| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/13/2004 | US20040089471 Printed circuit board and method of manufacturing the same |
| 05/13/2004 | US20040089470 Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/13/2004 | US20040089425 Dual conformal film sealing apparatus |
| 05/13/2004 | US20040089413 System and method for modifying electronic design data |
| 05/13/2004 | US20040089282 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus |
| 05/13/2004 | US20040089171 Apparatus for improving stencil/screen print quality |
| 05/13/2004 | US20040088856 Electric connector and IC tin ball shaping and fixing manufacturing method |
| 05/13/2004 | US20040088854 Abrasion resistant electrode and device |
| 05/13/2004 | US20040088853 Method and system for assembling a printed circuit board using a land grid array |
| 05/13/2004 | DE19755765B4 Gehäuse mit Deckel Housing with cover |
| 05/13/2004 | DE10347460A1 Circuit board used in electronic devices has a communication circuit which communicates with an external device without using wires, and a storage unit |
| 05/13/2004 | DE10250725A1 Verfahren zur Herstellung von Leiterbildstrukturen auf einer Leiterplatte A process for the production of printed circuit image structures on a circuit board |
| 05/13/2004 | DE10248020A1 Verfahren und Vorrichtung zum Fügen von zumindest zwei Bauteilen Method and apparatus for assembling at least two components |
| 05/13/2004 | CA2473976A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 05/12/2004 | EP1418798A2 Printed circuit board and method for installing printed circuit board onto electro-conductive housing |
| 05/12/2004 | EP1418797A2 Wiring board and process of producing the same |
| 05/12/2004 | EP1418679A1 Multiband high-frequency switching module |
| 05/12/2004 | EP1418645A1 Terminal fitting and printed circuit boards assembly |
| 05/12/2004 | EP1418616A1 Electronic parts packaging structure and method of manufacturing the same |
| 05/12/2004 | EP1418251A1 Plating method |
| 05/12/2004 | EP1417871A2 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 05/12/2004 | EP1417473A1 Confocal 3d inspection system and process |
| 05/12/2004 | EP1192848B1 Tooling fixture |
| 05/12/2004 | EP1135783A4 Capacitance-coupled high dielectric constant embedded capacitors |
| 05/12/2004 | EP1123512B1 High density printed circuit board |
| 05/12/2004 | EP1073539B1 Use of lead-free solder alloy powder paste in pcb production |
| 05/12/2004 | EP0991682B1 Coating method using a one-component aqueous coating system comprising thermally labile hydrophilic groups |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN2616005Y Wave crest soldering machine nozzle |
| 05/12/2004 | CN1496670A Manufacture of printed circuits using single layer processing techniques |
| 05/12/2004 | CN1496669A Laminate comprised of flat conductor elements |
| 05/12/2004 | CN1496377A Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/12/2004 | CN1496343A Methods of roughening ceramic surface |
| 05/12/2004 | CN1496304A Electrolyte copper foil having carrier foil, making method thereof, and layered plate using the same |
| 05/12/2004 | CN1496218A Power miniature assembly and its mfg. method |
| 05/12/2004 | CN1496216A Multilayer circuit board forming method and multilayer circuit board |
| 05/12/2004 | CN1496215A Multilayer printed-wiring board mfg. method and multilayer printed-wiring board |
| 05/12/2004 | CN1496213A Technique for reducing number of layers of multilayer circuit board |
| 05/12/2004 | CN1496212A Circuit board with pin made of resin |
| 05/12/2004 | CN1495976A Equipment and method for making electric connector |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495814A Microelectronic element bearer and mfg. method thereof |
| 05/12/2004 | CN1495435A Printed circuit board with integrated two-axis fulxgate sensor and its making method |
| 05/12/2004 | CN1495292A Chemical processing method and chemical processing device |
| 05/12/2004 | CN1495288A Plating method |
| 05/12/2004 | CN1495287A Plating method |
| 05/12/2004 | CN1495020A Ink-jet head and its mfg. method |
| 05/12/2004 | CN1494980A Method for mfg. printed-circuit board and circuit board therefrom |
| 05/12/2004 | CN1149906C Vibrator holder |
| 05/12/2004 | CN1149905C Multi-layered printed circuit board |
| 05/12/2004 | CN1149667C High thermal conductivity silicon nitride circuit substrat, and semiconductor device using the same |
| 05/12/2004 | CN1149666C Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 05/12/2004 | CN1149653C Copper stud structure with refractory metal liner |
