| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/26/2004 | EP1422320A1 Copper electroplating bath |
| 05/26/2004 | EP1422055A1 Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| 05/26/2004 | EP1421835A1 Embedded electrical traces and method for making |
| 05/26/2004 | EP1421834A1 Component arrangement |
| 05/26/2004 | EP1421618A2 Power electronics component |
| 05/26/2004 | EP1421609A1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 05/26/2004 | EP1354237A4 Fat conductor |
| 05/26/2004 | EP1276011B1 Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same |
| 05/26/2004 | EP1202862B1 Improvements relating to screen printing |
| 05/26/2004 | EP1127387A4 Non-circular micro-via |
| 05/26/2004 | EP1034193A4 Phenol-novolacs with improved optical properties |
| 05/26/2004 | CN2618405Y Board carrying dipplating mechanism of PC board through out hole electroplating device |
| 05/26/2004 | CN1500372A Laminate for formation of capacitor layer and method for prodn. thereof |
| 05/26/2004 | CN1500296A Electrically conductive patterns, antennas and methods of manufacture |
| 05/26/2004 | CN1500278A Compsn. for filling through-holes in printed wiring boards |
| 05/26/2004 | CN1500276A Conductive paste, article produced therewith with conductive coating on glass, ceramics or enameled steel and method for production thereof |
| 05/26/2004 | CN1500234A Incremental setp drilling system and method |
| 05/26/2004 | CN1500232A Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it |
| 05/26/2004 | CN1500025A Method of laser milling |
| 05/26/2004 | CN1500015A UV-urable inks for PTF laminates (including flxible circuitry) |
| 05/26/2004 | CN1499921A Method for fixing shield cover on a circuit board and fixed structure |
| 05/26/2004 | CN1499915A Method of mounting electronic part on wiring board |
| 05/26/2004 | CN1499914A Structure for installing magnetic core winding on service |
| 05/26/2004 | CN1499913A Wiring board and its mfg. method |
| 05/26/2004 | CN1499617A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499616A Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 05/26/2004 | CN1499596A Mfg. method of assembly set with electronic component and mfg. method for related products |
| 05/26/2004 | CN1499593A Circuit wiring board and method of mfg. same |
| 05/26/2004 | CN1499591A Encapsulation structure of electronic component and its mfg. method |
| 05/26/2004 | CN1499573A Non-planography through selective reaction for producing mask, its products and compsns. for such method |
| 05/26/2004 | CN1499432A 非接触通信介质 Noncontact communication medium |
| 05/26/2004 | CN1499289A Microcast carborundum nano embossing mould |
| 05/26/2004 | CN1499246A Electronic building block and its mfg. method |
| 05/26/2004 | CN1499205A Novel current sensing element and mfg. method |
| 05/26/2004 | CN1499191A Method for checking welding quality |
| 05/26/2004 | CN1498749A Super-thin copper foil with carrier, its mfg. method and printed wiring base plate |
| 05/26/2004 | CN1498713A Lead-less joining material and joining method using such material |
| 05/26/2004 | CN1151707C Laminating method and product of 8-layer printed circuit board |
| 05/26/2004 | CN1151535C Ion reflection comprising flexible printed circuit board |
| 05/26/2004 | CN1151203C Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using same |
| 05/26/2004 | CN1151202C Thermosetting resin composition use in ink stocking method |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/26/2004 | CN1151008C High-strength welding head |
| 05/25/2004 | US6741481 Structure for circuit board attaching portion |
| 05/25/2004 | US6741480 Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
| 05/25/2004 | US6741478 Compact electronic circuit unit having circulator, manufactured with high productivity |
| 05/25/2004 | US6741471 Expansion board apparatus and removing method |
| 05/25/2004 | US6741315 Liquid crystal device and electronic apparatus |
| 05/25/2004 | US6741221 Low cost antennas using conductive plastics or conductive composites |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740982 Microelectronic package with an attachment layer including spacer elements |
