| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/06/2004 | US6717071 Coaxial via hole and process of fabricating the same |
| 04/06/2004 | US6717070 Printed wiring board having via and method of manufacturing the same |
| 04/06/2004 | US6717069 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 04/06/2004 | US6717068 Circuit board capable of preventing electrostatic breakdown and magnetic head using the same |
| 04/06/2004 | US6717067 Circuit board and a method for making the same |
| 04/06/2004 | US6717066 Electronic packages having multiple-zone interconnects and methods of manufacture |
| 04/06/2004 | US6717065 Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board |
| 04/06/2004 | US6717064 Substrate piece and flexible substrate |
| 04/06/2004 | US6717063 Multi-layer circuit board with supporting layers of different materials |
| 04/06/2004 | US6717062 Battery pack and battery case used for the same, and method for producing the same |
| 04/06/2004 | US6717061 Stacking of multilayer modules |
| 04/06/2004 | US6717060 Circuit board consisting of at least two individual circuit board layers made of plastic |
| 04/06/2004 | US6717059 Circuit board and connection structure of terminal portion of the same |
| 04/06/2004 | US6716892 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 04/06/2004 | US6716767 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 04/06/2004 | US6716673 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 04/06/2004 | US6716572 Manufacturing process for printed wiring board |
| 04/06/2004 | US6716530 Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them |
| 04/06/2004 | US6716332 Plating method and apparatus |
| 04/06/2004 | US6716290 Method for removing soldering flux residue from a substrate |
| 04/06/2004 | US6716281 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
| 04/06/2004 | US6716072 Systems and methods for disposing a circuit board component on a circuit board using a soldering pin |
| 04/06/2004 | US6716067 Multi-connector for use in high-speed communication apparatus and method for mounting the same multi-connector into printed board |
| 04/06/2004 | US6716060 Electrical connector with solder plate and pegs for PC board mounting |
| 04/06/2004 | US6716038 Z-axis connection of multiple substrates by partial insertion of bulges of a pin |
| 04/06/2004 | US6716037 Flexible electric-contact structure for IC package |
| 04/06/2004 | US6716036 Method of attaching circuitry to a modular jack connector using electrically conductive paste |
| 04/06/2004 | US6715937 Optical module |
| 04/06/2004 | US6715415 Screen printing apparatus having rotatable united squeegee pair, and method of screen printing using said apparatus |
| 04/06/2004 | US6715413 Supplying creamy solder paste onto the mask and sliding squeegees; solder paste is printed on the substrate through the pattern openings; pattern is inspected |
| 04/06/2004 | US6715204 Printed wiring board and method for producing the same |
| 04/06/2004 | US6715203 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 04/06/2004 | CA2245775C Method and device for bonding a wire conductor |
| 04/01/2004 | WO2004028225A1 Printing process and solder mask ink composition |
| 04/01/2004 | WO2004028224A1 Plating process |
| 04/01/2004 | WO2004028223A2 Electronics component and method for fabricating same |
| 04/01/2004 | WO2004028126A1 Electrical subassembly and use thereof |
| 04/01/2004 | WO2004027919A2 Activation layer controlled variable impedance transmission line |
| 04/01/2004 | WO2004027866A2 Method for creating a link in an integrated metal substrate |
| 04/01/2004 | WO2004027115A1 Method and solution for treating fluorocarbon surfaces |
| 04/01/2004 | WO2004026984A1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 04/01/2004 | WO2004026977A1 Process and ink for making electronic devices |
| 04/01/2004 | WO2004026574A1 Method of producing laminates, and laminates |
| 04/01/2004 | WO2004026526A1 Bonding material and bonding method |
| 04/01/2004 | WO2004026524A1 Method of photo-thermal induced diffusion and apparatus with electrically conductive trace |
| 04/01/2004 | WO2004026517A2 Solder hierarchy for lead free solder joint |
| 04/01/2004 | WO2004012301A3 Method of curing an anisotropic conductive compound |
| 04/01/2004 | WO2003096389A3 Metal object to be at least partially coated with a substance |
| 04/01/2004 | WO2003094256A3 Barrier coatings and methods of making same |
| 04/01/2004 | WO2003092121A3 Three dimensional, high speed back-panel interconnection system |
| 04/01/2004 | WO2003090276A3 Method for the production of contact pads on a substrate and device for carrying out said method |
| 04/01/2004 | WO2003087590A3 Method of self-assembly and self-assembled structures |
| 04/01/2004 | WO2002091810A3 Printed circuit board |
| 04/01/2004 | US20040063849 Photosolder resist composition |
| 04/01/2004 | US20040063642 Novel benzimidazolone peptidomimetics as thrombin receptor antagonists |
| 04/01/2004 | US20040063352 Membrane probe with anchored elements |
