| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/23/2004 | US6710867 Device and method for inspecting a three-dimensional surface structure |
| 03/23/2004 | US6710612 CSP BGA test socket with insert and method |
| 03/23/2004 | US6710610 Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device |
| 03/23/2004 | US6710607 Method and apparatus for inspection |
| 03/23/2004 | US6710540 Electrostatically-addressable electrophoretic display |
| 03/23/2004 | US6710457 Integrated circuit carrier |
| 03/23/2004 | US6710444 Molded substrate stiffener with embedded capacitors |
| 03/23/2004 | US6710440 Low resistance contact for an integrated circuit |
| 03/23/2004 | US6710373 Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
| 03/23/2004 | US6710304 Cartridge type soldering iron with a releasable and replaceable handle |
| 03/23/2004 | US6710290 Method for processing ceramic green sheet and laser beam machine used therefor |
| 03/23/2004 | US6710289 Laser processing apparatus and method |
| 03/23/2004 | US6710288 Method and apparatus for aligning a work piece in a laser drilling system |
| 03/23/2004 | US6710265 Multi-strand substrate for ball-grid array assemblies and method |
| 03/23/2004 | US6710264 Method and apparatus for supporting a circuit component having solder column interconnects using external support |
| 03/23/2004 | US6710263 Semiconductor devices |
| 03/23/2004 | US6710261 Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board |
| 03/23/2004 | US6710260 Printed circuit board and manufacturing method of the printed circuit board |
| 03/23/2004 | US6710259 Overcoating nonconductor with carbon; pretreating for electroplating; printed circuits |
| 03/23/2004 | US6710258 Circuitized substrate for high-frequency applications |
| 03/23/2004 | US6710257 Circuit encapsulation |
| 03/23/2004 | US6710256 Apparatus for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member |
| 03/23/2004 | US6710255 Printed circuit board having buried intersignal capacitance and method of making |
| 03/23/2004 | US6710252 Method for connecting flat film cables |
| 03/23/2004 | US6709988 Production process of electronic component using wet etching, electronic component, and suspension for hard disk |
| 03/23/2004 | US6709979 Method of manufacturing a semiconductor device |
| 03/23/2004 | US6709966 Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device |
| 03/23/2004 | US6709964 Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints |
| 03/23/2004 | US6709963 Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps |
| 03/23/2004 | US6709962 Process for manufacturing printed circuit boards |
| 03/23/2004 | US6709944 Techniques for fabricating a resistor on a flexible base material |
| 03/23/2004 | US6709890 Method of manufacturing semiconductor integrated circuit device |
| 03/23/2004 | US6709806 Electroconductive zones on dielectric |
| 03/23/2004 | US6709803 Conductor pattern is formed on surface of insulating substrate by electroless copper plating; anionic surfactant suppresses adsorption of palldium-tin mixed colloid catalyst to the plating resist solution; electronics |
| 03/23/2004 | US6709769 Copper-aluminium-copper material joined by single ultrasonic weld |
| 03/23/2004 | US6709741 FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler |
| 03/23/2004 | US6709714 Raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer |
| 03/23/2004 | US6709606 Anisotropic conductive film and production method thereof |
| 03/23/2004 | US6709469 Spacer plate solder ball placement fixture and methods therefor |
| 03/23/2004 | US6709285 Electric connecting elements for piezoelectric plates |
| 03/23/2004 | US6708873 Apparatus and method for filling high aspect ratio via holes in electronic substrates |
| 03/23/2004 | US6708872 Method and apparatus for applying solder to an element on a substrate |
| 03/23/2004 | US6708871 Solder mask formed of laser ablatable material overlying the pads, and dispensing liquid solder onto the pads. |
| 03/23/2004 | US6708868 Method for producing weld points on a substrate and guide for implementing said method |
| 03/23/2004 | US6708863 Heat bonding method and heat bonding device |
| 03/23/2004 | US6708506 Display apparatus for refrigerator |
| 03/23/2004 | US6708404 Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole |
| 03/23/2004 | US6708401 Method of manufacturing article having electronic circuit |
| 03/23/2004 | US6708400 Method of attaching printed circuits boards within an electronic module housing |
