| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/05/2004 | CN1494368A Printed cirucitboard and its mfg. method |
| 05/05/2004 | CN1494366A Wiring board having sandwich layer containing inorganic filling |
| 05/05/2004 | CN1494365A V type slot circuit board |
| 05/05/2004 | CN1494149A Electronic apparatus |
| 05/05/2004 | CN1494134A 半导体装置 Semiconductor device |
| 05/05/2004 | CN1494120A Metal electroplating method of integrated circuit packaging substrate |
| 05/05/2004 | CN1493925A Exposure device and method for transfering photomask and workpiece |
| 05/05/2004 | CN1149008C Vibrator holder |
| 05/05/2004 | CN1149007C Multilayered printed circuit board |
| 05/05/2004 | CN1148934C Vibrator holder |
| 05/05/2004 | CN1148802C Low alpha emission interconnect system of electronic device and its forming method |
| 05/05/2004 | CN1148796C Semiconductor chip device and package method thereof |
| 05/05/2004 | CN1148696C High-reliability touch panel |
| 05/05/2004 | CN1148471C Electroplating machine |
| 05/05/2004 | CN1148470C Method for plating insulating base material and plated attacher produced thereby |
| 05/04/2004 | US6731511 Wiring board, method of manufacturing the same, electronic component, and electronic instrument |
| 05/04/2004 | US6731476 Circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and magnetic head using the same |
| 05/04/2004 | US6731189 Multilayer stripline radio frequency circuits and interconnection methods |
| 05/04/2004 | US6731061 Dual layer electroplated structure for a flat panel display device |
| 05/04/2004 | US6731004 Electronic device and method of producing same |
| 05/04/2004 | US6731001 Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| 05/04/2004 | US6730995 Two-stage transfer molding device to encapsulate MMC module |
| 05/04/2004 | US6730860 Electronic assembly and a method of constructing an electronic assembly |
| 05/04/2004 | US6730859 Substrate for mounting electronic parts thereon and method of manufacturing same |
| 05/04/2004 | US6730858 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
| 05/04/2004 | US6730857 Structure having laser ablated features and method of fabricating |
| 05/04/2004 | US6730856 Ceramic circuit board and method for manufacturing the same |
| 05/04/2004 | US6730854 Resin-formed substrate and resin-formed substrate unit |
| 05/04/2004 | US6730644 Cleaning solution for substrates of electronic materials |
| 05/04/2004 | US6730596 Method of and apparatus for forming interconnection |
| 05/04/2004 | US6730409 Promoting adhesion between a polymer and a metallic substrate |
| 05/04/2004 | US6730391 Clad board for printed-circuit board, multilayered printed-circuit board, and method of manufacture thereof |
| 05/04/2004 | US6730358 Method for depositing conductive paste using stencil |
| 05/04/2004 | US6730356 Method and apparatus for forming pattern using printing method |
| 05/04/2004 | US6730238 Coupling a low-power radio frequency power supply to a tuning network by a transmission line; coupling a gas manifold to the plasma chamber; increasing the power to produce a plasma in oxygen; exposing thick-film polymer resistors; etching |
| 05/04/2004 | US6730209 Using polyol additive |
| 05/04/2004 | US6730183 Laminated ceramic electronic components and manufacturing method therefor |
| 05/04/2004 | US6730173 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
| 05/04/2004 | US6729891 Right angle board-to-board connector with balanced impedance |
| 05/04/2004 | US6729889 Electrical connection arrangement and method for the manufacture thereof |
| 05/04/2004 | US6729888 Connecting structure, electro-optical device, and electronic apparatus |
| 05/04/2004 | US6729776 Transparent substrate and hinged optical assembly |
| 05/04/2004 | US6729532 Component mounting method |
| 05/04/2004 | US6729238 Printing of a conductive coating on an electric unit |
| 05/04/2004 | US6729213 Manufacturing method of monolithic electronic components |
| 05/04/2004 | US6729027 Method of forming recessed socket contacts |
| 05/04/2004 | US6729025 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 05/04/2004 | US6729024 Method of forming a non-continuous conductive layer for laminated substrates |
| 05/04/2004 | US6729023 Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material |
| 05/04/2004 | US6729022 Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards |
| 05/04/2004 | US6729001 Method for making a sonoprobe |
| 05/04/2004 | CA2325141C Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace |
