| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/11/2004 | US6732904 Solder ball holding terminal in a BGA arrangement |
| 05/11/2004 | US6732643 Method for forming pattern using printing process |
| 05/11/2004 | US6732640 Screen printing frame having prestressing reinforcement |
| 05/11/2004 | US6732567 Sintered textured channel; heat conductive detector |
| 05/06/2004 | WO2004039138A1 Electromagnetic wave shielding light transmitting window material and process for producin the same |
| 05/06/2004 | WO2004039137A1 Plasma display panel-use copper foil and production method therefor |
| 05/06/2004 | WO2004039136A1 Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate |
| 05/06/2004 | WO2004039135A1 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 05/06/2004 | WO2004039134A2 Printed circuit heaters with ultrathin low resistivity materials |
| 05/06/2004 | WO2004039130A1 High-pressure discharge lamp operation device and illumination appliance having the same |
| 05/06/2004 | WO2004038799A1 Electronic member, method for making the same, and semiconductor device |
| 05/06/2004 | WO2004038743A1 Process for producing laminated ceramic capacitor |
| 05/06/2004 | WO2004038495A1 Connection structure of wiring board and connection structure of liquid crystal display panel |
| 05/06/2004 | WO2004038435A1 Wiring board inspection device, and wiring board inspection method |
| 05/06/2004 | WO2004038433A1 Sheet-form connector and production method and application therefor |
| 05/06/2004 | WO2004038289A1 Light-emitting module |
| 05/06/2004 | WO2004038053A2 A lead-free solder, and a lead-free joint |
| 05/06/2004 | WO2004037885A1 Capsule type hardener and composition |
| 05/06/2004 | WO2004026517A3 Solder hierarchy for lead free solder joint |
| 05/06/2004 | WO2004004025A3 Method for the economical structuring of conducting polymers by means of defining hydrophilic and hydrophobic regions |
| 05/06/2004 | WO2004003055A8 Biaxially oriented polyester film and laminates thereof with copper |
| 05/06/2004 | WO2003034636A8 High speed, controlled impedance air dielectric electronic backplane systems |
| 05/06/2004 | WO2003024172A8 A method of etching copper on cards |
| 05/06/2004 | WO2002048432A9 Method for patterning metal using nanoparticle containing precursors |
| 05/06/2004 | WO2002004711A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 05/06/2004 | US20040088416 Printed circuit board and method manufacturing the same |
| 05/06/2004 | US20040087177 Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same |
| 05/06/2004 | US20040087173 Applying a magnetic field to mixture of a polymer and magnetic particles sandwiched between first and second components to form and bend an aligned path of particles between the components and solidifying the polymer |
| 05/06/2004 | US20040087130 Semiconductor device and mounted semiconductor device structure |
| 05/06/2004 | US20040087128 Method and materials for printing particle-enhanced electrical contacts |
| 05/06/2004 | US20040087077 Electronic assembly having semiconductor component with polymer support member and method of fabrication |
| 05/06/2004 | US20040087063 Edge-sealed substrates and methods for effecting the same |
| 05/06/2004 | US20040087062 Semiconductor device and method of manufacturing the same |
| 05/06/2004 | US20040087058 Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 05/06/2004 | US20040087046 Method for testing chips on flat solder bumps |
| 05/06/2004 | US20040086806 Applying photosensitive resin containing polysilane to substrate; exposing a region of photosensitive layer to a radiation and performing development to form channel portion that corresponds to metal pattern; contacting with liquid |
| 05/06/2004 | US20040086801 Method for manufacturing printeed wiring board and photosensitive resin composition used to be used for it |
| 05/06/2004 | US20040086741 Drill stack formation |
| 05/06/2004 | US20040086739 Film carrier tape for mounting electronic part |
| 05/06/2004 | US20040086697 Metal alloy compositions and plating methods related thereto |
| 05/06/2004 | US20040085742 Capacitor mounting structure |
| 05/06/2004 | US20040085699 Amalgam of shielding and shielded energy pathways and other elements for single or multiiple circuitries with common reference node |
| 05/06/2004 | US20040085505 Display, method of manufacturing display and apparatus for manufacturing display |
| 05/06/2004 | US20040085279 Flat panel display with signal transmission patterns |
| 05/06/2004 | US20040085164 Filter circuit apparatus and manufacturing method thereof |
| 05/06/2004 | US20040085149 Wired transmission path |
| 05/06/2004 | US20040085017 Variable LED display panel |
| 05/06/2004 | US20040084810 Laser system for drilling and plating vias |