| 03/23/2004 | US6708399 Method for fabricating a test interconnect for bumped semiconductor components |
| 03/18/2004 | WO2004023859A1 Apparatus and method for replacing defective pcb of pcb panel |
| 03/18/2004 | WO2004023854A1 Controlled depth etched dielectric film |
| 03/18/2004 | WO2004023597A1 Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method |
| 03/18/2004 | WO2004023541A1 Pattern formation substrate and method of pattern formation |
| 03/18/2004 | WO2004023540A1 Basic material for patterning and patterning method |
| 03/18/2004 | WO2004023523A2 Apparatus and process for manufacturing solder balls |
| 03/18/2004 | WO2004023122A1 Pattern inspection method and inspection device therefor |
| 03/18/2004 | WO2004022814A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 03/18/2004 | WO2004022663A1 Conductive adhesive and circuit comprising it |
| 03/18/2004 | WO2004022351A2 Method and apparatus for releasing materials from stencils |
| 03/18/2004 | WO2004022338A2 Printing method using rubber stamp |
| 03/18/2004 | WO2004022332A1 Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system |
| 03/18/2004 | WO2004014479A3 Insulated implantable electrical circuit |
| 03/18/2004 | WO2003104901A3 Cleaning compositions for microelectronic substrates |
| 03/18/2004 | WO2003100846A3 Glass material for use at high frequencies |
| 03/18/2004 | WO2003099709A3 Method for patterning carbon nanotube coating and carbon nanotube wiring |
| 03/18/2004 | WO2003075340A3 Method for obtaining metal to metal contact between a metal surface and a bonding pad. |
| 03/18/2004 | WO2003030252B1 Process for producing interconnects |
| 03/18/2004 | WO2002098582A3 Dimensionally stable composite article and method of making the same |
| 03/18/2004 | US20040054980 Embossed mask lithography |
| 03/18/2004 | US20040054031 Optical reflectance modulated by electricity |
| 03/18/2004 | US20040053529 Device for temporarily fastening electronic component to circuit board |
| 03/18/2004 | US20040053497 Large line conductive pads for interconnection of stackable circuitry |
| 03/18/2004 | US20040053489 Multilayer wiring substrate, and method of producing same |
| 03/18/2004 | US20040053488 Ball electrode forming method |
| 03/18/2004 | US20040053034 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module |
| 03/18/2004 | US20040053020 Laminate for forming capacitor layer and method for manufacturing the same |
| 03/18/2004 | US20040053019 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil |
| 03/18/2004 | US20040053014 Multilayer printed circuit board |
| 03/18/2004 | US20040053011 Document structure with circuit elements |
| 03/18/2004 | US20040052945 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 03/18/2004 | US20040052932 Method of manufacturing a printed wiring board |
| 03/18/2004 | US20040052678 Tin, silver, bismuth alloy |
| 03/18/2004 | US20040052478 Optical module mounted body and securing method of optical module |
| 03/18/2004 | US20040052061 Mounting structure of wireless module having excellent productivity |
| 03/18/2004 | US20040052060 Low profile chip scale stacking system and method |
| 03/18/2004 | US20040052059 Parallel printed circuit board assembly |
| 03/18/2004 | US20040052035 Method of producing electronic unit of radio system and electronic unit |
| 03/18/2004 | US20040051666 Low cost antennas using conductive plastics or conductive composites |
| 03/18/2004 | US20040051618 Electronics component and method for fabricating same |
| 03/18/2004 | US20040051171 Surface mountable electronic device |
| 03/18/2004 | US20040051169 Lead-bond type chip package and manufacturing method thereof |
| 03/18/2004 | US20040050911 Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB |
| 03/18/2004 | US20040050910 Flatwire repair tool systems and methods |
| 03/18/2004 | US20040050905 Processing device, processing method, and production equipment using the device and the method |
| 03/18/2004 | US20040050904 Solder hierarchy for lead free solder joint |
| 03/18/2004 | US20040050903 Solder ball |
| 03/18/2004 | US20040050711 Substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution |
| 03/18/2004 | US20040050708 Capable of forming a plated layer on a circuit board without a power supply line for gold-plating at a pad |
| 03/18/2004 | US20040050586 Circuit board where circuit terminals are interconnected and method of fabricating the same |