| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/29/2004 | US20040079244 Screen printing apparatus and method of the same |
| 04/29/2004 | US20040079195 Method for patterning metal using nanopraticle containing percursors |
| 04/29/2004 | US20040079193 Overcoating metal particles with high electroconductive paste; high density integrated circuits |
| 04/29/2004 | US20040078970 Multilayer electroconductive layers; electroless plating; patterning by isotropic etching to control thickness |
| 04/29/2004 | US20040078969 Method of manufacturing circuit board and communication appliance |
| 04/29/2004 | US20040078968 Printed circuit board manufacturing method |
| 04/29/2004 | US20040078967 Z-axis electrical contact for microelectronic devices |
| 04/29/2004 | US20040078966 Method of mounting electronic parts on wiring board |
| 04/29/2004 | US20040078965 Article with electronic circuit formed and method of manufacturing the same |
| 04/29/2004 | US20040078964 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| 04/29/2004 | US20040078963 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof |
| 04/29/2004 | US20040078957 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/29/2004 | DE29724810U1 Electrical or electronic device has externally accessible section for connecting conducting tracks on one circuit board side, both circuit board sides and/or adjacent circuit boards |
| 04/29/2004 | DE19934487B4 Durchlauftrockner für Platten oder Bahnen Continuous dryers for plates and sheets |
| 04/29/2004 | DE10348010A1 Mehrschichtleiterplatte, Verfahren zu deren Herstellung und Mehrschichtleiterplatte verwendendes Mobilgerät Multi-layer printed circuit board, process for their preparation and multilayer PCB-use mobile device |
| 04/29/2004 | DE10301516B3 Making conductive structures, selectively removes outer conductive layer from foam loaded with controlled concentration of conductive particles |
| 04/29/2004 | DE10296512T5 Quasi-kontinuierliches diodengepumptes Festkörper-Uv-Lasersystem und Verfahren zu seiner Anwendung Quasi-continuous diode-pumped solid-state laser Uv System and method for its use |
| 04/29/2004 | DE10295940T5 Plattenförmiger Schaltungsblock und Verfahren zu dessen Herstellung A plate-shaped circuit block and method of producing the |
| 04/29/2004 | DE10252308B3 Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
| 04/29/2004 | DE10249868B3 Verfahren zum Bohren von Löchern in einem aus Polymermaterial mit Glasfaserverstärkung gebildeten Substrat A method for drilling holes in a carrier formed from polymer material with glass fiber reinforcement substrate |
| 04/29/2004 | DE10247409A1 Ceramic substrate body for an electronic switch, comprises a ceramic substrate having a recess for an insertion body which is connected to the substrate via a foam |
| 04/29/2004 | DE10246953A1 Elektronische Schaltungsanordnung Electronic circuitry |
| 04/29/2004 | DE10134986B4 Verbindung gehäusegefaßter integrierter Speicherbausteine mit einer Leiterplatte Connection housing calmer integrated memory devices with a circuit board |
| 04/29/2004 | DE10062618B4 Durchlauftrockner für Platten oder Bahnen Continuous dryers for plates and sheets |
| 04/29/2004 | DE10057606B4 Anordnung zur Verbindung des Ferritkerns eines Planartransformators mit Masse Arrangement for connection of the ferrite core of a planar transformer to ground |
| 04/29/2004 | CA2502140A1 Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
| 04/28/2004 | EP1414282A2 Connection structure between printed circuit board and flexible circuit board |
| 04/28/2004 | EP1414281A1 Circuit module |
| 04/28/2004 | EP1414280A2 The multilayer electronic substrate and its method of manufacturing |
| 04/28/2004 | EP1414279A2 High-frequency module and communication apparatus |
| 04/28/2004 | EP1414050A1 Method for producing nanocomposite magnet using atomizing method |
| 04/28/2004 | EP1413926A2 Photosensitive resin composition and printed wiring board |
| 04/28/2004 | EP1413923A2 Nano-imprinting stamp |
| 04/28/2004 | EP1413632A2 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip |
| 04/28/2004 | EP1413360A2 Apparatus and method of material deposition using compressed fluids |
| 04/28/2004 | EP1413178A1 Card manufacturing technique and resulting card |
| 04/28/2004 | EP1413004A1 Ball grid array antenna |
| 04/28/2004 | EP1412307A2 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate. |
| 04/28/2004 | EP1412198A1 Method for placing indicia on substrates |
| 04/28/2004 | EP1090401A4 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 04/28/2004 | CN2613881Y Implantation device for welding-ball |
| 04/28/2004 | CN1493178A Manufacturing method of printed wiring board |
| 04/28/2004 | CN1493177A Land portion of printed wiring board, method for manufacturnig printed wiring board, and printed wiring board mounting method |
| 04/28/2004 | CN1492944A Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 04/28/2004 | CN1492728A Drill hole press board substitution method of printed circuit board |
| 04/28/2004 | CN1492491A Method for producing polycrystalline base plate with conductive salient block and its conductive salient block |
| 04/28/2004 | CN1492449A Electrode member |
| 04/28/2004 | CN1148110C Laminating method and product of 8-layer printed circuit board |
| 04/28/2004 | CN1147993C Master slice, substrate element and producing method therefor |
| 04/28/2004 | CN1147938C Surface installation structure and electronic elements included inside |
| 04/28/2004 | CN1147621C Figure forming method |
| 04/27/2004 | US6728106 Heat dissipation structure of integrated circuit (IC) |
| 04/27/2004 | US6728092 Formation of thin film capacitors |
| 04/27/2004 | US6728068 Head gimbal assembly interconnecting leads having improved robustness and lower stiffness |
| 04/27/2004 | US6727881 Longterm image quality |
| 04/27/2004 | US6727868 Display device for an electronic appliance |
| 04/27/2004 | US6727782 Multilayered LC composite component and method for manufacturing the same |
| 04/27/2004 | US6727774 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 04/27/2004 | US6727766 Oscillator with dielectric resonator and electronic apparatus using the same |
| 04/27/2004 | US6727718 Electronic component package, printed circuit board, and method of inspecting the printed circuit board |
| 04/27/2004 | US6727591 Mixed defective piece and good piece sections; cut lines around bridges and joint by adhesive; printed circuits |
| 04/27/2004 | US6727584 Semiconductor module |
| 04/27/2004 | US6727581 Semiconductor module |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6727577 Tape carrier package |
| 04/27/2004 | US6727574 Sealed plurality of chips stacked on surface of die pad with exposed surface; high speed, accuracy |
| 04/27/2004 | US6727519 Plurality of bumps disposed between solder pads and poly solder interconnections; electrodes on patterned light emitting layer |
| 04/27/2004 | US6727437 Non-continuous conductive layer for laminated substrates |
| 04/27/2004 | US6727435 Backplane power distribution system |
| 04/27/2004 | US6727111 Process for making electronic chip device incorporating plural elements |
| 04/27/2004 | US6727042 Photosensitive resin composition |
| 04/27/2004 | US6726984 Ceramic structure using a support sheet |
| 04/27/2004 | US6726827 Electroplating solution for high speed plating of tin-bismuth solder |
| 04/27/2004 | US6726780 Lead-free solder, and paste solder composition |
| 04/27/2004 | US6726493 Method and structure for connecting and aligning electrical connections disposed on devices by fitting one device into an opening on another device |
| 04/27/2004 | US6726491 Jack connector retainer with recesses in vicinity of electrical terminals and opto-electrical jack connectors using such retainer |
| 04/27/2004 | US6726488 High-frequency wiring board |
| 04/27/2004 | US6726195 Method for ensuring planarity when using a flexible, self conforming, workpiece support system |
| 04/27/2004 | US6726087 Process and device for soldering electrical components on a plastic sheet |
| 04/27/2004 | US6726082 Soldering apparatus |
| 04/27/2004 | US6725769 Method and apparatus for applying a viscous or paste material onto a substrate |
| 04/27/2004 | US6725537 Method of connecting circuit element |
| 04/27/2004 | US6725536 Methods for the fabrication of electrical connectors |
| 04/27/2004 | CA2351568C Method for forming transparent conductive film by using chemically amplified resist |
| 04/22/2004 | WO2004034759A1 Wiring board incorporating components and process for producing the same |
| 04/22/2004 | WO2004034758A1 Process for producing ceramic multilayer board |
| 04/22/2004 | WO2004034757A1 Substrate cleaner |
| 04/22/2004 | WO2004034753A2 Circuit board standoff |
| 04/22/2004 | WO2004034512A1 Electronic circuitry provided with an integrated antenna |
| 04/22/2004 | WO2004034434A2 Components, methods and assemblies for multi-chip packages |
| 04/22/2004 | WO2004034431A2 Circuit board threadplate |
| 04/22/2004 | WO2004034427A2 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
| 04/22/2004 | WO2004034147A1 Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition |
| 04/22/2004 | WO2004033999A1 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module, and meter using them |
| 04/22/2004 | WO2003092174A3 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/22/2004 | WO2003090507A9 Filtration of flux contaminants |
| 04/22/2004 | WO2003085703A3 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 04/22/2004 | US20040077798 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 04/22/2004 | US20040077770 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion |
| 04/22/2004 | US20040077751 Esterification of acids and salts by heating and mixing with silicon and nitrogen compounds, to from reaction products used as adjuvants, curing agents or adhesion intensifiers, having storage stability |