| 05/25/2004 | US6740975 Wiring substrate having no through holes formed in wiring correspondence regions |
| 05/25/2004 | US6740966 Bendable; no removal required |
| 05/25/2004 | US6740965 Flip-chip package substrate |
| 05/25/2004 | US6740964 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 05/25/2004 | US6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 05/25/2004 | US6740824 Ground connector assembly with substrate strain relief and method of making same |
| 05/25/2004 | US6740823 Solder bonding method, and electronic device and process for fabricating the same |
| 05/25/2004 | US6740822 Printed circuit board having footprints, circuit module having a printed circuit board, and method of manufacturing a printed circuit board |
| 05/25/2004 | US6740820 Heat distributor for electrical connector |
| 05/25/2004 | US6740819 Printed wiring board |
| 05/25/2004 | US6740816 Film composite, method for producing the same and its use |
| 05/25/2004 | US6740811 Electric terminal for an electronic device |
| 05/25/2004 | US6740725 Room temperature curable organopolysiloxane compositions |
| 05/25/2004 | US6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly |
| 05/25/2004 | US6740541 Unmolded package for a semiconductor device |
| 05/25/2004 | US6740540 Fabrication method for circuit board |
| 05/25/2004 | US6740425 Electroless deposition using catalyst |
| 05/25/2004 | US6740352 Method for forming bonding pads |
| 05/25/2004 | US6740246 Circuit board and a method for making the same |
| 05/25/2004 | US6740222 Substrate has a discontinuous plating layer located within each of the openings and contacting the via metal |
| 05/25/2004 | US6740192 Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane |
| 05/25/2004 | US6740183 Method of producing ceramic multi-layered substrate |
| 05/25/2004 | US6739879 Ball grid array circuit board jumper |
| 05/25/2004 | US6739878 Pressure point contact for flexible cable |
| 05/25/2004 | US6739733 LED lamp assembly |
| 05/25/2004 | US6739498 Solder ball attachment system |
| 05/25/2004 | US6739497 SMT passive device noflow underfill methodology and structure |
| 05/25/2004 | US6739048 Process of fabricating a circuitized structure |
| 05/25/2004 | US6739046 Method for producing dendrite interconnect for planarization |
| 05/25/2004 | US6739045 Method for removing solder bumps from LSI |
| 05/25/2004 | US6739044 Electrical terminal tinning process |
| 05/25/2004 | US6739042 Method for assembling a mechatronics sensor |
| 05/25/2004 | US6739041 Circuit board and a method for making the same |
| 05/25/2004 | US6739040 Method of manufacturing multilayered printed wiring board using adhesive film |
| 05/25/2004 | US6739039 Manufacturing method of printed circuit board using dry film resist |
| 05/25/2004 | US6739028 A hi-z structure in which the capacitors are vertical, instead of horizontal, so that they may be trimmed after manufacturing, for tuning purposes |
| 05/25/2004 | US6739027 Method for producing printed circuit board with embedded decoupling capacitance |
| 05/25/2004 | CA2118679C Multiple curable composition and use thereof |
| 05/21/2004 | WO2004043121A1 Printed wiring board and process for producing the same |
| 05/21/2004 | WO2004043120A1 Method for manufacturing resin substrate, method for manufacturing multilayer resin substrate, and resin substrate |
| 05/21/2004 | WO2004042820A1 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi) |
| 05/21/2004 | WO2004042814A1 Film carrier tape for mounting electronic component |
| 05/21/2004 | WO2004041517A1 Heat-resistant flexible laminated board manufacturing method |
| 05/21/2004 | WO2004041475A1 Solder flux compositions undergoing phase separation during soldering reflow process |
| 05/21/2004 | WO2004041474A1 Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam |
| 05/21/2004 | WO2004001904A8 Stabilized wire bonded electrical connections and method of making same |
| 05/21/2004 | WO2003058750B1 Grouped element transmission channel link |
| 05/20/2004 | US20040097109 Connector and method of mounting |
| 05/20/2004 | US20040097095 Method for fabricating circuit module |