| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/19/2004 | CN1150807C Method for making laminated circuit board |
| 05/19/2004 | CN1150676C Electronic element with conductor and lead terminal |
| 05/19/2004 | CN1150613C Organic chip carriers for wire bond-type chip |
| 05/19/2004 | CN1150604C Flat multi-layer ceramic component with subadjacent grooves |
| 05/19/2004 | CN1150244C Epoxy resin compsn. and its laminated product |
| 05/19/2004 | CN1150080C 焊锡膏 Paste |
| 05/19/2004 | CN1150079C Anti-welding composition and printed-circuit board |
| 05/18/2004 | USRE38516 Liquid crystal display with casing structure |
| 05/18/2004 | US6738600 Ceramic microelectromechanical structure |
| 05/18/2004 | US6738505 Method and apparatus for detecting solder paste deposits on substrates |
| 05/18/2004 | US6738249 Universal energy conditioning interposer with circuit architecture |
| 05/18/2004 | US6738195 Optical magnification adjustment system and projection exposure device |
| 05/18/2004 | US6738030 Display device using COF |
| 05/18/2004 | US6737882 Method for universal wafer carrier for wafer level die burn-in |
| 05/18/2004 | US6737770 Brushless motor |
| 05/18/2004 | US6737752 Flip-chip package containing a chip and a substrate having differing pitches for electrical connections |
| 05/18/2004 | US6737749 Resistive vias for controlling impedance and terminating I/O signals at the package level |
| 05/18/2004 | US6737741 Process for mounting electronic device and semiconductor device |
| 05/18/2004 | US6737590 Tape circuit board and semiconductor chip package including the same |
| 05/18/2004 | US6737589 Flexible printed wiring board |
| 05/18/2004 | US6737588 Processes for manufacturing flexible wiring boards and the resulting flexible wiring board |
| 05/18/2004 | US6737586 Flat cable and a manufacturing method therefor |
| 05/18/2004 | US6737338 Pattern forming method for a display device |
| 05/18/2004 | US6737179 Electronically tunable dielectric composite thick films and methods of making same |
| 05/18/2004 | US6737153 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 05/18/2004 | US6737108 Microcapsulating conductive metal particles with polymerized monomers |
| 05/18/2004 | US6736988 Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board |
| 05/18/2004 | US6736985 High-resolution method for patterning a substrate with micro-printing |
| 05/18/2004 | US6736954 Plating bath and method for depositing a metal layer on a substrate |
| 05/18/2004 | US6736942 Freestanding reactive multilayer foils |
| 05/18/2004 | US6736907 Tin, zinc alloy mixed with flux |
| 05/18/2004 | US6736900 Highly-viscous-fluid applying apparatus capable of controlling delivery amount of fluid |
| 05/18/2004 | US6736665 Contact structure production method |
| 05/18/2004 | US6736654 Hold down apparatus for perpendicularly mounted cards |
| 05/18/2004 | US6736308 Systems and methods for distributing solder paste using a tool having a solder paste aperture with a non-circular cross-sectional shape |
| 05/18/2004 | US6736306 Semiconductor chip package comprising enhanced pads |
| 05/18/2004 | US6736291 Viscous material application apparatus |
| 05/18/2004 | US6736058 Uphill screen printing in the manufacturing of microelectronic components |
| 05/18/2004 | US6735865 Forming a photo-polymer layer by coating, exposing, development, and post-curing in sodium carbonate solution |
| 05/18/2004 | US6735857 Method of mounting a BGA |
| 05/18/2004 | US6735855 Methods for electrical connector |
| 05/13/2004 | WO2004040953A1 Holding/convey jig and holding/convey method |
| 05/13/2004 | WO2004040949A1 Printed circuit board for mobile telephones |
| 05/13/2004 | WO2004040948A1 Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040944A1 Transparent window with non-transparent contact surface for a soldering bonding |
| 05/13/2004 | WO2004040592A1 Chip resistor, process for producing the same, and frame for use therein |
| 05/13/2004 | WO2004040591A1 Fixed network resistor |
| 05/13/2004 | WO2004040290A1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 05/13/2004 | WO2004040287A1 Method of manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040285A2 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040005A1 Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
| 05/13/2004 | WO2004039898A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 05/13/2004 | WO2004039897A2 Process for making an electrochemical sensor |
| 05/13/2004 | WO2004039600A2 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 05/13/2004 | WO2004039579A1 Very ultra thin conductor layers for printed wiring boards |
| 05/13/2004 | WO2004039533A1 Lead-free solder and soldered article |
