| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/01/2004 | DE10243637A1 Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von sterr-flexiblen Leiterplatten Circuit board with at least one rigid and at least one flexible region as well as methods for producing sterr-flexible PCB |
| 04/01/2004 | DE10243113A1 Elektrische Baugruppe und deren Verwendung Electrical assembly and their use |
| 04/01/2004 | DE10223203B4 Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung The electronic component module and method for its production |
| 03/31/2004 | EP1404167A1 Method for producing multilayer wiring circuit board |
| 03/31/2004 | EP1404166A1 Multilayer flexible wiring circuit board and its manufacturing method |
| 03/31/2004 | EP1404165A1 Method for manufacturing multilayer wiring board |
| 03/31/2004 | EP1404164A1 Method for manufacturing printed circuit boards from an extruded polymer |
| 03/31/2004 | EP1403686A2 Liquid crystal display device |
| 03/31/2004 | EP1403685A2 Liquid crystal display device |
| 03/31/2004 | EP1403228A1 Ceramic component and production method therefor |
| 03/31/2004 | EP1403055A1 Method of fabrication of electrostatic liquid emission device |
| 03/31/2004 | EP1403050A1 Inkjet head and manufacturing method of the same |
| 03/31/2004 | EP1402990A1 Solder composition |
| 03/31/2004 | EP1402989A1 Leach-resistant solder alloys for silver-based thick-film conductors |
| 03/31/2004 | EP1402988A1 The use of a solder on surfaces coated with nickel by electroless plating |
| 03/31/2004 | EP1402615A1 Housing part for an electric adjusting drive |
| 03/31/2004 | EP1402543A1 Material and method for making an electroconductive pattern |
| 03/31/2004 | EP1402321A1 Resist curable resin composition and cured article thereof |
| 03/31/2004 | EP1401984A1 Ultraviolet activatable adhesive film |
| 03/31/2004 | EP1401659A1 Corrosion prevention for cac component |
| 03/31/2004 | EP1401636A2 Partition plate and method for producing a partition plate for a multi-layer pressed stack |
| 03/31/2004 | EP1401609A1 Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates |
| 03/31/2004 | EP1169775B1 Predistortion generator coupled with an rf amplifier |
| 03/31/2004 | EP1153985B1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 03/31/2004 | EP1146101B1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 03/31/2004 | EP1133812B1 High density electrical connector |
| 03/31/2004 | CN2609320Y Hot air roaster for printed circuit board |
| 03/31/2004 | CN2609212Y Fastening wire spring sheet base |
| 03/31/2004 | CN1486561A Electromagnetically-coupled bus system |
| 03/31/2004 | CN1486504A Chromium adhesion layer for copper vias in low-K technology |
| 03/31/2004 | CN1486245A Lightweight circuit board with conductive constraining cores |
| 03/31/2004 | CN1486128A Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 03/31/2004 | CN1485937A Connector for button battery contained in electronic device |
| 03/31/2004 | CN1485865A Condenser and circuit board, method for producing the same |
| 03/31/2004 | CN1144327C Socket joint |
| 03/31/2004 | CN1144320C Connector with two rows of terminals having tail portions with similar impedance |
| 03/31/2004 | CN1144287C Integrated circuit assembly band and its producing method |
| 03/31/2004 | CN1144283C Circuit-board flattening method and method for producing semiconductor device |
| 03/31/2004 | CN1144277C 载体和半导体器件 Carrier and semiconductor device |
| 03/31/2004 | CN1144242C Sheet shape inducer |
| 03/31/2004 | CN1144087C Liquid crystal display device |
| 03/31/2004 | CN1143875C Composition and method for producing polythioethers having pendent methyl chain |
| 03/31/2004 | CN1143766C Retainer for punching ceramic green sheet and punching device |
| 03/30/2004 | US6715023 PCI bus switch architecture |
| 03/30/2004 | US6714431 Semiconductor package with a controlled impedance bus and method of forming same |
| 03/30/2004 | US6714422 High frequency module device and method for its preparation |
| 03/30/2004 | US6714421 Flip chip package substrate |
| 03/30/2004 | US6714420 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 03/30/2004 | US6714308 Rapid in-situ mastering of an aspheric fizeau |
