| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/16/2004 | CN1505461A A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| 06/16/2004 | CN1505460A Electronic circuit installation wiring substrate manufacturing method based on lead-free soldering tin |
| 06/16/2004 | CN1505459A Circuit apparatus |
| 06/16/2004 | CN1505458A Wiring base material, electrical equipment and switching device possessing the same |
| 06/16/2004 | CN1505457A Printed circuit board fabrication-related device |
| 06/16/2004 | CN1505456A A printed circuit board and processing method thereof |
| 06/16/2004 | CN1505455A Interconnection structure of electric conductive wirings |
| 06/16/2004 | CN1505147A Electronic parts packaging structure and method of manufacturing the same |
| 06/16/2004 | CN1505137A Semiconductor device |
| 06/16/2004 | CN1505135A Laminated electronic component |
| 06/16/2004 | CN1505124A Method for manufacturing circuit device |
| 06/16/2004 | CN1504592A Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste |
| 06/16/2004 | CN1154403C Printed wiring board, method of producing the same and electronic equipment |
| 06/16/2004 | CN1154230C Surface sound wave device |
| 06/16/2004 | CN1154186C Metallization in semiconductor devices |
| 06/16/2004 | CN1154185C Miltilayer wiring structure and producing method thereof |
| 06/16/2004 | CN1154159C Process for ashing organic materials from substrates |
| 06/16/2004 | CN1154130C Ceramic electronic assembly and production method thereof |
| 06/16/2004 | CN1154122C 可变电阻器 Variable resistor |
| 06/16/2004 | CN1153855C Method and device for regulating concentration of substaces in electrolytes |
| 06/16/2004 | CN1153649C Soldering agent composition used for soldering paste |
| 06/16/2004 | CN1153647C Solder powder and method for preparing same |
| 06/16/2004 | CN1153646C Laser processing device and method |
| 06/15/2004 | US6751361 Method and apparatus for performing fixturing in a machine vision system |
| 06/15/2004 | US6751103 Having at least three arms, with free ends adapted to couple with electronic device and intersecting ends joined together at intersecting point, means for biasing intersection towards device; free ends are spaced apart to receive battery |
| 06/15/2004 | US6751101 Electronic component and method of producing the same |
| 06/15/2004 | US6750899 Solder paste inspection system |
| 06/15/2004 | US6750894 Method of forming image on support |
| 06/15/2004 | US6750732 Circuit board with EMI suppression |
| 06/15/2004 | US6750669 Method for constructing a flex-rigid laminate probe |
| 06/15/2004 | US6750549 Variable pad diameter on the land side for improving the co-planarity of ball grid array packages |
| 06/15/2004 | US6750537 Substrate structure |
| 06/15/2004 | US6750534 Heat spreader hole pin 1 identifier |
| 06/15/2004 | US6750475 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 06/15/2004 | US6750431 Electric component removing device |
| 06/15/2004 | US6750422 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 06/15/2004 | US6750405 Two signal one power plane circuit board |
| 06/15/2004 | US6750404 High density printed wiring board having in-via surface mounting, pads |
| 06/15/2004 | US6750403 Reconfigurable multilayer printed circuit board |
| 06/15/2004 | US6750396 I-channel surface-mount connector |
| 06/15/2004 | US6750148 Method of manufacturing wireless suspension blank |
| 06/15/2004 | US6750136 Contact structure production method |
| 06/15/2004 | US6750134 Variable cross-section plated mushroom with stud for bumping |
| 06/15/2004 | US6750132 Flip chip package, circuit board thereof and packaging method thereof |
| 06/15/2004 | US6750084 Method of mounting a leadless package and structure therefor |
| 06/15/2004 | US6750081 Header for electronic components board in surface mount and through-hole assembly |
| 06/15/2004 | US6749994 Water-soluble cellulose derivative, a photopolymerizable monomer, an acrylic resin having a hydroxyl group, a photoinitiator, and an inorganic powder; high sensitivity for precise patterning even when a thick film |
| 06/15/2004 | US6749928 Producing time is shortened, and crack or warp are hard to occur, reduction of cost can be attained |
| 06/15/2004 | US6749927 Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
