| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/01/2004 | US6744123 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same |
| 06/01/2004 | US6744120 Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board |
| 06/01/2004 | US6743982 Stretchable interconnects using stress gradient films |
| 06/01/2004 | US6743975 Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| 06/01/2004 | US6743851 Polyimide film |
| 06/01/2004 | US6743841 Solvent-soluble polyimide resin, and an optionally cyclic phenoxyphosphazene compound or polyphosphazene; adhesives for printed wiring boards |
| 06/01/2004 | US6743664 Flip-chip on flex for high performance packaging applications |
| 06/01/2004 | US6743659 Method for manufacturing multi-layer package substrates |
| 06/01/2004 | US6743499 Metal filling method and member with filled metal sections |
| 06/01/2004 | US6743477 On synthetic resin substrates |
| 06/01/2004 | US6743395 Composite metallic ultrafine particles and process for producing the same |
| 06/01/2004 | US6743345 Coating with layer of polymer matrix doped with photoreducer material dielectric particles, irradiating the surface to be metallized with laser, and immersing the irradiated part in an autocatalytic bath containing metal ions |
| 06/01/2004 | US6743319 Adhesiveless transfer lamination method and materials for producing electronic circuits |
| 06/01/2004 | US6743316 Multilayered ceramic substrate and production method therefor |
| 06/01/2004 | US6743303 Contacting metal surface with adhesion promotion formulation comprising sulfuric acid and phosphoric acid to form a micro-roughened conversion coated metal surface, contacting with aqueous organosilicon formulation |
| 06/01/2004 | US6743301 Substrate treatment process and apparatus |
| 06/01/2004 | US6743048 Measuring system with cylindrical housing body carrying elastic tongues for connection to a support member |
| 06/01/2004 | US6743045 Flexible transmission link having integral connectors |
| 06/01/2004 | US6743037 Surface mount socket contact providing uniform solder ball loading and method |
| 06/01/2004 | US6743026 Printed wiring board thickness control for compression connectors used in electronic packaging |
| 06/01/2004 | US6742774 Process for high shear gas-liquid reactions |
| 06/01/2004 | US6742702 Gas injection type soldering method and apparatus |
| 06/01/2004 | US6742701 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 06/01/2004 | US6742694 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| 06/01/2004 | US6742530 Semi-aqueous solvent cleaning of paste processing residue from substrates |
| 06/01/2004 | US6742250 Method of manufacturing wiring substrate |
| 06/01/2004 | US6742249 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 06/01/2004 | US6742248 Method of forming a soldered electrical connection |
| 06/01/2004 | US6742247 Process for manufacturing laminated high layer count printed circuit boards |
| 06/01/2004 | CA2254362C Composition and method for reducing copper oxide to metallic copper |
| 05/27/2004 | WO2004045262A1 Multi-layer circuit assembly and process for preparing the same |
| 05/27/2004 | WO2004045261A1 Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 05/27/2004 | WO2004045260A1 Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same |
| 05/27/2004 | WO2004045027A1 Anisotropic conductive adhesive and film |
| 05/27/2004 | WO2004045016A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 05/27/2004 | WO2004044568A1 Method for measuring amount of heat in metal foil, method for adjusting surface characteristics, laser drilling method, and apparatus for measuring amount of heat |
| 05/27/2004 | WO2004043692A1 Ceramic multilayer substrate and method for the production thereof |
| 05/27/2004 | WO2004043130A2 Mechanically enhanced package and method of making same |
| 05/27/2004 | WO2004032583A3 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 05/27/2004 | WO2004017703A3 Method for forming printing inspection data |
| 05/27/2004 | WO2003092073A3 Electrical contacts for flexible displays |
| 05/27/2004 | WO2003088340A3 Method for the production of structured layers on substrates |
| 05/27/2004 | WO2003058719B1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof |
| 05/27/2004 | WO2003040970A8 Process for designing high frequency circuits in multiple domains |
| 05/27/2004 | WO2003036387A3 Method of forming a pattern of sub-micron broad features |
| 05/27/2004 | WO2003023820A8 Boat for ball attach manufacturing process and method of fabricating reliable flip-chip assembly |
| 05/27/2004 | US20040102043 Confocal 3D inspection system and process |
| 05/27/2004 | US20040102030 Device and method for forming bump |
| 05/27/2004 | US20040102029 Method for solder crack deflection |
| 05/27/2004 | US20040101995 Method for manufacturing circuit devices |
| 05/27/2004 | US20040101993 Component connections using bumps and wells |
| 05/27/2004 | US20040101783 Electrodeposited photoresist and dry film photoresist photolithography process for printed circuit board patterning |
