| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/25/2004 | WO2003081725B1 A miniaturized contact spring |
| 03/25/2004 | WO2003059027A8 System for producing electrical and integrated circuits |
| 03/25/2004 | WO2003054486A8 Optical encoder device |
| 03/25/2004 | WO2003029518A3 Precious metal recovery |
| 03/25/2004 | US20040059455 Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate |
| 03/25/2004 | US20040058593 Coupling adjusting structure for double-tuned circuit |
| 03/25/2004 | US20040058565 Electrical connector having improved elastomeric contact pressure pad |
| 03/25/2004 | US20040058561 Photo-thermal induced diffusion |
| 03/25/2004 | US20040058521 Photo-thermal induced diffusion |
| 03/25/2004 | US20040058470 Methods of forming a contact array in situ on a substrate and resulting substrate assemblies |
| 03/25/2004 | US20040058276 Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating thereto |
| 03/25/2004 | US20040058192 Can be applied to a wiring structure, a circuit |
| 03/25/2004 | US20040058143 Resin composition, process for producing the same and electrophotographic fixing member |
| 03/25/2004 | US20040058136 For use in electronic apparatus |
| 03/25/2004 | US20040058088 Preparing a substrate of a polymer material; surface-modifying the substrate; forming a seed layer on the substrate; and forming the thick film on the seed layer |
| 03/25/2004 | US20040058071 Colloidal seed formation for printed circuit board metallization |
| 03/25/2004 | US20040058067 For electroless plating |
| 03/25/2004 | US20040057222 Method of making a center bond flip chip semiconductor carrier |
| 03/25/2004 | US20040057221 Dynamic isolating mount for processor packages |
| 03/25/2004 | US20040057220 Electronic apparatus |
| 03/25/2004 | US20040057184 Circuit board with added impedance |
| 03/25/2004 | US20040057176 Fabric and yarn structures for improving signal integrity in fabric-based electrical circuits |
| 03/25/2004 | US20040056939 Direct positive image photo-resist transfer of substrate design |
| 03/25/2004 | US20040056673 Test method for semiconductor components using conductive polymer contact system |
| 03/25/2004 | US20040056345 Masking an electronic component substrate, applying a temporary mask material, forcing the filler through the hole in the temporary mask; printed circuit boards and integrated circuits |
| 03/25/2004 | US20040056344 Multi-chip circuit module and method for producing the same |
| 03/25/2004 | US20040056330 Fine line circuitization |
| 03/25/2004 | US20040056236 Mixtures of electroconductive nickel and gold plated plastic grains, and polymers as binders |
| 03/25/2004 | US20040056233 Liquid crystalline polymeric compositions |
| 03/25/2004 | US20040056078 Individual selective rework of defective BGA solder balls |
| 03/25/2004 | US20040056068 Reflow soldering apparatus and method for selective infrared heating |
| 03/25/2004 | US20040056067 Process and apparatus for flow soldering |
| 03/25/2004 | US20040056009 Multiple beam micro-machining system and method |
| 03/25/2004 | US20040055785 Fat conductor |
| 03/25/2004 | US20040055784 Solder interconnections for flat circuits |
| 03/25/2004 | US20040055783 Automotive electronic control unit |
| 03/25/2004 | US20040055782 Surface-mounting type electronic circuit unit having no melting of solder attaching electric part thereto |
| 03/25/2004 | US20040055770 EMI shield that adheres to and conforms with printed circuit board surfaces |
| 03/25/2004 | US20040055703 Process for securing a microwave module to a support |
| 03/25/2004 | US20040055503 Method and solution for treating fluorocarbon surfaces |
| 03/25/2004 | US20040055153 Method for producing a molding with an integrated conductor run, and a molding |
| 03/25/2004 | US20040055152 Bonding of a multi-layer circuit to a heat sink |
| 03/25/2004 | US20040055126 Fabrication of liquid emission device with symmetrical electrostatic mandrel |
| 03/25/2004 | DE4301570B4 Verfahren zur Herstellung einer Induktionsspule A process for producing an induction coil |
| 03/25/2004 | DE20217460U1 Elektrisches Kontaktelement Electrical contact element |
| 03/25/2004 | DE19818452B4 Elektronische Schaltung mit einer in Gießharz eingebetteten Leiterplatte und Verfahren zu ihrer Herstellung An electronic circuit comprising an embedded in cast resin printed circuit board and process for its preparation |
| 03/25/2004 | DE19704600B4 Armaturenbrett mit leitendem Gehäuse Dashboard with conductive housing |
| 03/25/2004 | DE10349584A1 Electrically conducting connection used in the production of a circuit board comprises forming a contact surface on a pin and/or bushing through a soft electrically conducting metallic external layer applied on a diffusion barrier layer |
| 03/25/2004 | DE10341053A1 Verbindungsstruktur eines Flachkabels und Verbindungsverfahren A flat cable connection structure and connection method |
