| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/10/2004 | US20040108587 High density chip carrier with integrated passive devices |
| 06/10/2004 | US20040108368 Solder past printing apparatus and printing method |
| 06/10/2004 | US20040108367 Structure and method for lead free solder electronic package interconnections |
| 06/10/2004 | US20040108363 Method of fabricating an electronic module comprising an active component on a base |
| 06/10/2004 | US20040108216 Method and apparatus for making very low roughness copper foil |
| 06/10/2004 | US20040108211 Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB) |
| 06/10/2004 | US20040108137 Cross connect via for multilayer printed circuit boards |
| 06/10/2004 | US20040108135 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| 06/10/2004 | US20040108134 Printed wiring boards having low inductance embedded capacitors and methods of making same |
| 06/10/2004 | US20040108133 Electrolytic cell; contacting electrode with projections; mixture of electroconductive filler and polymer |
| 06/10/2004 | US20040108132 Interconnection structure of electric conductive wirings |
| 06/10/2004 | US20040108131 Circuit board and method for making same |
| 06/10/2004 | US20040108130 Mounting structure for electronic component |
| 06/10/2004 | US20040107902 Stencil/screen print apparatus |
| 06/10/2004 | US20040107570 Singulation methods and substrates for use with same |
| 06/10/2004 | US20040107569 Metal core substrate packaging |
| 06/10/2004 | US20040107555 Method for making monolithic ceramic capacitor |
| 06/10/2004 | CA2507471A1 Photosensitive resin composition comprising a halogen-free colorant |
| 06/09/2004 | EP1427267A1 Multi-milling method for the production of printed circuits and the printed circuits thus obtained |
| 06/09/2004 | EP1427266A1 Method for forming image on object surface including circuit substrate |
| 06/09/2004 | EP1427073A1 Solder reserve transfer device and process |
| 06/09/2004 | EP1427061A2 Differential signal electrical connectors |
| 06/09/2004 | EP1427055A1 Low cost antennas using conductive plastics or conductive composites |
| 06/09/2004 | EP1427051A1 High-frequency module substrate device |
| 06/09/2004 | EP1427013A2 Control device, particularly for use in automotive engineering |
| 06/09/2004 | EP1427008A1 Process of manufacturing an electronic module comprising an active component on a substrate |
| 06/09/2004 | EP1427006A1 Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | EP1426979A1 COATED CONDUCTIVE PARTICLE, COATED CONDUCTIVE PARTICLE MANUFACTURING METHOD, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE |
| 06/09/2004 | EP1426978A1 CONDUCTIVE PASTE AND CONDUCTIVE FILM USING IT, PLATING METHOD AND PRODUCTION METHOD FOR FINE METAL COMPONENT |
| 06/09/2004 | EP1426469A1 Method for electrolytic copper plating |
| 06/09/2004 | EP1426464A1 Method for producing metal/ceramic bonding substrate |
| 06/09/2004 | EP1426189A2 Laser thermal transfer donor including a separate dopant layer |
| 06/09/2004 | EP1425949A2 Printed circuit board |
| 06/09/2004 | EP1425948A2 A method of etching copper on cards |
| 06/09/2004 | EP1425947A1 Method for laser beam drilling with a perforated mask |
| 06/09/2004 | EP1425946A1 An electronic assembly and a method of constructing an electronic assembly |
| 06/09/2004 | EP1425945A1 Pin-free socket compatible with optical-electrical interconnects |
| 06/09/2004 | EP1425824A1 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards |
| 06/09/2004 | EP1425792A2 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 06/09/2004 | EP1425767A1 Micro-replicated miniaturised electric components |
| 06/09/2004 | EP1425759A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 06/09/2004 | EP1425358A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 06/09/2004 | EP1425174A2 Inkjet deposition apparatus and method |
| 06/09/2004 | EP1425167A2 Method for producing a ceramic substrate and ceramic substrate |
| 06/09/2004 | EP1293009A4 Multi-layer microwave circuits and methods of manufacture |
| 06/09/2004 | EP1125483B1 Case for circuit board for horizontal or vertical mounting |
| 06/09/2004 | EP1070159A4 Electrodeposition of metals in small recesses using modulated electric fields |
| 06/09/2004 | EP1000429B1 A protective containment apparatus for potted electronic circuits |
| 06/09/2004 | DE20280417U1 Element zum elektromagnetischen Abschirmen Element for electromagnetic shielding |
| 06/09/2004 | DE10254662A1 Assembly support for light emitting diodes, e.g. for outer and inner illumination of vehicles comprises connection pins, a flexible circuit board, and a rigid support joined by its main surfaces to the flexible circuit board |