| 05/27/2004 | US20040101696 Double-sided copper clad laminate and method for manufacturing the same |
| 05/27/2004 | US20040101666 Inspection contact sheet and method of fabricating the same |
| 05/27/2004 | US20040101665 Direct patterning method |
| 05/27/2004 | US20040101634 Method of forming a patterned film of surface-modified carbon nanotubes |
| 05/27/2004 | US20040101624 Treating metal surfaces with a modified oxide replacement composition |
| 05/27/2004 | US20040101620 Method for aluminum metalization of ceramics for power electronics applications |
| 05/27/2004 | US20040101190 Characteristic amount calculating device for soldering inspection |
| 05/27/2004 | US20040100780 Motherboard power-leveler |
| 05/27/2004 | US20040100778 Power converter package and thermal management |
| 05/27/2004 | US20040100777 Device for anchoring components on circuit board |
| 05/27/2004 | US20040100163 Method for making electrical connection to ultrasonic transducer through acoustic backing material |
| 05/27/2004 | US20040099999 Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 05/27/2004 | US20040099962 Flip chip electrical test yields by countering substrate die area coplanarity |
| 05/27/2004 | US20040099961 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
| 05/27/2004 | US20040099960 Economical high density chip carrier |
| 05/27/2004 | US20040099958 Crack resistant interconnect module |
| 05/27/2004 | US20040099947 Interconnection method and structure |
| 05/27/2004 | US20040099942 Ceramic multilayer substrate and method for manufacturing the same |
| 05/27/2004 | US20040099939 Semiconductor chip carrier; multilayer dielectric coverings; high density plating through aperture; connecting structure |
| 05/27/2004 | US20040099936 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
| 05/27/2004 | US20040099875 Structure of surface mount device light emitting diode |
| 05/27/2004 | US20040099773 Wire retainer |
| 05/27/2004 | US20040099716 Solder joint reliability by changing solder pad surface from flat to convex shape |
| 05/27/2004 | US20040099647 Laser trimming of resistors |
| 05/27/2004 | US20040099646 Laser trimming of annular passive components |
| 05/27/2004 | US20040099637 Microetching; printed circuits; mixture of acid, oxidizer, organonitrogen compound and silver compounds; overcoating with polymer |
| 05/27/2004 | US20040099441 Printed circuit board,its manufacturing method and csp manufacturing method |
| 05/27/2004 | US20040099440 Technique for accommodating electronic components on a multiplayer signal routing device |
| 05/27/2004 | US20040099438 Electrode or circuit pattern; overcoating carbon, impregnating with binder; curing |
| 05/27/2004 | US20040099368 Transfer printing |
| 05/27/2004 | US20040099367 Adhesive film and method for manufacturing multilayer printed wiring board comprising the same |
| 05/27/2004 | US20040099366 Method for contact-connecting an electrical component to a substrate having a conductor structure |
| 05/27/2004 | US20040099364 Method of producing a composite sheet and method of producing a laminate by using the composite sheet |
| 05/27/2004 | US20040099343 Process for improving the adhesion of polymeric materials to metal surfaces |
| 05/27/2004 | US20040099340 Reduction of surface oxidation during electroplating |
| 05/27/2004 | US20040099167 Etch resist using printer technology |
| 05/27/2004 | DE29924634U1 Electrical control circuit arrangement for control module, has circuit carrier substrate having printed circuit formed crossing electrically conductive path formed by bonding wire and another printed circuit |
| 05/27/2004 | DE29724822U1 Hochdichte Verbinderanordnung High density connector assembly |
| 05/27/2004 | DE20220761U1 Surface-mounted device has solder pre-form around each connector pin for assembly on printed circuit board via through-hole-reflow technique |
| 05/27/2004 | DE10352927A1 Electrical contact element for flat strip conductor has locking bracket with hole, which can be reached through by contacting tooth when locking bracket is bent over base plate |
| 05/27/2004 | DE10350829A1 Production of multiple layer made from unfired ceramic comprises applying thin layer on ceramic, and partially removing after functional structures are applied |
| 05/27/2004 | DE10344494A1 Störschutzverfahren für Motorsteuerungsmodule Störschutzverfahren for engine control modules |
| 05/27/2004 | DE10240112A1 Batteriekonfektionierung Battery assembly |
| 05/27/2004 | DE10121970B4 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact |
| 05/26/2004 | EP1422985A1 A method of supporting electronic components and an electronic device with elestic support for an electronic component |
| 05/26/2004 | EP1422981A2 Packaging and thermal management in electronic apparatus |
| 05/26/2004 | EP1422717A1 Memory system and memory subsystem |
| 05/26/2004 | EP1422563A1 Method of forming a patterned film of surface-modified carbon nanotubes |