| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/22/2004 | US20040077733 Stabilization of alkaline carbon or graphite particles in water and ammonia solutions while exposed to air during use, by acidification or purging with inert gases |
| 04/22/2004 | US20040077192 Connector |
| 04/22/2004 | US20040077189 Adhesive interconnector |
| 04/22/2004 | US20040077124 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
| 04/22/2004 | US20040077112 Conductive component manufacturing process employing an ink jet printer |
| 04/22/2004 | US20040077109 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods |
| 04/22/2004 | US20040076858 Coin cell protection against reverse insertion in cell holder |
| 04/22/2004 | US20040076832 For three-layer flexible printed circuit board; requires no roughening; improved adhesion with epoxy resins; corrosion resistance |
| 04/22/2004 | US20040076765 To impart improved adhesion to metal, by surface treating the polyimide with a solution of potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and then with an acid; peel strength |
| 04/22/2004 | US20040076744 Method for forming solder-resist film |
| 04/22/2004 | US20040076743 Using a mask during activation step so as to selectively activate only selected portions of the surface, thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used |
| 04/22/2004 | US20040076491 Female screw device pickable by a SMT automatic machine |
| 04/22/2004 | US20040076424 Camera and photographing lens barrel |
| 04/22/2004 | US20040076323 Inspection data producing method and board inspection apparatus using the method |
| 04/22/2004 | US20040075991 Vapor phase connection techniques |
| 04/22/2004 | US20040075988 Method of manufacturing circuit formed substrate |
| 04/22/2004 | US20040075946 Head gimbal assembly and method for manufacturing the same |
| 04/22/2004 | US20040075528 Printed circuit heaters with ultrathin low resistivity materials |
| 04/22/2004 | US20040075177 Wiring board, method of manufacturing the same, semiconductor device, circuit board, and electronic equipment |
| 04/22/2004 | US20040075168 Semiconductor device bonded on circuit board via coil spring |
| 04/22/2004 | US20040075165 Dual power supply method and apparatus |
| 04/22/2004 | US20040074952 Method of controlling solder deposition utilizing two fluxes and preform |
| 04/22/2004 | US20040074950 High temperature eutectic solder ball attach |
| 04/22/2004 | US20040074946 Solder ball holding terminal in a bga arrangement |
| 04/22/2004 | US20040074865 Hybrid interconnect substrate and method of manufacture thereof |
| 04/22/2004 | US20040074778 Plating bath and method for depositing a metal layer on a substrate |
| 04/22/2004 | US20040074671 Mutilayer wiring board, touch panel and manufacturing method of the same |
| 04/22/2004 | US20040074670 Connection structure between printed circuit board and flexible circuit board |
| 04/22/2004 | US20040074669 Circuit board and method of making circuit board |
| 04/22/2004 | US20040074660 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 04/22/2004 | US20040074651 Conformal coating enhanced to provide heat detection |
| 04/22/2004 | US20040074591 Apparatus for producing non-woven fabric |
| 04/22/2004 | US20040074519 Metal safe stabilized stripper for removing cured polymeric layers and negative tone acrylic photoresists |
| 04/22/2004 | US20040074358 Apparatus for processing binding film for manufacturing copper clad laminate board and circuit board |
| 04/22/2004 | US20040074089 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that |
| 04/22/2004 | US20040074088 Method for manufacturing multilayer circuit board for semiconductor device |
| 04/22/2004 | US20040074086 Method for forming conductor wire on a substrate board |
| 04/22/2004 | DE202004002332U1 Leiterplatte Circuit board |
| 04/22/2004 | DE10300344A1 Solder stop lacquer structured using a laser for protecting conductors on circuit boards comprises a solid body, has a specified coating viscosity and contains a flame protection agent |
| 04/22/2004 | DE10247746A1 Production of conducting fine, very fine and micro-structures and other flat constructions on a support used in electronic devices, involves applying conducting particles on the support body and forming a non-conducting layer on its surface |
| 04/22/2004 | DE10247567A1 Procedure to manufacture electrical component carrier having plastic housing with conductors stamped out of sheet metal with electronic components connected to them and all embedded in plastic of housing |
| 04/22/2004 | DE10246591A1 Punching die tool e.g. for punching holes into ceramic work pieces has die part fastened nondestructive via fastener system, to connection part for mounting on machine tool |
| 04/22/2004 | DE10246576A1 Method for fixing component on circuit board e.g. for motor vehicle controls, has end of component connected by laser welding seam over significant part of circumference |