| 05/13/2004 | WO2004039532A1 Method for punching holes in a polymeric glass fibre reinforced substrate |
| 05/13/2004 | WO2004039526A1 Soldering method and device |
| 05/13/2004 | WO2003084861A3 Method of manufacturing an electronic device in a cavity with a cover |
| 05/13/2004 | WO2002101888A3 Multi-beam micro-machining system and method |
| 05/13/2004 | WO2002067644A9 Machine for stacking and bonding sub-boards of a multilayer board for a printed circuit and method of fabrication of a multilayer board |
| 05/13/2004 | US20040092174 Circuit board inter-connection system and method |
| 05/13/2004 | US20040092141 Electronic system modules and method of fabrication |
| 05/13/2004 | US20040092137 Electronic module and method for fabricating the same |
| 05/13/2004 | US20040092136 Method and apparatus for electrolytic plating of surface metals |
| 05/13/2004 | US20040092129 Method for manufacturing circuit devices |
| 05/13/2004 | US20040092065 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 05/13/2004 | US20040091821 Manufacturing methods for printed circuit boards |
| 05/13/2004 | US20040091818 Without chemical roughening pretreatment; coating molded polymer, electroless plating conductive metal and photoresist patterning |
| 05/13/2004 | US20040091697 For connecting fine-pitched terminals, for example, in case of electrically connecting input terminals of liquid crystal panels (liquid crystal displays) to outer leads in TAB (Tape Automated Bonding) |
| 05/13/2004 | US20040091688 Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer board |
| 05/13/2004 | US20040091687 Method for manufacturing printed wiring board with embedded electric device |
| 05/13/2004 | US20040091686 Aromatic liquid-crystalline polyester solution composition |
| 05/13/2004 | US20040091625 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/13/2004 | US20040091622 Forming a coated prepreg by applying a solventless hot-melt resin system with high thermal conductivity to a prepreg by means of a slot die extrusion head |
| 05/13/2004 | US20040091511 A repellent of a pyrethroid-base neurotransmitting agent, a curable phenolic resin and silica filler, for using in soldering process, forming a film on a printed wiring board, repelling cockroach, ant, spider, building nest inside |
| 05/13/2004 | US20040091030 Process to refurbish cable modem circuitry to comply with DOCSIS 2.0 specification |
| 05/13/2004 | US20040090843 Large line conductive pads for interconnection of stackable circuitry |
| 05/13/2004 | US20040090760 Electrical connecting element and method of fabricating the same |
| 05/13/2004 | US20040090758 Multi-layered semiconductor device and method of manufacturing same |
| 05/13/2004 | US20040090757 Printed circuit board |
| 05/13/2004 | US20040090755 Small and securely-soldered electronic unit |
| 05/13/2004 | US20040090753 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 05/13/2004 | US20040090748 Printed circuit board and method for installing printed circuit board onto electro-conductive housing |
| 05/13/2004 | US20040090732 Plated terminations |
| 05/13/2004 | US20040090584 Assembly structure for flat panel display device |
| 05/13/2004 | US20040090476 Apparatus for ejecting droplets, actuator controller used in the apparatus, and method for controlling the actuator |
| 05/13/2004 | US20040090415 Rear electrode structures for electrophoretic displays |
| 05/13/2004 | US20040090380 Electrically conductive patterns, antennas and methods of manufacture |
| 05/13/2004 | US20040090304 Electrical devices and process for making such devices |
| 05/13/2004 | US20040090291 Method and apparatus for refurbishing analog set top box to provide digital set top box and optional DOCSIS cable modem capability |
| 05/13/2004 | US20040089948 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 05/13/2004 | US20040089945 Semiconductor device |
| 05/13/2004 | US20040089937 Apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a pre-curved |
| 05/13/2004 | US20040089880 Methods for providing an integrated circuit package with an alignment mechanism |
| 05/13/2004 | US20040089838 Etching with sulfuric acid, hydrogen peroxide, and tetrazole derivative to form acicular projections in printed circuits |
| 05/13/2004 | US20040089770 Fixing member for fixing an object to be attached to a plate and clamp with the fixing member |
| 05/13/2004 | US20040089700 Preconditioning via plug material for a via-in-pad ball grid array package |
| 05/13/2004 | US20040089557 Process for electrolytic copper plating |
| 05/13/2004 | US20040089472 Multilayer ceramic substrate, its production method, and apparatus used for its production |