| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/08/2004 | US20040067348 Thin films containing microprojections; acoustic absorption; fineness apertures |
| 04/08/2004 | US20040067347 Method and structure for small pitch z-axis electrical interconnections |
| 04/08/2004 | US20040067312 Method for forming thin film and catalyzed treatment solution used therefor |
| 04/08/2004 | US20040066640 Expansion board apparatus and removing method |
| 04/08/2004 | US20040066638 Multilayered hybrid electronic module |
| 04/08/2004 | US20040066635 Film carrier tape for mounting electronic part and screen mask for solder resist coating |
| 04/08/2004 | US20040066634 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 04/08/2004 | US20040066633 Method for manufacturing printed wiring board |
| 04/08/2004 | US20040066617 Circuit board device and its manufacturing method |
| 04/08/2004 | US20040066589 Electronic device and interposer board |
| 04/08/2004 | US20040066478 Lamination of liquid crystal polymer dielectric films |
| 04/08/2004 | US20040065960 Electronic package with filled blinds vias |
| 04/08/2004 | US20040065954 Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials |
| 04/08/2004 | US20040065949 [solder bump] |
| 04/08/2004 | US20040065720 Apparatus and method to prevent oxidation of electronic devices |
| 04/08/2004 | US20040065718 Solder joint structure and method for soldering electronic components |
| 04/08/2004 | US20040065717 Multilayered metal laminate and process for producing the same |
| 04/08/2004 | US20040065639 Method and apparatus for surface processing of printed wiring board |
| 04/08/2004 | US20040065555 Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate |
| 04/08/2004 | US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues |
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | US20040065473 Warpage preventing substrate |
| 04/08/2004 | US20040065471 Electronic circuit board |
| 04/08/2004 | US20040065463 Electric junction box and process for producing the same |
| 04/08/2004 | US20040065404 Transfer body and method using the same |
| 04/08/2004 | US20040065401 Method to produce pedestal features in constrained sintered substrates |
| 04/08/2004 | US20040064942 Apparatus and methods for interconnecting components to via-in-pad interconnects |
| 04/08/2004 | US20040064941 Sockets for "springed" semiconductor device |
| 04/08/2004 | US20040064940 Method of manufacturing chip-type ceramic electronic component |
| 04/08/2004 | US20040064939 Structure having laser ablated features and method of fabricating |
| 04/08/2004 | DE20220757U1 Automated tool machine with several work stations such as a drill machine, comprises several drilling stations where each work station has a common control or tool set |
| 04/08/2004 | DE202004001683U1 Electronic circuit board uses inserts having contacts that provide a connection between surface conductor tracks |
| 04/08/2004 | DE19755185B4 Austausch Zinnbad Exchange tin bath |
| 04/08/2004 | DE10342964A1 Flachdrahtreparaturwerkzeugsysteme und -verfahren Flat wire repair tool systems and procedures |
| 04/08/2004 | DE10340069A1 Surface mountable opto-electronic device e.g. LED for backlighting, has body with surface having recesses to mount device, where electrical contacts are provided on surface including portions formed on inner surface of recesses |
| 04/08/2004 | DE10304176B3 Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors |
| 04/08/2004 | DE10258090A1 Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich Process for the preparation of rigid-flex circuits and printed circuit boards with at least one rigid portion and at least one flexible area |
| 04/08/2004 | DE10250919A1 Arrangement with integrated circuits with blocking capacitors and circuit boards has blocking capacitor(s) physically arranged between connection pins of housing and electrically connected to them |
| 04/08/2004 | DE10248388B3 Through contact method for conductor path foil of electronic data carrier e.g. chip card, using contact thread passed between opposite sides of conductor path foil via sewing process using hollow needle |
| 04/08/2004 | DE10245928A1 Process for the structured selective metallization of a surface of a substrate comprises preheating the substrate to a temperature below the deposition temperature of a predetermined metal and depositing the metal in predetermined regions |
| 04/08/2004 | DE10245635A1 Silk screen printing unit driving two or more parallel squeegees at same time to apply print solution to substrate for manufacture of electroluminescent display screen |
| 04/08/2004 | CA2754630A1 Multilayer substrate |
| 04/08/2004 | CA2498356A1 Multilayer substrate |
| 04/07/2004 | EP1406477A1 CORE SUBSTRATE, AND MULTILAYER CIRCUIT BOARD USING IT |
| 04/07/2004 | EP1406303A1 Power module and air conditioner |
| 04/07/2004 | EP1406271A1 Resistor element, stress sensor and method for manufacturing them |
| 04/07/2004 | EP1405552A1 Method for manufacturing ceramic multilayer circuit board |