| 05/12/2004 | CN1149651C Semiconductor chip device and its package method |
| 05/12/2004 | CN1149649C Producing method of relay base plate for installation of semi-conductor elements |
| 05/12/2004 | CN1149538C Circuit substrate, circuit-formed suspension substrate, and production methods therefor |
| 05/11/2004 | US6735092 Expansion board apparatus |
| 05/11/2004 | US6735087 Module and surface-mounted module |
| 05/11/2004 | US6735074 Chip capacitor |
| 05/11/2004 | US6735052 Hard disk drive suspension with integral flexible circuit |
| 05/11/2004 | US6734941 Liquid crystal display device |
| 05/11/2004 | US6734750 Surface mount crossover component |
| 05/11/2004 | US6734691 Substrate for a probe card having conductive layers for supplying power to IC devices |
| 05/11/2004 | US6734665 Inductive sensor having a sensor coil in the form of a structured conductive layer |
| 05/11/2004 | US6734570 Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
| 05/11/2004 | US6734557 Semiconductor device |
| 05/11/2004 | US6734555 Integrated circuit package and printed circuit board arrangement |
| 05/11/2004 | US6734544 Integrated circuit package |
| 05/11/2004 | US6734542 Component built-in module and method for producing the same |
| 05/11/2004 | US6734540 Semiconductor package with stress inhibiting intermediate mounting substrate |
| 05/11/2004 | US6734534 Microelectronic substrate with integrated devices |
| 05/11/2004 | US6734529 Vertically mountable interposer and assembly |
| 05/11/2004 | US6734444 Substrate treatment device using a dielectric barrier discharge lamp |
| 05/11/2004 | US6734375 Central portion of porous sheet is not impregnated with resin from laminated resin layer; dielectrics; accuracy |
| 05/11/2004 | US6734373 Through hole insertion type electronic component and method of packaging same |
| 05/11/2004 | US6734371 Soldered heat sink anchor and method of use |
| 05/11/2004 | US6734370 Multilayer modules with flexible substrates |
| 05/11/2004 | US6734369 Surface laminar circuit board having pad disposed within a through hole |
| 05/11/2004 | US6734368 Metal backed printed circuit board assemblies |
| 05/11/2004 | US6734248 Containing a 1h-tetrazole or a 5,5'-bis-1h-tetrazole |
| 05/11/2004 | US6734039 Semiconductor chip grid array package design and method of manufacture |
| 05/11/2004 | US6734029 Method for forming conductive film pattern, and electro-optical device and electronic apparatus |
| 05/11/2004 | US6733954 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module |
| 05/11/2004 | US6733886 Made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer; improved adhesion |
| 05/11/2004 | US6733871 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel |
| 05/11/2004 | US6733868 Substrate for forming specific pattern, and method for manufacturing same |
| 05/11/2004 | US6733823 Method for electroless gold plating of conductive traces on printed circuit boards |
| 05/11/2004 | US6733822 Firing an aluminum nitride molding having at least one highly isolated through-hole for via hole formation; specified shrinkage factor; noncracking |
| 05/11/2004 | US6733685 Methods of planarizing structures on wafers and substrates by polishing |
| 05/11/2004 | US6733613 An anisotropic conductive compound is cured by exposing it to heat while in the presence of an ac magnetic field followed by a static, substantially homogeneous dc magnetic field. |
| 05/11/2004 | US6733334 Connector structure of circuit board for power supply apparatus |
| 05/11/2004 | US6733327 Connector for button battery contained in electronic device |
| 05/11/2004 | US6733319 Connector and method for establishing solderfree connections between a rigid main PCB and associated conductors |
| 05/11/2004 | US6733309 Device for connecting electrical conductors |
| 05/11/2004 | US6733306 Electronic module assembly apparatus, methods and articles of manufacture |
| 05/11/2004 | US6733148 Spread illuminating apparatus with flexible printed circuit |
| 05/11/2004 | US6732912 Solder ball attaching process |
| 05/11/2004 | US6732911 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system |
| 05/11/2004 | US6732908 Microjoint chip carrier including multilayer substrate with plurality of receptacles in top surface, set of microjoint pads on device chips with conductive studs extending outwardly above surface, interconnect wiring connecting receptacles |
| 05/11/2004 | US6732907 Soldering method, soldering device, and method and device of fabricating electronic circuit module |