| 04/22/2004 | DE10196368T5 Kontaktstruktur und Verfahren zu dessen Herstellung und eine Prüfkontaktanordnung, die diese verwendet Contact structure and method for its preparation and a test contact, which uses this |
| 04/22/2004 | DE10084799T5 Universelle eigensichere Schaltstromversorgung Universal intrinsically safe switching power supply |
| 04/21/2004 | EP1411594A2 High density electrical connector |
| 04/21/2004 | EP1411553A1 Electronic circuit component |
| 04/21/2004 | EP1411290A1 Diode lighting system |
| 04/21/2004 | EP1411147A1 Formaldehyde-free electroless copper plating process and solution for use in the process |
| 04/21/2004 | EP1411102A1 Releasable microcapsule and adhesive curing system using the same |
| 04/21/2004 | EP1410906A1 Laminate structures, methods for production thereof and uses thereof |
| 04/21/2004 | EP1410871A1 Lead-free solder ball |
| 04/21/2004 | EP1410866A2 Methods and apparatus for dispensing materials on a substrate |
| 04/21/2004 | EP1410705A1 Alignment plate with matched thermal coefficient of expansion |
| 04/21/2004 | EP1410704A1 Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks |
| 04/21/2004 | EP1410703A1 Sequentially processed circuitry |
| 04/21/2004 | EP1410702A1 Dielectric processing with included stabilization periods |
| 04/21/2004 | EP1410701A1 Method of manufacturing an integrated circuit carrier |
| 04/21/2004 | EP1410700A1 Integrated circuit carrier with recesses |
| 04/21/2004 | EP1410403A1 Low temperature method and compositions for producing electrical conductors |
| 04/21/2004 | EP1410320A1 Method for production of a conductor cross-over on a data support card |
| 04/21/2004 | EP1410062A2 Radar device |
| 04/21/2004 | EP1409992A2 Method and apparatus for improved process control in combustion applications |
| 04/21/2004 | EP1409194A2 Laser micromachining of electrical structures |
| 04/21/2004 | EP1409192A1 Method of ablating an opening in a hard, non-metallic substrate |
| 04/21/2004 | EP1325538B1 Method for connecting flat film cables |
| 04/21/2004 | EP1266234B1 Testing device for printed boards |
| 04/21/2004 | EP1255677B1 Method and apparatus of immobilizing solder spheres |
| 04/21/2004 | EP1153183B1 Key with integrated, electronic control circuit for a vehicle security system |
| 04/21/2004 | EP1123644B1 Method for producing multi-layer circuits |
| 04/21/2004 | CN2613126Y Cooling device for slab-shaped working piece |
| 04/21/2004 | CN2613125Y 板件冷却装置 Plate cooling device |
| 04/21/2004 | CN1491528A Method for producing wirings with rough conducting structures and at least one area with fine conducting structures |
| 04/21/2004 | CN1491462A Connector and contact wafer |
| 04/21/2004 | CN1491448A Circuit board device and its manufacturing mehtod |
| 04/21/2004 | CN1491440A Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/21/2004 | CN1491439A Multi-chip circuit module and method for producing the same |
| 04/21/2004 | CN1491433A Lead-free solder structure and method for high fatigue life |
| 04/21/2004 | CN1491077A Film bearing band for arranging electronic parts and printing screen mask for coating welding retardant |
| 04/21/2004 | CN1491076A Method for preparing wiring placode |
| 04/21/2004 | CN1491075A Manufacture of Jiekong network circuits |
| 04/21/2004 | CN1491073A Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board |
| 04/21/2004 | CN1491072A 多层布线板 The multilayer wiring board |
| 04/21/2004 | CN1490857A Structure of micro distance crystal covered carrier-board and manufacture thereof |
| 04/21/2004 | CN1490656A Electronic assembly and driving circuit placode therewith |
| 04/21/2004 | CN1490646A Mounting device and structure for semiconductor component, electro-optical device and producing method thereof |
| 04/21/2004 | CN1147021C Method for vertical connection of conductors in device in microwave range |
| 04/21/2004 | CN1146990C High-frequency integrated circuit device and mfr. method thereof |
| 04/21/2004 | CN1146974C Method of manufacturing multi-layered ceramic substrate |
| 04/21/2004 | CN1146927C Hybrid coil of printed circuit transformer of radio frequency mixer |
| 04/21/2004 | CN1146647C Anisotropic conductive adhesive and method for preparation thereof and electronic apparatus using said adhesive |
| 04/21/2004 | CN1146522C Surface treatment device |
| 04/20/2004 | US6725430 Process for designing high frequency circuits in multiple domains |
| 04/20/2004 | US6724905 Microphone unit mounting structure |
| 04/20/2004 | US6724638 Printed wiring board and method of producing the same |
| 04/20/2004 | US6724637 Apparatus and method for harnessing optical fiber to a circuit board |
| 04/20/2004 | US6724631 Power converter package with enhanced thermal management |
| 04/20/2004 | US6724095 Apparatus for aligning an integrated circuit package with an interface |
| 04/20/2004 | US6724083 Method of producing semiconductor packages by cutting via holes into half when separating substrate |
| 04/20/2004 | US6724081 Electronic assembly |