| 03/25/2004 | DE10248112A1 Multilayer circuit board manufacture, e.g. for motor vehicle control device, by creating groove by machining to remove region of at least one rigid individual layer |
| 03/25/2004 | DE10241662A1 Ribbon cable conductor soldering process monitoring method using detection and evaluation of counter magnetic field variations for determining temperature and conductivity variations |
| 03/25/2004 | DE10241658A1 Partially soldering electrical conductors, comprises removing the insulation from the conducting material, heating the conductor by induction, and supplying solder and flux |
| 03/25/2004 | DE10241643A1 Ribbon cable connection device uses induction coil for providing heating of solder connections between corresponding cable conductors |
| 03/25/2004 | DE10241619A1 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 03/25/2004 | DE10240685A1 Production of a strip conductor foil comprises pressing a foil made from an electrically conducting material with a coating using a stamp on a plastic film under the action of heat, and removing the foil from the plastic film |
| 03/24/2004 | EP1401250A1 Electrodes with a mesh structure |
| 03/24/2004 | EP1401065A1 Method for fixing electronic plug connectors |
| 03/24/2004 | EP1400848A1 Circuitry with embossed portions |
| 03/24/2004 | EP1400613A2 Tin plating method |
| 03/24/2004 | EP1400545A2 Halo resistant photoimagable coverlay compositions |
| 03/24/2004 | EP1400500A1 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 03/24/2004 | EP1399978A1 Surface-mountable, radiation-emitting component and method for the production thereof |
| 03/24/2004 | EP1399951A2 Interchangeable microdeposition head apparatus and method |
| 03/24/2004 | EP1399950A2 Formation of printed circuit board structures using piezo microdeposition |
| 03/24/2004 | EP1399936A1 Capacitor |
| 03/24/2004 | EP1399935A1 Improved method for forming magnetic layers in printed circuit boards |
| 03/24/2004 | EP1399879A1 Multi-feature-size electronic structures |
| 03/24/2004 | EP1399519A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
| 03/24/2004 | EP1399269A1 Waveform generator for microdeposition control system |
| 03/24/2004 | EP1399268A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 03/24/2004 | EP1399267A1 Microdeposition apparatus |
| 03/24/2004 | EP1138180B1 Printed circuit board and method for fabricating such board |
| 03/24/2004 | EP0975953B1 Device for inspecting test objects and the use thereof |
| 03/24/2004 | EP0843955B1 Method of forming raised metallic contacts on electrical circuits |
| 03/24/2004 | CN2607716Y Printing screen frame with vibrating device |
| 03/24/2004 | CN2607715Y Circuit board printing form easy-to-demould |
| 03/24/2004 | CN1484935A Production of antenna devices |
| 03/24/2004 | CN1484934A Via-in-pad with off-center geometry and method of manufacture |
| 03/24/2004 | CN1484878A Surface mount connector lead |
| 03/24/2004 | CN1484869A Fuel cell electric equipment electronic board manufacturing method of electric board connector for fuel cell wiring member and mounting method of fuel cell |
| 03/24/2004 | CN1484854A A method and an arrangement for providing vias in printed circuit boards |
| 03/24/2004 | CN1484482A Multi-layer wire distributed substrate and mfg method |
| 03/24/2004 | CN1484481A Method for preventing meltback of electroplating tin-lead surface |
| 03/24/2004 | CN1484080A Active matrix substrate, liquid crystal display apparatus waving same, method for mfg of same |
| 03/24/2004 | CN1484033A Detection card and preparation, method thereof |
| 03/24/2004 | CN1143375C Semiconductor device, method of manufacture, circuit board and electronic device |
| 03/24/2004 | CN1143374C Semiconductor device, method of manufacture thereof, circuit board and electronic device |
| 03/24/2004 | CN1143373C Semiconductor device, method of manufacture thereof circuit board and electronic device |
| 03/24/2004 | CN1143330C Surface mounting coil |
| 03/24/2004 | CN1143172C Connection wiring base board of electro-optical board, electro-optical device and electronic device |
| 03/24/2004 | CN1143170C Tape carrier package and display device using the same |
| 03/24/2004 | CN1143010C Metal foil with raised bonding capacity for base and its manufacturing method |
| 03/24/2004 | CN1142843C Pb-free solder-connected structure and electronic device |
| 03/23/2004 | US6711031 Wire management system |
| 03/23/2004 | US6711030 Interconnecting method of wiring in printed circuit boards and printed circuit board unit |
| 03/23/2004 | US6711029 Low temperature co-fired ceramic with improved shrinkage control |
| 03/23/2004 | US6711026 Sash for land grid arrays |
| 03/23/2004 | US6711025 Combination device of the IC connection device and the main board |
| 03/23/2004 | US6711024 Flexible microsystem and building techniques |
| 03/23/2004 | US6711021 Systems and methods that use at least one component to remove the heat generated by at least one other component |