| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/20/2004 | US20040097086 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097081 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097078 Thin film transfer join process and multilevel thin film module |
| 05/20/2004 | US20040096781 Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
| 05/20/2004 | US20040096688 Zinc, tin, bismuth, germanium alloy; joining connectors |
| 05/20/2004 | US20040096676 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 05/20/2004 | US20040096634 Wiring board and process of producing the same |
| 05/20/2004 | US20040096632 Pb-free solder composition and soldered article |
| 05/20/2004 | US20040095734 High capacitance package substrate |
| 05/20/2004 | US20040095710 Circuit module |
| 05/20/2004 | US20040095646 Vehicle mirror system with vehicle heading sensor assembly |
| 05/20/2004 | US20040095632 Rearview mirror constructed for efficient assembly |
| 05/20/2004 | US20040095564 Exposure device |
| 05/20/2004 | US20040095501 Imaging device package camera module and camera module producing method |
| 05/20/2004 | US20040095158 Apparatuses configured to engage a conductive pad |
| 05/20/2004 | US20040095144 Inspection apparatus and inspection method |
| 05/20/2004 | US20040095045 Method for making electrical connection to ultrasonic transducer |
| 05/20/2004 | US20040094846 Semiconductor device mounting method, semiconductor device mounting structure, ellectro-optical device, electro-optical device manufacturing method and electronic device |
| 05/20/2004 | US20040094842 Flip chip C4 extension structure and process |
| 05/20/2004 | US20040094834 Ceramic multilayer substrate and method for manufacturing the same |
| 05/20/2004 | US20040094817 Photo-interrupter and semiconductor device using the same |
| 05/20/2004 | US20040094751 Composition for filling through-holes in printed wiring boards |
| 05/20/2004 | US20040094607 System and method for mounting electronic components onto flexible substrates |
| 05/20/2004 | US20040094601 Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
| 05/20/2004 | US20040094600 Device for applying solder globules |
| 05/20/2004 | US20040094521 Carbon dioxide gas laser machining method of multilayer material |
| 05/20/2004 | US20040094512 Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process |
| 05/20/2004 | US20040094330 Electrical component, arrangement for said component and method for producing said arrangement |
| 05/20/2004 | US20040094329 Method of processing high-resolution flex circuits with low distortion |
| 05/20/2004 | US20040094328 Cabled signaling system and components thereof |
| 05/20/2004 | US20040094264 Method for adhering substrates using light activatable adhesive film |
| 05/20/2004 | US20040093724 Manufacturing method for fixing tin balls in connectors or IC devices |
| 05/20/2004 | US20040093723 Method of attaching printed circuit boards within an electronic module housing |
| 05/20/2004 | US20040093722 Retainer element for electrical components for assembly on circuit supports |
| 05/19/2004 | EP1420621A1 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
| 05/19/2004 | EP1420620A2 Desmear and texturing method |
| 05/19/2004 | EP1420441A1 Semiconductor device and method for manufacturing the same |
| 05/19/2004 | EP1419866A1 Method and device for forming module electronic component and module electronic component |
| 05/19/2004 | EP1419681A2 Horizontal component retention socket |
| 05/19/2004 | EP1419679A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards |
| 05/19/2004 | EP1419678A1 Thermosetting electroconductive paste for electroconductive bump use |
| 05/19/2004 | EP1419559A1 Electromagnetic emission reduction technique for shielded connectors |
| 05/19/2004 | EP1419558A1 Cable assembly module with compressive connector |
| 05/19/2004 | EP1419528A2 Interconnect module with reduced power distribution impedance |
| 05/19/2004 | EP1419526A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods |
| 05/19/2004 | EP1419290A2 Segmented counterelectrode for an electrolytic treatment system |
| 05/19/2004 | EP1102821A4 Composition and method for polishing in metal cmp |
| 05/19/2004 | EP0885551B1 Printed circuit board fabrication apparatus and method |
| 05/19/2004 | EP0847682B1 Screen printing method and screen printing apparatus |
| 05/19/2004 | EP0764352B1 Microelectronic contacts and assemblies |
| 05/19/2004 | DE4426109B4 Laser-Zeicheneinrichtung Laser Tag facility |
| 05/19/2004 | DE20300294U1 Verbindungsmittel zur flexiblen elektrischen Verbindung von Leiterplatten Flexible connection means for electrical connection of printed circuit boards |