| 06/09/2004 | DE10254029A1 Verfahren zur Herstellung eines partiell metallisierten Folienelements A process for preparing a partially metallized film element |
| 06/09/2004 | DE10252584A1 Electrical and/or electronic circuit with overvoltage protection provided by arc path between points of conductor ring between coupling element terminal pin and conductor path structure |
| 06/09/2004 | CN2620460Y High-heat radiation hole metallized printed circuitboard of Al or Mg or its alloy base |
| 06/09/2004 | CN1504070A Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| 06/09/2004 | CN1504068A Inteconnect |
| 06/09/2004 | CN1504066A Method for forming printed circuit board and printed circuit board formed thereby |
| 06/09/2004 | CN1503927A Resin composition, process for producing resin composition, and method of forming resin film |
| 06/09/2004 | CN1503831A A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 06/09/2004 | CN1503769A Multilayer foil capable of independent reaction |
| 06/09/2004 | CN1503729A Wet etchable laminated body insulation film, and electronic circuit part using the laminated body and the film |
| 06/09/2004 | CN1503616A Multilayer ceramic substrate and mfg method thereof |
| 06/09/2004 | CN1503408A High density connector system |
| 06/09/2004 | CN1503359A Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | CN1503354A Ceramic multi-layer substrate and mfg method thereof |
| 06/09/2004 | CN1503338A Multi-layer distribution board and mfg method, electronic device and electronic apparatus |
| 06/09/2004 | CN1503284A Method for forming film capacitor with less leakage current and high insulation voltage-resistance |
| 06/09/2004 | CN1503277A Formation of thin film resistors |
| 06/09/2004 | CN1503276A Formation of thin film resistors |
| 06/09/2004 | CN1502970A Characteristic value calculation for welding detection |
| 06/09/2004 | CN1502555A Method for forming pattern film of surface modified carbon nano tube |
| 06/09/2004 | CN1502414A Microdrop sprayer, microdrop spraying method and photoelectronic equipment |
| 06/09/2004 | CN1153284C Substrate provided with spherical grate array type circuit portion, and installation method therefor |
| 06/09/2004 | CN1153268C Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 06/09/2004 | CN1153266C Method for forminog bump and semiconductor device |
| 06/09/2004 | CN1153240C Production processes of printed substrate, electron-emitting element, electron source and image-forming apparatus |
| 06/08/2004 | US6748289 Method for controlling screen printer |
| 06/08/2004 | US6747875 Surface mount power supplies for standard assembly process |
| 06/08/2004 | US6747862 System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
| 06/08/2004 | US6747472 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same |
| 06/08/2004 | US6747450 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same |
| 06/08/2004 | US6747392 Chip electronic components and mounting structure for the same |
| 06/08/2004 | US6747362 Perimeter matrix ball grid array circuit package with a populated center |
| 06/08/2004 | US6747356 Multilayer circuit board; reducing the variation in the characteristic impedance of the wirings with high accuracy. |
| 06/08/2004 | US6747259 Assembly of imaging arrays for large format documents |
| 06/08/2004 | US6747217 Alternative to through-hole-plating in a printed circuit board |
| 06/08/2004 | US6747216 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 06/08/2004 | US6747215 Fat conductor |
| 06/08/2004 | US6746946 Process and apparatus for manufacturing printed circuit boards |
| 06/08/2004 | US6746899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 06/08/2004 | US6746897 Fabrication process of semiconductor package and semiconductor package |
| 06/08/2004 | US6746816 Photosensitive resin composition and circuit board |
| 06/08/2004 | US6746727 Metal to ILD adhesion improvement by reactive sputtering |
| 06/08/2004 | US6746710 Screen printing |
| 06/08/2004 | US6746639 Process for preparing polyimide film |
| 06/08/2004 | US6746621 Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board |
| 06/08/2004 | US6746547 Methods and compositions for oxide production on copper |
| 06/08/2004 | US6746270 Spring-loaded heat sink assembly for a circuit assembly |
| 06/08/2004 | US6746261 Pressure application device for retaining at least two electronic components disposed opposite each other on each side of a connection board |
| 06/08/2004 | US6745930 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 06/08/2004 | US6745464 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board |