| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/14/2004 | EP1408725A1 Process for producing ceramic circuit boards |
| 04/14/2004 | EP1408724A1 Circuit formed substrate and method of manufacturing circuit formed substrate |
| 04/14/2004 | EP1408586A1 Crimp connector |
| 04/14/2004 | EP1408584A1 Twisted flat electrical terminal |
| 04/14/2004 | EP1408543A2 Formation of solder balls having resin member as reinforcement |
| 04/14/2004 | EP1408520A2 Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 04/14/2004 | EP1408365A2 Circuit board and method of manufacturing the same |
| 04/14/2004 | EP1408364A1 Liquid crystal display device |
| 04/14/2004 | EP1408338A2 Method for making a probe card with multiple contact tips for testing integrated circuit |
| 04/14/2004 | EP1408337A2 Probe card assembly |
| 04/14/2004 | EP1408277A2 Lamps holder |
| 04/14/2004 | EP1407879A1 Heat-resistant resin film with metal layer and wiring board and method for manufacturing them |
| 04/14/2004 | EP1407644A1 Method for forming conducting layer onto substrate |
| 04/14/2004 | EP1407642A2 Defferential connector footprint for a multi-layer circuit board |
| 04/14/2004 | EP1407490A2 Single package containing multiple integrated circuit devices |
| 04/14/2004 | EP1407331A2 Incremental step drilling system and method |
| 04/14/2004 | EP1407062A1 Composite foil and its manufacturing process |
| 04/14/2004 | EP1406977A1 Selective deposition of circuit-protective polymers |
| 04/14/2004 | EP1406763A1 Screen printing apparatus |
| 04/14/2004 | EP1406745A1 Soldering flux vehicle additive |
| 04/14/2004 | EP1208014B1 Positive acting photoresist composition and imageable element |
| 04/14/2004 | CN2612208Y Rotary two-side welding article |
| 04/14/2004 | CN2612207Y Baking rack of circuit board |
| 04/14/2004 | CN2612064Y Vertical winding structure |
| 04/14/2004 | CN1489884A High frequency circuit block member, its manufacturing method, high refrequency module device and its manufaturing method |
| 04/14/2004 | CN1489883A Copper foil with insulation layer and its manufactuing method and printed wiring board using the copper foil with insulation layer |
| 04/14/2004 | CN1489788A Unmolded package for semiconductor device |
| 04/14/2004 | CN1489432A Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| 04/14/2004 | CN1489431A 多层电路板及其制造方法 The multilayer circuit board and its manufacturing method |
| 04/14/2004 | CN1489430A Large-wire conductive plate for interconnection of circuit capable of superposing |
| 04/14/2004 | CN1489429A Method for manufacturing circuit board and communication device |
| 04/14/2004 | CN1489428A Method and device for processing adhesive piece apparent |
| 04/14/2004 | CN1489427A Method for simultaneously pulling-out multi routings |
| 04/14/2004 | CN1489202A Electronic device module |
| 04/14/2004 | CN1489201A 半导体器件 Semiconductor devices |
| 04/14/2004 | CN1489106A IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| 04/14/2004 | CN1489091A Method for distinctive display for routing-passing zone |
| 04/14/2004 | CN1489090A Layout method of power source circuit for ball grid array chip |
| 04/14/2004 | CN1488933A Good-or-not decision device, decision programme, method and multi-variable statistical analyzing device |
| 04/14/2004 | CN1146309C Method for regulating thermal expansion of plate-shaped electronic elements and its structural member |
| 04/14/2004 | CN1146308C Method for making electronic circuit |
| 04/14/2004 | CN1146043C Via structure |
| 04/14/2004 | CN1146042C Bump formation method |
| 04/14/2004 | CN1146040C Substrate for semiconductor device, method of manufacturing the same, semiconductor device thereof |
| 04/14/2004 | CN1146030C Semiconductor device and manufacturling method thereof, semiconductor module, circuit board and electrnic equipment |
| 04/14/2004 | CN1145979C Circuit protection device |
| 04/14/2004 | CN1145802C Microelectronic spring contact element and electronic element thereof |
| 04/14/2004 | CN1145682C Small chip adhesion agent for microelectronic device |
| 04/14/2004 | CN1145541C Laser processing device and method |
| 04/13/2004 | US6721343 Laser processing apparatus with position controller |
| 04/13/2004 | US6721189 Memory module |
| 04/13/2004 | US6721188 Power supply for low profile equipment housing |
| 04/13/2004 | US6721187 Multi-layered high density connections |