| 05/06/2004 | US20040084783 Integrated circuit package capable of operating in multiple orientations |
| 05/06/2004 | US20040084782 High density area array solder microjoining interconnect structure and fabrication method |
| 05/06/2004 | US20040084769 Semiconductor device and method for manufacturing the same |
| 05/06/2004 | US20040084759 Housing preform and electronic apparatus using the same |
| 05/06/2004 | US20040084510 Phase separated system for fluxing |
| 05/06/2004 | US20040084399 Process of producing printed circuit boards and the circuit boards formed thereby |
| 05/06/2004 | US20040084321 Electroconductive carbon is coated on nonconductor surface; conditioning; dispersion of graphite and binder is applied to conditioned surface; fixing; low electrical resistance; removable from copper by microetching |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | US20040084301 Electro-chemical deposition system |
| 05/06/2004 | US20040084211 Z-axis packaging for electronic device and method for making same |
| 05/06/2004 | US20040084210 Apparatus and method for interconnection between a component and a printed circuit board |
| 05/06/2004 | US20040084209 Flip chips; separating top and bottom flow fronts to prevent wrapping around sides and trapping air |
| 05/06/2004 | US20040084208 Article and method for reducing external excitation of MEMS devices |
| 05/06/2004 | US20040084207 Molded high impedance surface and a method of making same |
| 05/06/2004 | US20040084206 Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method |
| 05/06/2004 | US20040084205 Warpage-preventive circuit board and method for fabricating the same |
| 05/06/2004 | US20040084148 Low pressure plasma processing apparatus and method |
| 05/06/2004 | US20040084137 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 05/06/2004 | US20040083606 Circuit wiring board and method of manufacturing the same |
| 05/06/2004 | US20040083605 Press-fit chip package |
| 05/06/2004 | US20040083604 Forming a sandwiched printed circuit board, with steel plate sandwiched between the first and second coppers, conveying to working room, laminating the sandwiched board, prepregs, and cores serially; materials handling |
| 05/06/2004 | US20040083590 Method for forming a multi-frequency surface acoustic wave device |
| 05/06/2004 | EP1416779A2 Multi-layer circuit board and method of manufacturing the same |
| 05/06/2004 | EP1416778A2 Small and securely-soldered electronic unit |
| 05/06/2004 | EP1416581A1 Non-contact communication medium |
| 05/06/2004 | EP1416535A2 Tape carrier for tab |
| 05/06/2004 | EP1416532A1 Module component |
| 05/06/2004 | EP1416065A1 Plating method |
| 05/06/2004 | EP1416003A1 RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND CURED ARTICLE OBTAINED THEREFROM |
| 05/06/2004 | EP1415813A2 Edge-sealed substrates and methods for effecting the same |
| 05/06/2004 | EP1415522A1 Electromagnetic filter for display screens |
| 05/06/2004 | EP1415521A1 A method of providing radio frequency screening for electric components |
| 05/06/2004 | EP1415520A1 Stencil for use with stencil mounting frame |
| 05/06/2004 | EP1415519A1 Welded leadframe |
| 05/06/2004 | EP1415369A1 Batch electrically connecting sheet |
| 05/06/2004 | EP1415336A2 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 05/06/2004 | EP1415167A2 Method and apparatus for evaluating a set of electronic components |
| 05/06/2004 | EP1415166A1 Apparatus and method for testing bare circuit boards |
| 05/06/2004 | EP1415021A1 Copper on invar composite and method of making |
| 05/06/2004 | EP1414895A1 Flame retardant molding compositions |
| 05/06/2004 | EP1414587A1 Method of and apparatus for substrate pre-treatment |
| 05/06/2004 | EP1414350A1 Ultrasound probe wiring method and apparatus |
| 05/06/2004 | EP0999950B1 Trim panel having grooves with integrally formed electrical circuits |
| 05/06/2004 | EP0944482B1 Apparatus and method for recovering photoresist developers and strippers |
| 05/06/2004 | DE69432839T2 Epoxydharz und Polyesterharz enthaltende heissschmelzbare Zusammensetzungen Epoxy resin and polyester resin containing hot melt compositions |
| 05/06/2004 | DE10249005A1 Verfahren zur Herstellung einer Schaltungsanordnung A process for producing a circuit arrangement |
| 05/06/2004 | DE10196822T5 Oberflächenmontierter Verbinderanschluß The surface mount connector terminal |
| 05/06/2004 | DE10132786B4 Flüssigkristall anzeigemodul Liquid crystal display module |
| 05/06/2004 | DE10056665B4 Lenkstockschalter, insbesondere für Fahrzeuge Steering column switch, in particular for vehicles |
| 05/05/2004 | CN1494820A Ceramic electronic component and method of producing the same |
| 05/05/2004 | CN1494753A Method and device for connecting conductors |
| 05/05/2004 | CN1494369A Electroplating method of printed circuit board |