| 05/04/2004 | CA2305894C Electronic device structure capable of preventing malfunction caused by electromagnetic waves coming from the outside |
| 04/29/2004 | WO2004036969A1 Method and device for joining at least two parts |
| 04/29/2004 | WO2004036967A1 Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
| 04/29/2004 | WO2004036964A2 Method for the manufacture of printed circuit boards with integral plated resistors |
| 04/29/2004 | WO2004036701A2 Method and apparatus for depositing material for an electronic device |
| 04/29/2004 | WO2004035307A1 Film multilayer body and flexible circuit board |
| 04/29/2004 | WO2004035303A1 Laminate structures, methods for production thereof and uses therefor |
| 04/29/2004 | WO2004035253A1 An apparatus and method for filling a ball grid array template |
| 04/29/2004 | WO2004016829A3 Electrolytic copper plating solutions |
| 04/29/2004 | WO2004008817A3 A multi-configuration processor-memory device |
| 04/29/2004 | WO2003096123A8 Reversal imprint technique |
| 04/29/2004 | WO2003044849A3 Integrated void-free process for assembling a solder bumped chip |
| 04/29/2004 | WO2002091811A3 Throughplating of flexible printed boards |
| 04/29/2004 | US20040083446 Method of manufacturing a device, device manufacturing apparatus, device, and electronic apparatus |
| 04/29/2004 | US20040082189 Multi-layer circuit board and method of manufacturing the same |
| 04/29/2004 | US20040082183 Pattern forming method and apparatus, and device fabrication method and device |
| 04/29/2004 | US20040082179 Method for forming metal coating and method for manufacturing chip electronic components |
| 04/29/2004 | US20040082113 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 04/29/2004 | US20040082100 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 04/29/2004 | US20040081921 Method for manufacturing conductive pattern substrate |
| 04/29/2004 | US20040081811 Integrated thin film capacitor/inductor/interconnect system and method |
| 04/29/2004 | US20040081810 Structure having embedded flush circuitry features and method of fabricating |
| 04/29/2004 | US20040081800 Micro-casted silicon carbide nano-imprinting stamp |
| 04/29/2004 | US20040081762 Applying to substrate a photosensitive resin composition containing polysilane, photosensitive radical generator, oxidizing agent, alkoxy containing containing silicone compound, exposing to radiation, plating |
| 04/29/2004 | US20040081351 Multi-layer printed circuit board fabrication system and method |
| 04/29/2004 | US20040080921 Printed circuit board assembly employing a press fit electrical connector |
| 04/29/2004 | US20040080918 Circuit board and its manufacture method |
| 04/29/2004 | US20040080735 Plain surface stage apparatus |
| 04/29/2004 | US20040080459 Integrated dual function circuitry and antenna system |
| 04/29/2004 | US20040080397 Method of protecting a thick film resistor |
| 04/29/2004 | US20040080386 Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| 04/29/2004 | US20040080378 High-frequency module and communication apparatus |
| 04/29/2004 | US20040080057 Sash for land grid arrays |
| 04/29/2004 | US20040080054 Writing determination pattern in dielectric substrate; connecting terminals covering apertures; electroplating of metals |
| 04/29/2004 | US20040080052 Circuit substrate and fabrication method thereof |
| 04/29/2004 | US20040080044 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/29/2004 | US20040080043 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 04/29/2004 | US20040080021 Integrated thin film capacitor/inductor/interconnect system and method |
| 04/29/2004 | US20040079937 Wiring substrate, electronic device, electro-optical device, and electronic apparatus |
| 04/29/2004 | US20040079791 Method for manufacturing printed circuit board |
| 04/29/2004 | US20040079788 Cost effective substrate fabrication for flip-chip packages |
| 04/29/2004 | US20040079785 Electronic components carrier for collecting electronic components dropping from a circuit board and related method |
| 04/29/2004 | US20040079783 Solder bump fabrication method and apparatus |
| 04/29/2004 | US20040079644 Uniform thickness; applying electricity |
| 04/29/2004 | US20040079643 Immersion substrate with apertures in electroplating solution; conductors |
| 04/29/2004 | US20040079549 Conductive substrate structure |
| 04/29/2004 | US20040079546 Miniature contact block packaging for printed circuit boards |
| 04/29/2004 | US20040079254 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus |