| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/20/2004 | US6724073 Plastic lead frames for semiconductor devices and packages including same |
| 04/20/2004 | US6724014 High-voltage hybrid circuit |
| 04/20/2004 | US6723999 Electromagnetic wave assisted chemical processing |
| 04/20/2004 | US6723928 Terminal pins mounted in flexible substrates |
| 04/20/2004 | US6723927 High-reliability interposer for low cost and high reliability applications |
| 04/20/2004 | US6723926 Mounting configuration of electric and/or electronic components on a printed circuit board |
| 04/20/2004 | US6723629 Method and apparatus for attaching solder members to a substrate |
| 04/20/2004 | US6723584 Methods of making microelectronic assemblies including compliant interfaces |
| 04/20/2004 | US6723575 Method of fabricating a shape memory alloy ink jet printing mechanism |
| 04/20/2004 | US6723494 Conductor pattern and electronic component having the same |
| 04/20/2004 | US6723390 Laser deposition of elements onto medical devices |
| 04/20/2004 | US6723388 Method of depositing nanostructured films with embedded nanopores |
| 04/20/2004 | US6723385 Process for the preliminary treatment of copper surfaces |
| 04/20/2004 | US6723251 Method for planarizing circuit board and method for manufacturing semiconductor device |
| 04/20/2004 | US6723192 Process for producing a thin film EL device |
| 04/20/2004 | US6722930 I-channel surface-mount connector |
| 04/20/2004 | US6722916 Surface battery clip |
| 04/20/2004 | US6722893 Test and burn-in connector |
| 04/20/2004 | US6722557 Pretreating and preheating |
| 04/20/2004 | US6722554 Soldering apparatus |
| 04/20/2004 | US6722553 Controlled and programmed deposition of flux on a flip-chip die by spraying |
| 04/20/2004 | US6722411 Mounting apparatus and mounting method |
| 04/20/2004 | US6722275 Reservoir stencil with relief areas and method of using |
| 04/20/2004 | US6722245 Punching unit |
| 04/20/2004 | US6722035 Method of manufacturing an ink ejecting device wherein electrodes formed within non-ejecting channels are divided and electrodes formed within ejecting channels are continuous |
| 04/20/2004 | US6722032 Method of forming a structure for electronic devices contact locations |
| 04/20/2004 | US6722031 Method for making printed circuit board having low coefficient of thermal expansion power/ground plane |
| 04/20/2004 | US6722029 Method of mounting an electrical component to a support |
| 04/20/2004 | US6722028 Method of making electronic device |
| 04/20/2004 | US6722027 Method of positioning of self-adjusting printed circuit board support |
| 04/20/2004 | CA2105493C Method and apparatus for assessing and restoring solderability |
| 04/15/2004 | WO2004032585A1 Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof |
| 04/15/2004 | WO2004032583A2 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 04/15/2004 | WO2004032582A1 Circuit materials, circuits, multi-layer circuits and methods of manufacture thereof |
| 04/15/2004 | WO2004032581A1 Electrical circuit arrangement |
| 04/15/2004 | WO2004032257A2 Film comprising organic semiconductors |
| 04/15/2004 | WO2004032234A2 Semiconductor device power interconnect striping |
| 04/15/2004 | WO2004032223A1 Semiconductor device |
| 04/15/2004 | WO2004032222A1 Selective connection in ic packaging |
| 04/15/2004 | WO2004032210A2 Monolithic structures including alignment and/or retention fixtures for accepting components |
| 04/15/2004 | WO2004032154A1 Techniques for fabricating a resistor on a flexible base material |
| 04/15/2004 | WO2004030994A1 Pre-cabled fitting part, connection branch and method for the production thereof |
| 04/15/2004 | WO2004030907A1 Laminate comprising silver layer and, formed thereon, layer for stabilizing the same |
| 04/15/2004 | WO2004030830A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 04/15/2004 | WO2004015441A3 Radio frequency identificaton device and method |
| 04/15/2004 | WO2003104854A3 Long range optical reader |
| 04/15/2004 | WO2003102267A8 Method for electroless metalisation of polymer substrate |
| 04/15/2004 | WO2003060960A3 High density area array solder microjoining interconnect structure and fabrication method |
| 04/15/2004 | WO2003052876A3 Method and apparatus for connecting circuit boards for a sensor assembly |
| 04/15/2004 | WO2003049514A3 Miniature rf and microwave components and methods for fabricating such components |
| 04/15/2004 | WO2002103718A9 Uv-curable inks for ptf laminates (including flexible circuitry) |
| 04/15/2004 | WO2002099161A3 Method for the deposition of materials from mesomorphous films |
| 04/15/2004 | WO2002092878A3 Electroless plating method and device, and substrate processing method and apparatus |
| 04/15/2004 | WO2001082362A8 Process for forming electrical/mechanical connections |
| 04/15/2004 | US20040073737 Electromagnetically-coupled bus system |
