| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/08/2004 | US6745463 Manufacturing method of rigid flexible printed circuit board |
| 06/08/2004 | US6745450 Method for loading solder balls into a mold |
| 06/08/2004 | CA2334627C Composite substrate, thin-film electroluminescent device using the substrate, and production process for the device |
| 06/04/2004 | CA2452284A1 Low cost antennas using conductive plastics or conductive composites |
| 06/03/2004 | WO2004047510A2 A method of supporting electronic components and an electronic device with elastic support for an electronic component |
| 06/03/2004 | WO2004047509A1 Cabled signaling system |
| 06/03/2004 | WO2004047508A2 Technique for accommodating electronic components on a multilayer signal routing device |
| 06/03/2004 | WO2004047507A2 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 06/03/2004 | WO2004047168A1 Electronic device |
| 06/03/2004 | WO2004046568A1 Bolt assembly, method and device for release, and computer system |
| 06/03/2004 | WO2004046419A1 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin |
| 06/03/2004 | WO2004045859A1 Method for producing a partially metallised film-type element |
| 06/03/2004 | WO2004021366A3 Mixtures comprising thiophene/anion dispersions and certain additives for producing coatings exhibiting improved conductivity, and methods related thereto |
| 06/03/2004 | WO2003044849B1 Integrated void-free process for assembling a solder bumped chip |
| 06/03/2004 | WO2003034130A3 Methods of fabricating patterned layers on a substrate |
| 06/03/2004 | US20040106758 Reacting fluorene with vinylbenzyl halide |
| 06/03/2004 | US20040106334 Microparticle arrangement film, electrical connection film, electrical connection structure, and microparticle arrangement method |
| 06/03/2004 | US20040106306 Display apparatus and connecting cables used in the display apparatus |
| 06/03/2004 | US20040106288 Method for manufacturing circuit devices |
| 06/03/2004 | US20040106235 Method for manufacturing circuit devices |
| 06/03/2004 | US20040106232 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby |
| 06/03/2004 | US20040106230 Multi-die module and method thereof |
| 06/03/2004 | US20040106228 Substrate based ESD network protection method for flip chip design |
| 06/03/2004 | US20040106061 temporary supports having thermoplastic resins layers, intermediate layers, and light sensitive recording layers, used to form color filters used in liquid crystal displays or printed circuits |
| 06/03/2004 | US20040105955 Lamination process and structure of high layout density substrate |
| 06/03/2004 | US20040105291 Soldermask opening to prevent delamination |
| 06/03/2004 | US20040105243 Electronic device having a plurality of metallic balls for transmitting signals between two circuit boards |
| 06/03/2004 | US20040105228 Electrical circuit board |
| 06/03/2004 | US20040105223 Method of manufacturing electronic part and electronic part obtained by the method |
| 06/03/2004 | US20040104967 Ink-jet printhead |
| 06/03/2004 | US20040104846 Method of machining glass substrate and method of fabricating high-frequency circuit |
| 06/03/2004 | US20040104800 Fastening device |
| 06/03/2004 | US20040104739 Contact probe |
| 06/03/2004 | US20040104490 Semiconductor device and a method of manufacturing the same |
| 06/03/2004 | US20040104487 Semiconductor device, wiring board and method of making same |
| 06/03/2004 | US20040104469 Card type recording medium and production method therefor |
| 06/03/2004 | US20040104464 Plating tail design for IC packages |
| 06/03/2004 | US20040104449 Filling spaces with metallic layer; removing three-dimensional sacrificial mold; radio and optical telecommunications |
| 06/03/2004 | US20040104260 Methods for manufacturing a tactile sensor usning an electrically conductive elastomer |
| 06/03/2004 | US20040104202 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
| 06/03/2004 | US20040104199 Combined wet etching method for stacked films and wet etching system used for same |
| 06/03/2004 | US20040104124 Plating bath and method for depositing a metal layer on a substrate |
| 06/03/2004 | US20040104044 [printed circuit board design] |
| 06/03/2004 | US20040104043 Compactness, low profile, and light-weight properties |
| 06/03/2004 | US20040104042 It laminating double-side circuit board, and production method therefor and multilayer printed circuit board using |
| 06/03/2004 | US20040104040 Injection molded conductor carrying means and a method for the manufacture thereof |
| 06/03/2004 | US20040104021 Radiating fin and radiating method using the radiating fin |
| 06/03/2004 | US20040103960 Method for the patterned, selective metallization of a surface of a substrate |
| 06/03/2004 | US20040103919 Single wafer cleaning with ozone |