| 04/13/2004 | US6721083 Electrophoretic displays using nanoparticles |
| 04/13/2004 | US6720690 Vibration motor holding apparatus and portable electronic equipment having the same |
| 04/13/2004 | US6720665 Enhanced pad design for substrate |
| 04/13/2004 | US6720652 Apparatus providing redundancy for fabricating highly reliable memory modules |
| 04/13/2004 | US6720651 Semiconductor plastic package and process for the production thereof |
| 04/13/2004 | US6720524 Method and apparatus for laser drilling |
| 04/13/2004 | US6720502 Integrated circuit structure |
| 04/13/2004 | US6720501 PC board having clustered blind vias |
| 04/13/2004 | US6720500 Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| 04/13/2004 | US6720499 Copper circuitry, and a finish coating of tin, and an alloy cap layer of at least two immersion-platable metals (tin and silver for example); solderable for at least a year |
| 04/13/2004 | US6720211 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 04/13/2004 | US6720208 Semiconductor device |
| 04/13/2004 | US6720127 Printed circuit substrate with controlled placement covercoat layer |
| 04/13/2004 | US6720120 Technique for providing the fine lines are applied to an electron-source substrate and an image forming apparatus. |
| 04/13/2004 | US6720084 Process for producing heat-resistant resin film having metallic thin film, process for producing endless belt, endless belt, and apparatus for forming image |
| 04/13/2004 | US6720077 Resin composition, and use and method for preparing the same |
| 04/13/2004 | US6719915 Step and flash imprint lithography |
| 04/13/2004 | US6719582 Method of making a flexible electrode bio-probe assembly |
| 04/13/2004 | US6719574 Angled electrical connector |
| 04/13/2004 | US6719570 Card-type portable device |
| 04/13/2004 | US6719187 Method of connecting circuit boards |
| 04/13/2004 | US6719185 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 04/13/2004 | US6719144 Method of separating oxide from dross, device for separating oxide from dross, and jet solder tank |
| 04/13/2004 | US6718858 Integrated circuit package separators |
| 04/13/2004 | US6718631 Process for producing a flexible wiring board |
| 04/08/2004 | WO2004030429A1 Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region |
| 04/08/2004 | WO2004030428A1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 04/08/2004 | WO2004030427A1 Flexible circuit with electrostatic damage limiting feature |
| 04/08/2004 | WO2004030099A1 Surface mounted electrical components and method for mounting an d retaining same |
| 04/08/2004 | WO2004030078A1 Joining apparatus |
| 04/08/2004 | WO2004030072A1 Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor |
| 04/08/2004 | WO2004030035A2 Via interconnect forming process and electronic component product thereof |
| 04/08/2004 | WO2004029994A2 Multilayer substrate |
| 04/08/2004 | WO2004029153A1 Thermosetting magnetic slurry and use thereof |
| 04/08/2004 | WO2004028823A1 Printing plate, circuit board and method of printing circuit board |
| 04/08/2004 | WO2004028816A1 Method and device for positioning electronic components |
| 04/08/2004 | WO2004028775A1 Method for producing laminated board and misregistration-preventing system for laminated board production |
| 04/08/2004 | WO2003106734A3 Metallisation |
| 04/08/2004 | WO2003006396B1 Bonding method and product |
| 04/08/2004 | US20040068061 Will not exhibit reduced adhesive forces as is typical in adhesives to which a large amount of filler is added; phenoxy resins are particularly preferred because they are highly miscible to epoxy resins |
| 04/08/2004 | US20040067714 Interactive LED device |
| 04/08/2004 | US20040067690 Connector and contact wafer |
| 04/08/2004 | US20040067663 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards |
| 04/08/2004 | US20040067447 Forming conducting metal lines through the dielectric photosensitive layer, by metallization on first layer, electrochemical process, metal electrodeposition, selectively exposing with light, selectively reduction of metal oxides |
| 04/08/2004 | US20040067444 Method for patterning electroconductive tin oxide film |
| 04/08/2004 | US20040067377 Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil |
| 04/08/2004 | US20040067349 Laminate and process for producing the same |