/2004 | US6705006 Method for replacing an electrical net on a printed circuit board |
| 03/16/2004 | US6705005 Method of forming assemblies of circuit boards in different planes |
| 03/16/2004 | US6705003 Printed wiring board with plurality of interconnect patterns and conductor bumps |
| 03/16/2004 | CA2097017C Non-chlorinated cleaner-drier |
| 03/11/2004 | WO2004021753A1 Electronic module |
| 03/11/2004 | WO2004021752A1 Method for producing circuit board and circuit board |
| 03/11/2004 | WO2004021751A1 Production of electronic organic circuits by contact printing |
| 03/11/2004 | WO2004021749A2 Manufacture of flexible printed circuit boards |
| 03/11/2004 | WO2004021489A2 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 03/11/2004 | WO2004021480A1 Method for connecting an aluminum charge eliminator of a flat battery to a contact |
| 03/11/2004 | WO2004021455A1 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module |
| 03/11/2004 | WO2004021436A1 A packaged semiconductor with coated leads and method therefore |
| 03/11/2004 | WO2004021435A1 Module part |
| 03/11/2004 | WO2004021366A2 Mixtures comprising thiophene/anion dispersions and certain additives for producing coatings exhibiting improved conductivity, and methods related thereto |
| 03/11/2004 | WO2004020209A1 Screen printing method |
| 03/11/2004 | WO2003087937A3 Waterborne printed circuit board coating compositions |
| 03/11/2004 | WO2003038865A3 Stacking multiple devices using direct soldering |
| 03/11/2004 | WO2003018213A3 Silanated copper foils, method of making, and use thereof |
| 03/11/2004 | WO2003007338A3 Method for attaching an electronic component to a substrate |
| 03/11/2004 | WO2002096168A3 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 03/11/2004 | US20040048524 Bus bar |
| 03/11/2004 | US20040048504 Electrical connector having a solder-array interface surface |
| 03/11/2004 | US20040048501 Electronic assembly having a removable power supply |
| 03/11/2004 | US20040048498 Metallic surface mount technology power connector |
| 03/11/2004 | US20040048497 High density interconnects |
| 03/11/2004 | US20040048486 Method for roughening copper surfaces for bonding to substrates |
| 03/11/2004 | US20040048465 Method of forming conductor wiring pattern |
| 03/11/2004 | US20040048417 Techniques for joining an opto-electronic module to a semiconductor package |