| 06/15/2004 | US6749899 Method for producing prepreg, prepreg, metal clad laminate and printed wiring board |
| 06/15/2004 | US6749889 Method for producing mounting structure for an electronic component |
| 06/15/2004 | US6749775 Conductive via composition |
| 06/15/2004 | US6749774 Conductive adhesive and connection structure using the same |
| 06/15/2004 | US6749765 Aperture fill |
| 06/15/2004 | US6749738 Electrochemical method for forming an inorganic covering layer on a surface of a copper material |
| 06/15/2004 | US6749737 Method of fabricating inter-layer solid conductive rods |
| 06/15/2004 | US6749655 Reflow apparatus for solder joining electronic components to circuit boards |
| 06/15/2004 | US6749445 Electrical connector with spacer |
| 06/15/2004 | US6749439 Circuit board riser |
| 06/15/2004 | US6749157 Snap structure |
| 06/15/2004 | US6749058 Conveyor and fixing unit for substrates |
| 06/15/2004 | US6748652 Circuit board and method of manufacturing the same |
| 06/15/2004 | US6748651 Method of manufacturing a bus-bar wiring board to reduce the amount of waste |
| 06/15/2004 | US6748650 Preserves the planarity of a substrate |
| 06/15/2004 | US6748645 Aligned modular printed circuit film elements |
| 06/10/2004 | WO2004049772A1 Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 06/10/2004 | WO2004049771A1 Method for producing conductive structures on a support |
| 06/10/2004 | WO2004049437A1 Crack resistant interconnect module |
| 06/10/2004 | WO2004049401A2 Laser trimming of resistors |
| 06/10/2004 | WO2004049356A1 Ceramic package and chip resistor, and method for manufacture thereof |
| 06/10/2004 | WO2004049070A2 Photosensitive resin composition comprising a halogen-free colorant |
| 06/10/2004 | WO2004049065A2 Curable covercoat compositions, cured products obtained therefrom, and methods of manufacture thereof |
| 06/10/2004 | WO2004048640A1 Process for improving the adhesion of polymeric materials to metal surfaces |
| 06/10/2004 | WO2004048434A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 06/10/2004 | WO2004048082A1 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 06/10/2004 | WO2004029994A3 Multilayer substrate |
| 06/10/2004 | WO2004012300A3 Anisotropic conductive compound |
| 06/10/2004 | WO2003097357A3 Device and method for positioning a substrate to be printed |
| 06/10/2004 | WO2003085697A3 Solder-bearing articles and method of retaining a solder mass thereon |
| 06/10/2004 | WO2003063562A3 A method of applying an edge electrode pattern to a touch screen |
| 06/10/2004 | WO2002068245A8 Method for producing a moulded component comprising an integrated conductor strip and moulded component |
| 06/10/2004 | US20040110401 Conductive elastomeric contact system with anti-overstress columns |
| 06/10/2004 | US20040110398 Electrical connector with spacer |
| 06/10/2004 | US20040110382 Conductive core substrate fabrication |
| 06/10/2004 | US20040110366 Forming solder balls on substrates |
| 06/10/2004 | US20040110321 Method of forming thick-film wiring and method of producing laminated electronic component |
| 06/10/2004 | US20040110319 Fabrication process of semiconductor package and semiconductor package |
| 06/10/2004 | US20040110024 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC). |
| 06/10/2004 | US20040110015 Copper-clad laminate |
| 06/10/2004 | US20040109995 Accuracy connectors; surface treated metal particles as core overcoated with polymer |
| 06/10/2004 | US20040109974 Attaching components to a printed circuit card |
| 06/10/2004 | US20040109627 Multi-layer PCB and method for coupling block type multichannel optical signals |
| 06/10/2004 | US20040109602 Method and apparatus for inspecting a bump electrode |
| 06/10/2004 | US20040109300 Expansion board apparatus and removing method |
| 06/10/2004 | US20040109298 Dielectric material including particulate filler |
| 06/10/2004 | US20040108937 Ball grid array resistor network |
| 06/10/2004 | US20040108862 Printed wiring board, multilayer printed wiring board, and method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| 06/10/2004 | US20040108629 Method for fabricating ceramic substrate |
| 06/10/2004 | US20040108591 Enhanced connectivity for electronic substrates, modules and systems using a novel edge flower terminal array |
| 06/10/2004 | US20040108590 Carrier-based electronic module |