| 05/19/2004 | DE10308060B3 Electrical distribution in vehicles, applies conductive tracks to sheet metal workpieces coated with hot melt adhesive layers, then joins sheets, to connect tracks |
| 05/19/2004 | DE10252636A1 Ceramic multi-layer substrate used in front end module for mobile radio, has uppermost layer with recess and stable intermediate layer below it |
| 05/19/2004 | DE10251615A1 Steckerelement und Platinenaufbau Connector element and circuit board assembly |
| 05/19/2004 | DE10251480A1 Drilling holes in circuit board using laser beam, by defining angular direction of movement of beam based on jump direction defined by start position |
| 05/19/2004 | DE10249569A1 Work-tool head for fixing electrical conductor on contact surface of substrate e.g. for microprocessors, uses converter for converting linear oscillations into radial oscillations |
| 05/19/2004 | DE10249198A1 Coil bridge connector construction for transmit and receive device with antenna and chip module |
| 05/19/2004 | DE10222874B4 Füllanlage zum luftblasenfreien Füllen von in Leiterplatten eingebrachten Löchern mit einem Füllmaterial Filling plant for bubble-free filling introduced into PCB holes with a filler material |
| 05/19/2004 | CN1498521A Radiating fin and radiating method using the radiating fin |
| 05/19/2004 | CN1498520A Method of manufacturing electronic part and electronic part obtained by the method |
| 05/19/2004 | CN1498519A Circuit support element for electronic devices, in particular for communication terminals |
| 05/19/2004 | CN1498449A Offset pathway arrangements for energy conditioning |
| 05/19/2004 | CN1498443A Filter circuit apparatus and manufacturing method thereof |
| 05/19/2004 | CN1498421A Substrate for high-frequency module and high-frequency module |
| 05/19/2004 | CN1498417A Method for assembling components and antenna in radio frequency identification devices |
| 05/19/2004 | CN1498346A Method and device for testing quality of printed circuits |
| 05/19/2004 | CN1498071A Assembly mounting device, program of control the device operation and assembly mounting system |
| 05/19/2004 | CN1498067A Method for processing hole on ceramic sheet |
| 05/19/2004 | CN1498066A Solder structure and soldering method of electronic assembly |
| 05/19/2004 | CN1498064A Forming method of welding convex point |
| 05/19/2004 | CN1498063A Manufacturing method of circuit device |
| 05/19/2004 | CN1498062A Pressure device and method |
| 05/19/2004 | CN1498061A Multilayer wiring board, touch face-plate and their manufacturing method |
| 05/19/2004 | CN1498060A Connecting method of printed circuit board |
| 05/19/2004 | CN1498059A Multi-layer structure unit and its manufacturing method |
| 05/19/2004 | CN1498058A Printed circuit board, combined substrate, manufacturing method of printed circuit board and electronic device |
| 05/19/2004 | CN1497793A Connecting structure between flexible circuit board and printed circuit board |
| 05/19/2004 | CN1497785A Electronic equipment with distribution substrate with maintaining press fit terminal |
| 05/19/2004 | CN1497717A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497712A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497710A Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device |
| 05/19/2004 | CN1497709A Circuit substrate, installing structure of solder ball network display and electro-light device |
| 05/19/2004 | CN1497693A Belt for carrying automatic welding |
| 05/19/2004 | CN1497692A Manufacturing method of circuit device |
| 05/19/2004 | CN1497691A Manufacturing method of circuit device |
| 05/19/2004 | CN1497690A Manufacturing method of circuit device |
| 05/19/2004 | CN1497689A Chip on film semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497688A Manufacturing method of circuit device |
| 05/19/2004 | CN1497687A Manufacturing method of circuit device |
| 05/19/2004 | CN1497674A Planar stage device |
| 05/19/2004 | CN1497664A Circuit board and its manufacturing method, copy chip, copy source substrate, electro-optical device |
| 05/19/2004 | CN1497661A Device and method for preventing oxidizing of electronic device |
| 05/19/2004 | CN1497627A Common backed ceramic capacitor for printed-wiring board and its manufacturing method |
| 05/19/2004 | CN1497624A Window channel capacitor |
| 05/19/2004 | CN1497623A Method for forming metal coating and method for manufacturing chip electronic element |
| 05/19/2004 | CN1497536A Magnetic head universal rack assembly and its making method |
| 05/19/2004 | CN1496820A Layer structure, its making method and its application |
| 05/19/2004 | CN1496779A 激光加工装置和激光加工方法 The laser processing apparatus and laser processing method |
| 05/19/2004 | CN1150808C Device and method in electronics line systems |