| 03/30/2004 | US6714275 Liquid crystal display apparatus method for checking the joining accuracy thereof |
| 03/30/2004 | US6713963 Ultra-high pressure discharge lamp |
| 03/30/2004 | US6713880 Semiconductor device and method for producing the same, and method for mounting semiconductor device |
| 03/30/2004 | US6713867 Package for microwave components |
| 03/30/2004 | US6713860 Electronic assembly and system with vertically connected capacitors |
| 03/30/2004 | US6713854 Electronic circuit module with a carrier having a mounting pad array |
| 03/30/2004 | US6713853 Electronic package with offset reference plane cutout |
| 03/30/2004 | US6713852 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| 03/30/2004 | US6713792 Integrated circuit heat sink device including through hole to facilitate communication |
| 03/30/2004 | US6713719 Method and device for laser drilling laminates |
| 03/30/2004 | US6713688 Circuit board and its manufacture method |
| 03/30/2004 | US6713687 Printed wiring board and method for manufacturing printed wiring board |
| 03/30/2004 | US6713686 Apparatus and method for repairing electronic packages |
| 03/30/2004 | US6713685 Non-circular micro-via |
| 03/30/2004 | US6713683 Wiring board with terminals and method for manufacturing the same |
| 03/30/2004 | US6713682 Through hole conduction structure of flexible multilayer circuit board and forming method thereof |
| 03/30/2004 | US6713587 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
| 03/30/2004 | US6713417 Multilayer circuit board using a low-melting conductive metal; low temperature-fired mixture of mgal2o4 mg3b2o6 and/or mg2b2o5 and a glass powder of silicon oxide, boron oxide, aluminum oxide, and magnesium oxide |
| 03/30/2004 | US6713399 Carbon-conductive ink resistor printed circuit board and its fabrication method |
| 03/30/2004 | US6713389 Method of forming an electronic device |
| 03/30/2004 | US6713377 Method of electroless plating copper on nitride barrier |
| 03/30/2004 | US6713376 Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board |
| 03/30/2004 | US6713320 Bumping process |
| 03/30/2004 | US6713318 Flip chip interconnection using no-clean flux |
| 03/30/2004 | US6713210 Secondary cell protection circuit device and secondary cell assembly |
| 03/30/2004 | US6713163 Multilayered printed wiring board |
| 03/30/2004 | US6713143 Thermosetting low-dielectric resin composition and use thereof |
| 03/30/2004 | US6713000 Ultraviolet curable silver composition and related method |
| 03/30/2004 | US6712626 Electrical connector with continuous strip contacts |
| 03/30/2004 | US6712625 Electronic component and a method of manufacturing the same |
| 03/30/2004 | US6712621 Thermally enhanced interposer and method |
| 03/30/2004 | US6712486 Mounting arrangement for light emitting diodes |
| 03/30/2004 | US6712262 Benzimidazole and iodine compounds |
| 03/30/2004 | US6712261 Solid conductive element insertion apparatus |
| 03/30/2004 | US6712260 Bump reflow method by inert gas plasma |
| 03/30/2004 | US6711999 Screen printing apparatus |
| 03/30/2004 | US6711997 Device to produce electronic circuits |
| 03/30/2004 | US6711815 Fabricating method of semiconductor devices |
| 03/30/2004 | US6711814 Method of making printed circuit board having inductive vias |
| 03/30/2004 | US6711813 Planarizing outer surface; isostatic pressingl; lamination; etching |
| 03/30/2004 | US6711812 Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
| 03/30/2004 | US6711811 Method to assemble a uniform force hydrostatic bolster plate |
| 03/30/2004 | US6711810 Method of assembling a land grid array module |
| 03/30/2004 | US6711797 Hydraulic tooling fixture |
| 03/30/2004 | CA2300522C Revenue meter bayonet assembly and method of attachment |
| 03/25/2004 | WO2004026010A1 Circuit-component-containing module |
| 03/25/2004 | WO2004026009A1 Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
| 03/25/2004 | WO2004025737A1 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system |
| 03/25/2004 | WO2004025724A1 Jet singulation of a substrate |
| 03/25/2004 | WO2003091788A3 Process for forming a patterned thin film conductive structure on a substrate |
| 03/25/2004 | WO2003088354A3 Method for producing a copy protection for an electronic circuit and corresponding component |