| 04/15/2004 | US20040072477 Holding element for holding a carrier board |
| 04/15/2004 | US20040072468 Apparatus and method for low-profile mounting of a multi-conductor coaxial cable launch to an electronic circuit board |
| 04/15/2004 | US20040072457 Hold down apparatus for perpendicularly mounted cards |
| 04/15/2004 | US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 04/15/2004 | US20040072455 Structure for mounting connector on board |
| 04/15/2004 | US20040072453 Twisted flat electrical terminal |
| 04/15/2004 | US20040072015 Composite material with improved binding strength and method for forming the same |
| 04/15/2004 | US20040070990 LED illuminator and method of manufacture |
| 04/15/2004 | US20040070959 Multi-layer board, its production method, and mobile device using multi-layer board |
| 04/15/2004 | US20040070953 Housing for Receiving a component which can be connected to the housing in a pluggable manner |
| 04/15/2004 | US20040070950 Voltage conversion module |
| 04/15/2004 | US20040070946 Power module and production method thereof |
| 04/15/2004 | US20040070915 Ceramic electronic component and production method therefor |
| 04/15/2004 | US20040070911 Controller system for bathing installation |
| 04/15/2004 | US20040070857 Rearview mirror assembly construction |
| 04/15/2004 | US20040070084 Solder ball assembly, a method for its manufacture, and a method of forming solder bumps |
| 04/15/2004 | US20040070082 Method for manufacturing an interconnected circuit board assembly and system |
| 04/15/2004 | US20040070074 Hybrid integrated circuit device |
| 04/15/2004 | US20040070068 Semiconductor package insulation film and manufacturing method thereof |
| 04/15/2004 | US20040070067 Semiconductor device |
| 04/15/2004 | US20040070010 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor |
| 04/15/2004 | US20040069840 Method and apparatus for filling a mask with solder paste |
| 04/15/2004 | US20040069839 Methods and apparatus for forming solder balls |
| 04/15/2004 | US20040069758 Method and device for applying a solder to a substrate |
| 04/15/2004 | US20040069649 Production method for flexible printed board |
| 04/15/2004 | US20040069646 Electrolytic treatment, such as plating or etching; providing a high resistance structure having an electrical conductivity lower than that of the electrolytic solution in the solution filled between a substrate in contact with an electrode |
| 04/15/2004 | US20040069636 Metal pattern formation |
| 04/15/2004 | US20040069529 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
| 04/15/2004 | US20040069528 Process for producing ceramic circuit boards |
| 04/15/2004 | US20040069400 ACF tape feeder machine, and method for feeding ACF tape |
| 04/15/2004 | US20040069397 Method and apparatus for determining processing size of bonding material |
| 04/15/2004 | US20040069112 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape |
| 04/15/2004 | US20040068869 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 04/15/2004 | US20040068868 Method of mounting camera module on wiring board |
| 04/15/2004 | DE202004001236U1 Circuit board for data communication systems, provides data cable connection by having twisted pair tracks formed using both sides |
| 04/15/2004 | DE10296416T5 Verfahren und Vorrichtung zur Registrierungssteuerung in der Produktion durch Belichten Method and apparatus for registration control in production by exposure |
| 04/15/2004 | DE10296415T5 Verfahren und Vorrichtung zum Drucken von Mustern und Substraten Method and apparatus for printing patterns and substrates |
| 04/15/2004 | DE10296376T5 Kohlenstoffdioxidlaser-Bearbeitungsverfahren von Mehrschichtmaterial Carbon dioxide laser processing method of multi-layer material |
| 04/15/2004 | DE10296028T5 Optische Codiervorrichtung Optical encoder |
| 04/15/2004 | DE10295972T5 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung Not manufactured in a mold package for a semiconductor device |
| 04/15/2004 | DE10257441A1 Elektrisches Bauelement und Anordnung mit dem Bauelement Electrical component and assembly with the component |
| 04/15/2004 | DE10192788T5 Verfahren und Vorrichtung zur Kantenverbindung zwischen Elementen einer integrierten Schaltung Method and device for edge connection between elements of an integrated circuit |
| 04/15/2004 | DE10147789B4 Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips Apparatus for soldering contacts on semiconductor chips |
| 04/15/2004 | DE10102848B4 Verfahren zum formschlüssigen und blasenfreien Verkleben von bestückten oder unbestückten gedruckten Schaltung mit planen Kühlkörpern unter Verwendung von Klebefolien Method for positive and bubble-free adhesion of assembled printed circuit bare or with planning heatsinks using adhesive films |
| 04/14/2004 | EP1408726A1 METHOD AND MATERIAL FOR MANUFACTURING CIRCUIT−FORMED SUBSTRATE |