| 04/01/2004 | US20040063341 Connecting method fo pins and tin balls of an electric connector |
| 04/01/2004 | US20040063340 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/01/2004 | US20040063332 COF semiconductor device and a manufacturing method for the same |
| 04/01/2004 | US20040063294 Techniques for fabricating a resistor on a flexible base material |
| 04/01/2004 | US20040063252 Method of making semiconductor device |
| 04/01/2004 | US20040063040 Providing asheet of dielectric surface being covered with a conductive bottom layer; forming a first set of vias; plating first set of vias with first metal up to first level, to form a vertical member of metal; removing excess amounts of metal |
| 04/01/2004 | US20040063025 Resist pattern, process for producing same, and utilization thereof |
| 04/01/2004 | US20040062896 Fractionally-releasable bonding layer for use in photo-sensitive laminate films |
| 04/01/2004 | US20040062858 Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method |
| 04/01/2004 | US20040062679 Comprises tin, copper, phosphorus, and germanium; may also contain silver, antimony, nickel, cobalt, iron, manganese, chromium, molybdenum, bismuth, indium and/or zinc; printed circuits; strength |
| 04/01/2004 | US20040062019 Multilayered circuit board |
| 04/01/2004 | US20040062015 Surface mounted electrical components |
| 04/01/2004 | US20040061747 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink |
| 04/01/2004 | US20040061566 EMI suppression method for powertrain control modules |
| 04/01/2004 | US20040061242 Semiconductor device power interconnect striping |
| 04/01/2004 | US20040061241 Semiconductor device power interconnect striping |
| 04/01/2004 | US20040061234 High reliability multlayer circuit substrates and methods for their formation |
| 04/01/2004 | US20040061232 Multilayer substrate |
| 04/01/2004 | US20040061226 Semiconductor device and contact-forming method therefor |
| 04/01/2004 | US20040061223 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 04/01/2004 | US20040061105 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 04/01/2004 | US20040060971 Method for the production of a soldered connection |
| 04/01/2004 | US20040060969 Structure and method for connecting flexible printed circuit board to inkjet print head |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060733 Structure for controlled shock and vibration of electrical interconnects |
| 04/01/2004 | US20040060731 Patterned electrically conductive polymers |
| 04/01/2004 | US20040060729 High frequency printed wiring board construction by plating conductive, thin film polymer on smooth copper surfaces of a core lamination to promote adhesion between the polymer of the laminate and the smooth copper surfaces. |
| 04/01/2004 | US20040060728 Method for producing electroconductive structures |
| 04/01/2004 | US20040060666 Electronic component component mounting equipment and component mounting method |
| 04/01/2004 | US20040060646 Method for manufacturing a ceramic multilayer circuit board |
| 04/01/2004 | US20040060574 Substrate processing method and substrate processing apparatus |
| 04/01/2004 | US20040060174 Method for producing wiring substrate |
| 04/01/2004 | US20040060173 Method for producing interconnection in a multilayer printed circuits |
| 04/01/2004 | US20040060171 Method and apparatus for connecting multiple coaxial cables to a printed circuit board in a compact |
| 04/01/2004 | US20040060169 Bettery pack and method of manufacturing the same |
| 04/01/2004 | US20040060162 Production of antenna devices |
| 04/01/2004 | DE4138818B4 Gehäuse zur Aufnahme elektronischer Komponenten und Verfahren zu seiner Herstellung Housing for accommodating electronic components and process for its preparation |
| 04/01/2004 | DE20320259U1 Solder includes introduced particles with metallic surfaces |
| 04/01/2004 | DE20319650U1 Flexible array of LEDs for creating illuminating surfaces by cutting circuit board into shape as needed |
| 04/01/2004 | DE20023435U1 Multi-layer conductor arrangement e.g. for the manufacture of compact electrical circuits, has at least two electrical conductor layers arranged one above the other on the carrier in different planes |
| 04/01/2004 | DE19714544B4 Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatine und Anordnung des Kondensators und der Platine A method for attaching a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the circuit board |
| 04/01/2004 | DE10333296A1 Vehicle-mounted electronic device e.g. heating-resistance type flow rate measuring device, has mounting portion provided at conductor wirings, whose shape is circular, elliptical or quadrangle |
| 04/01/2004 | DE10243814A1 Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat A process for producing a conductive coating on an insulating substrate |
| 04/01/2004 | DE10243693B3 Process for cleaning electronic circuit boards comprises feeding a carrier gas under pressure through a jet line to a jet nozzle, introducing liquid carbon dioxide via a feed line, converting into dry snow, and injecting into the jet line |