| 06/03/2004 | US20040103913 Apparatus for washing glass substrates and process for producing a liquid crystal device |
| 06/03/2004 | US20040103813 catalytic nickel powder is coated palladium; disperse tin coated nickel powder in palladium chloride solution; forming metallic film on substrate with catalytic paste as underlayer; conductor circuits; reduce the cost catalytic metal |
| 06/03/2004 | US20040103808 Electrical circuits and methods of manufacture and use |
| 06/03/2004 | US20040103512 Method and apparatus for reclamation of precious metals from circuit board scrap |
| 06/03/2004 | DE20218520U1 Anordnung mit mindestens einem Kondensator Arrangement with at least one capacitor |
| 06/03/2004 | DE19910318B4 Optisch transparente Scheibe mit einer elektrisch leitfähigen Struktur, Verfahren zum Herstellen einer solchen sowie Verwendung der Scheibe und des Verfahrens Optically transparent pane with an electrically conductive structure, methods of making such, as well as use of the disc and the method |
| 06/03/2004 | DE10261852B3 Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
| 06/03/2004 | DE10254783A1 Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating |
| 06/03/2004 | DE10254782A1 Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating |
| 06/03/2004 | DE10250907A1 Leiterplatte für Mobiltelefone PCB for mobile phones |
| 06/03/2004 | CA2506745A1 Bolt assembly, method and device for release, and computer system |
| 06/02/2004 | EP1424883A2 Arrangement for electromagnetic radiation reduction and arresting overvoltages |
| 06/02/2004 | EP1424882A1 Flat conductor cable |
| 06/02/2004 | EP1424749A2 System for establishing an electrical contact with a conductor, in particular for a heating or cooling device for a vehicle |
| 06/02/2004 | EP1424748A2 Microelectronic contacts and assemblies |
| 06/02/2004 | EP1424731A2 Electronic parts packaging structure and method of manufacturing the same |
| 06/02/2004 | EP1424708A1 Asembly with at least one capacitor |
| 06/02/2004 | EP1424199A1 Liquid drop discharger, test chip processor, printer device, method of discharging liquid drop and printing method, method of processing test chip, method of producing organic electroluminescent panel, method of forming conductive pattern, and method of producing field emission display |
| 06/02/2004 | EP1424156A1 Process for soldering miniaturized components onto a base plate |
| 06/02/2004 | EP1423891A1 Adapter for power transfer |
| 06/02/2004 | EP1423467A1 Fluxing compositions |
| 06/02/2004 | EP1423209A2 Dimensionally stable composite article and method of making the same |
| 06/02/2004 | EP1329144B1 Module support for electrical/electronic components |
| 06/02/2004 | EP1272586B1 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 06/02/2004 | EP0839166B1 Polymeric composition |
| 06/02/2004 | CN2618685Y Stock transfer mechanism |
| 06/02/2004 | CN1502218A Circuit board and mounting method for the same, and electronic apparatus using the same |
| 06/02/2004 | CN1502157A Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balan |
| 06/02/2004 | CN1502148A Circuit board connector |
| 06/02/2004 | CN1502147A Retention apparatus for electrical connectors |
| 06/02/2004 | CN1501899A Curable polyvinylbenzyl compound and process for producing the same |
| 06/02/2004 | CN1501850A Particle lock joint |
| 06/02/2004 | CN1501765A Plane mounting circuit module |
| 06/02/2004 | CN1501490A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 06/02/2004 | CN1501485A 电子器件 Electronic devices |
| 06/02/2004 | CN1501481A Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 06/02/2004 | CN1501436A Method for forming film pattern, apparatus for manufacturing thin film, conductive film wiring |
| 06/02/2004 | CN1501176A Combined wet etching method for stacked films and wet etching system used for same |
| 06/02/2004 | CN1501171A 曝光装置 Exposure device |
| 06/02/2004 | CN1500912A Improved cleaning c omposition |
| 06/02/2004 | CN1152427C Packaged IC substrate and making method |
| 06/02/2004 | CN1152383C Reel for winding photosensitive film |
| 06/02/2004 | CN1152232C Method and apparatus for measuring position error using index mark, and machining apparatus that corrects error based on measured result |
| 06/01/2004 | US6744691 Semiconductor memory module |
| 06/01/2004 | US6744656 Semiconductor device and process for manufacturing the same |
| 06/01/2004 | US6744638 Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same |
| 06/01/2004 | US6744636 High-G mounting arrangement for electronic chip carrier |
| 06/01/2004 | US6744635 Removable visual indication structure for a printed circuit board |
| 06/01/2004 | US6744135 Electronic apparatus |
| 06/01/2004 | US6744134 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
| 06/01/2004 | US6744130 Isolated stripline structure |