| 04/07/2004 | EP1405446A2 System and method for integrating optical layers in a pcb for inter-board communications |
| 04/07/2004 | EP1405278A2 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 04/07/2004 | EP1404899A1 Method and electrode for defining and replicating structures in conducting materials |
| 04/07/2004 | EP1404481A2 A laser machining system and method |
| 04/07/2004 | EP1181569B1 A microvia inspection system |
| 04/07/2004 | EP1121602B1 Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 04/07/2004 | EP1051265A4 A method of forming a coating onto a non-random monolayer of particles, and products formed thereby |
| 04/07/2004 | CN2610608Y Preheating device of wave soldering |
| 04/07/2004 | CN2610607Y Wave soldering oscillation wave mechanism |
| 04/07/2004 | CN2610605Y Plate of normalization circuit board |
| 04/07/2004 | CN2609874Y Frame for conveying circuit board |
| 04/07/2004 | CN1488235A Method for making amultilevel circuitry comprising conductor tracks and micro-vias |
| 04/07/2004 | CN1488169A Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |
| 04/07/2004 | CN1488152A Multi-layer and user-configurable micro-printed circuit board |
| 04/07/2004 | CN1487784A Protection film coated on basic plate for multi-layer substrate formation use, apparatus and method for checking basic plates |
| 04/07/2004 | CN1487783A Manufacture of multilayer magnetic circuit board with built-in metal and resistor |
| 04/07/2004 | CN1487782A Semiconductor device and semiconductor assemblies |
| 04/07/2004 | CN1487781A Underlying pattern forming material for electrode and wiring material absorption and application thereof |
| 04/07/2004 | CN1487780A Electronic parts and mounting structure thereof |
| 04/07/2004 | CN1487583A Semiconductor package and producing method thereof and semiconductor device |
| 04/07/2004 | CN1487582A Semiconductor packaging element and method for packaging semiconductor |
| 04/07/2004 | CN1487575A Electronic parts bonding method and electronic parts bonding apparatus |
| 04/07/2004 | CN1487572A Formation of welding flux with resin parts as strengthening element |
| 04/07/2004 | CN1487472A Method for checking data production and substrate checking apparatus by the same method |
| 04/07/2004 | CN1487362A Impression mask photoetching |
| 04/07/2004 | CN1487359A Mask. wiring substrate for brazing filler metal printing and producing method thereof, and their application |
| 04/07/2004 | CN1487265A Position detecting method, position detecting apparatus and method for positioning printed circuit board |
| 04/07/2004 | CN1487250A Power source board and producing method thereof, and air conditioner outdoor apparatus using with the same electric power board |
| 04/07/2004 | CN1486813A Soft brazing method |
| 04/07/2004 | CN1145216C High density electric connector |
| 04/07/2004 | CN1145206C Film carrier tape, semiconductor assembly, semiconductor device and producing method thereof, mounting base plate |
| 04/07/2004 | CN1145154C Optical detector with HF overlapping circuit |
| 04/07/2004 | CN1144831C Electronic circuit device comprising epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 04/07/2004 | CN1144670C Copper foil for TAB band carrier and TAB carrier band using copper foil, and TAB band carrier |
| 04/07/2004 | CN1144669C 3D structure and producing method thereof |
| 04/07/2004 | CN1144648C Method for preventing connected tin forming in wave soldering |
| 04/07/2004 | CN1144644C Method for setting reflux furnace parameters for soldering surface mounted element |
| 04/07/2004 | CN1144635C Method for working industrial parts having holes with large height/broad ratio |
| 04/06/2004 | US6718057 Position error measurement method and device using positioning mark, and machining device for correcting position based on result of measuring position error using positioning mark |
| 04/06/2004 | US6717824 Printed wiring board unit, auxiliary substrate for hierarchical mounting, and electronic apparatus |
| 04/06/2004 | US6717822 Lead-frame method and circuit module assembly including edge stiffener |
| 04/06/2004 | US6717820 Circuit board assembly |
| 04/06/2004 | US6717819 Solderable flexible adhesive interposer as for an electronic package, and method for making same |
| 04/06/2004 | US6717794 Composite multilayered ceramic board and manufacturing method thereof |
| 04/06/2004 | US6717485 Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| 04/06/2004 | US6717421 Electric contact probe assembly |
| 04/06/2004 | US6717334 Electronic component and method for forming substrate electrode of the same |
| 04/06/2004 | US6717277 Electrical assembly with vertical multiple layer structure |
| 04/06/2004 | US6717276 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly |
| 04/06/2004 | US6717264 High density integrated circuit package |
| 04/06/2004 | US6717262 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 04/06/2004 | US6717259 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 04/06/2004 | US6717249 Non-contact type IC card and process for manufacturing-same |